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특허 상세정보

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내보내기 페이스북 공유 카카오톡 공유

Thin film metallization process for improved metal to substrate adhesion

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-023/48    H01L-029/40   
미국특허분류(USC) 257/690 ; 257/758 ; 257/759 ; 257/753
출원번호 US-0444667 (1995-05-19)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 19  인용 특허 : 18
초록
▼

A metallization layer is formed on a substrate with improved adhesion thereto by performing the deposition at an elevated temperature which favors the formation of chemical bonds of the metal to the substrate as well as clusters of metal embedded within the substrate and contiguous with the metallization layer. In polymer substrates the chemical bond is made to carbonyl functional groups such as ketones or aldehydes. The adhesion is enhanced by the removal of moisture from the surface of the substrate at the elevated temperatures employed. A high degree ...

대표
청구항

An electronic circuit module including a metallization layer formed on an exterior surface of said electronic circuit module, said metallization layer of metal containing a mixture of chromium and copper in a ratio in a range of 0.3:1 to 3.0:1 including clusters of said metal embedded within said electronic circuit module adjacent said exterior surface.

이 특허에 인용된 특허 (18)

  1. Wade Robert J. (Louisville KY). Directly solderable three-dimensional electrically conductive circuit components and process for the preparation thereof. USP1989054826720.
  2. Ho Paul S. C. (Chappaqua NY) Hahn Peter O. (Burghausen NY DEX) Lefakis Harry (Shrub Oak NY) Rubloff Gary W. (Katonah NY). Enhanced adhesion between metals and polymers. USP1988014720401.
  3. Braun Robert E. (Norristown PA). Hermetic integrated circuit package for high density high power applications. USP1982074338621.
  4. Nakayama Masatoshi (Saku JPX) Morita Haruyuki (Saku JPX) Kubota Yuichi (Komoro JPX) Tsuchiya Keiko (Saku JPX). Magnetic recording medium. USP1986034575475.
  5. Nakayama Masatoshi (Tokyo JPX) Morita Haruyuki (Tokyo JPX) Kubota Yuichi (Tokyo JPX) Tsuchiya Keiko (Tokyo JPX). Magnetic recording medium. USP1989034816341.
  6. Mahulikar Deepak (Meriden CT). Metal pin grid array package. USP1992045103292.
  7. Clabes Joachim G. (Yorktown Heights NY) Hahn Peter O. (Burghausen NY DEX) Ho Paul S. (Chappaqua NY) Lefakis Haralambos (San Jose CA) Rubloff Gary W. (Katonah NY). Metal-polymer adhesion by low energy bombardment. USP1989124886681.
  8. Chou Ned J. (Yorktown Heights NY) Goldblatt Ronald D. (Rye Brook NY) Heidenreich ; III John E. (Yorktown Heights NY) Molis Steven E. (Yorktown Heights NY) Ferreiro ; deceased Luis M. (late of Bardoni. Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment. USP1991055019210.
  9. Polak, Anthony J.. Method for increasing the peel strength of metal-clad polymers. USP1983054382101.
  10. Geldermans Pieter (Poughkeepsie NY) Mathad Gangadhara S. (Poughkeepsie NY). Method of fabricating a chip interposer. USP1986104617730.
  11. Ueno Susumu (1 ; Oaza Touwada ; Kamisu-cho Kashima-gun ; Ibaraki-ken JPX) Kitamura Hajime (6-14-2 ; Aobadai Ichihara-shi ; Chiba-ken JPX) Inoue Kaname (5-18-10-404 ; Arima Miyamae-ku ; Kawasaki-shi ;. Method of making a flexible base plate for printed circuit board. USP1988084765860.
  12. Redmond ; John Peter ; Shirk ; Albert ; Bottiglier ; Elmer John ; Zimme rman ; Richard Henry. Method of making sensitized polyimide polymers, having catalyst and electroless metal, metal deposits thereon and circu. USP1978034078096.
  13. Shanefield Daniel J. (Princeton Township ; Mercer County NJ) Verdi Fred W. (Lawrence Township ; Mercer County NJ). Method of providing an adherent metal coating on an epoxy surface. USP1986044582564.
  14. Narken Bernt (Poughkeepsie NY) Tummala Rao R. (Wappingers Falls NY). Multilayered glass-ceramic substrate for mounting of semiconductor device. USP1980094221047.
  15. Somasiri Nanayakkara L. D. (St. Paul MN) Speckhard Thomas A. (St. Paul MN). Polyimide substrate having a textured surface and metallizing such a substrate. USP1990124975327.
  16. Nair Krishna K. (Binghamton NY) Snyder Keith A. (Vestal NY). Process for making multilayer integrated circuit substrate. USP1983054386116.
  17. Kurihara Keisuke (Yokohama JPX). Production method for solder coated conductor wiring. USP1982094351704.
  18. Mori, Seiichi. Semiconductor device having an improved bonding pad. USP1991075036383.

