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Vertical right angle solderless interconnects from suspended stripline to three-wire lines on MIC substrates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01P-005/08
출원번호 US-0576997 (1995-12-26)
발명자 / 주소
  • Quan Clifton (Arcadia CA)
출원인 / 주소
  • Hughes Electronics (Los Angeles CA 02)
인용정보 피인용 횟수 : 64  인용 특허 : 3

초록

An interconnection apparatus for providing solderless, three dimensional microwave interconnection from a planar suspended substrate stripline network to MIC modules using three wire transmission line input/output ports. The apparatus includes in sequence a coaxial line transition which is coupled t

대표청구항

A microwave interconnection apparatus for providing RF interconnection between a suspended stripline transmission line and a three wire transmission line, comprising: a coaxial line transition coupled to the suspended stripline transmission line, said coaxial line transition including a coaxial cent

이 특허에 인용된 특허 (3)

  1. Buchanan W. A. (E. Hampstead NH) Heiter G. L. (Andover MA), Coaxial transmission line to strip line coupler.
  2. Quan Clifton (Arcadia CA), Coaxial-to-microstrip orthogonal launchers having troughline convertors.
  3. Gawronski Michael J. (Minneapolis MN) Palmquist Steven L. (Minnetonka MN) Lamberg John R. (Minnetonka MN) Hart Rebecca A. (Plymouth MN), Millimeter wave microstrip to coaxial line side-launch transition.

이 특허를 인용한 특허 (64)

  1. Sherrer, David W.; Rollin, Jean-Marc, Batch fabricated microconnectors.
  2. Sherrer, David W.; Rollin, Jean-Marc, Batch fabricated microconnectors.
  3. Winslow David T. ; Quan Clifton ; Romero Hernan E. ; Howard Claudio S. ; Robertson Edward L., Blind mate non-crimp pin RF connector.
  4. Cites, Jeffrey S.; Garner, Sean M.; Henning, L. Christopher; Wen, Fang, Broadband uniplanar coplanar transition.
  5. Sherrer, David W.; Rollin, Jean-Marc, Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector.
  6. Sherrer, David, Coaxial transmission line microstructure with a portion of increased transverse dimension and method of formation thereof.
  7. Sherrer, David W.; Fisher, John J., Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section.
  8. Sherrer, David W.; Fisher, John J., Coaxial waveguide microstructures having an active device and methods of formation thereof.
  9. Sherrer, David W.; Fisher, John J., Coaxial waveguide microstructures having conductors formed by plural conductive layers.
  10. Nguyen Dung T. ; Howard Claudio S. ; Quan Clifton, Control impedance RF pin for extending compressible button interconnect contact distance.
  11. Sherrer, David W.; Reid, James R., Devices and methods for solder flow control in three-dimensional microstructures.
  12. Sherrer, David W.; Reid, Jr., James R., Devices and methods for solder flow control in three-dimensional microstructures.
  13. Margomenos, Alexandros, Dual-band antenna array and RF front-end for MM-wave imager and radar.
  14. Margomenos, Alexandros, Dual-band antenna array and RF front-end for automotive radars.
  15. Margomenos, Alexandros, Dual-band antenna array and RF front-end for mm-wave imager and radar.
  16. Margomenos, Alexandros, Dual-band antenna array and RF front-end for mm-wave imager and radar.
  17. Tanbakuchi,Hassan; Richter,Matthew R.; Whitener,Michael B.; Wong,Bobby Y.; Clatterbaugh,Jim, Electrical interconnection for coaxial line to slab line structure including a bead ring.
  18. Benham,John E.; Padro,Kenny; Godburn, Jr.,Robert D., High speed electrical connector.
  19. Driscoll, Michael P.; Vetter, Stephen; Bradley, Robert M., High speed, high density interconnect system for differential and single-ended transmission applications.
  20. Driscoll,Michael P.; Vetter,Stephen; Bradley,Robert M., High speed, high density interconnect system for differential and single-ended transmission systems.
  21. Benham, John E.; Padro, Kenny; Godburn, Jr., Robert D., High-speed electrical connector.
  22. Rollin, Jean-Marc; Sherrer, David W., Integrated electronic components and methods of formation thereof.
  23. Rollin, Jean-Marc; Sherrer, David W., Integrated electronic components and methods of formation thereof.
  24. Driscoll, Michael P.; Vetter, Stephen; Bradley, Robert M.; Wolfel, Lee A.; Beadle, Robert O., Interconnection system.
  25. Driscoll,Michael P.; Vetter,Stephen; Bradley,Robert M.; Wolfel,Lee A.; Beadle,Robert O., Interconnection system.
  26. Timothy E. Dearden ; Jeffrey J. Stitt ; Clifton Quan, Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards.
  27. Caplan,William L.; Hodgman,Nicholas S.; Chamberlain,Thomas B.; Morningstar,Michael S., Method and apparatus for microwave interconnection.
  28. Logothetis, James J., Method of manufacturing multilayer microwave couplers using vertically-connected transmission line structures.
  29. Sherrer, David W.; Cardwell, Dara L., Methods of fabricating electronic and mechanical structures.
  30. Rollin, Jean-Marc; Reid, J. Robert; Sherrer, David; Stacy, Will; Vanhille, Ken; Oliver, J. Marcus; Smith, Tim, Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other.
  31. Pergande, Albert, Millimeterwave module compact interconnect.
  32. Reid, James Robert, Multi-layer digital elliptic filter and method.
  33. Reid, James Robert, Multi-layer digital elliptic filter and method.
  34. Quan, Clifton; Kim, Hee Kyung; Yang, Fangchou; Rolston, Kevin C.; Jackson, Edward Marsh, Multi-layer microwave corrugated printed circuit board and method.
  35. Parker, Ernest Clyde; Lauriello, Philip Joseph, Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module.
  36. Pos, Marc M.; Holt, Keone J., Multiple radio frequency (RF) systems using a common radio frequency port without an RF switch.
  37. Winslow, David T.; Tallman, Colleen