이 특허를 인용한 특허 피인용횟수: 19

  1. Cowens,Marvin W.; Murtuza,Masood; Yamunan,Vinu; Odegard,Charles; Coffman,Phillip R.. Adhesion by plasma conditioning of semiconductor chip. USP2008017319275.
  2. Cowens,Marvin W.; Murtuza,Masood; Yamunan,Vinu; Odegard,Charles; Coffman,Phillip R.. Adhesion by plasma conditioning of semiconductor chip. USP2008117445960.
  3. Cowens, Marvin W.; Murtuza, Masood; Yamunan, Vinu; Odegard, Charles; Coffman, Phillip R.. Adhesion by plasma conditioning of semiconductor chip surfaces. USP2005036869831.
  4. Cowens,Marvin W.; Murtuza,Masood; Yamunan,Vinu; Odegard,Charles; Coffman,Phillip R.. Adhesion by plasma conditioning of semiconductor chip surfaces. USP2007097271494.
  5. Cowens,Marvin W.; Murtuza,Masood; Yamunan,Vinu; Odegard,Charles; Coffman,Phillip R.. Adhesion by plasma conditioning of semiconductor chip surfaces. USP2007107276401.
  6. Cloutier, Joshua R.; Mizumura, Takeshi; Chang, Keunsuk P.. Biaxially oriented polylactic acid film with high barrier. USP2016049314999.
  7. Dou, Shichen; Lee, Mark S.; Chang, Keunsuk P.. Biaxially oriented polylactic acid film with improved heat seal properties. USP2015109150004.
  8. Dou, Shichen; Lee, Mark S.; Paulino, Claudio M.; Yokota, Nao; Chang, Keunsuk P.. Biaxially oriented polylactic acid film with reduced noise level. USP2016019238324.
  9. Dou, Shichen; Lee, Mark S.; Paulino, Claudio M.; Yokota, Nao; Chang, Keunsuk P.. Biaxially oriented polylactic acid film with reduced noise level and improved moisture barrier. USP2016119492962.
  10. Golecki Ilan ; Eagan Margaret. Controlled-stress stable metallization for electronic and electromechanical devices. USP2001096291345.
  11. Marlon E. Menezes ; Howard K. Birnbaum ; Ian M. Robertson. Embedded cluster metal-polymeric micro interface and process for producing the same. USP2002016342307.
  12. Detzel, Thomas; Gross, Johann; Illing, Robert; Krug, Maximilian; Lanzerstorfer, Sven Gustav; Nelhiebel, Michael; Robl, Werner; Rogalli, Michael; Woehlert, Stefan. Integrated circuit and method of forming an integrated circuit. USP2016089418937.
  13. Chen Sheng-Hsiung,TWX. Method of improving copper pad adhesion. USP2001026191023.
  14. Chen,Sheng Hsiung. Method of improving copper pad adhesion. USP2006047026721.
  15. Sheng-Hsiung Chen TW; Fan Keng Yang TW. Method of improving pad metal adhesion. USP2002026350667.
  16. Dou, Shichen; Paolilli, Tracy A.; Fitch, John J.; Brandmeier, Michael F.; Chang, Keunsuk P.. Multi-layer high moisture barrier polylactic acid film. USP2015129221213.
  17. Paolilli, Tracy A.; Fitch, John J.. Multi-layer high moisture barrier polylactic acid film. USP2014088795803.
  18. Paolilli, Tracy A.; Fitch, John J.. Multi-layer high moisture barrier polylactic acid film. USP2014058734933.
  19. Paolilli, Tracy A.; Fitch, John J.. Multi-layer high moisture barrier polylactic acid film. USP2015059023443.

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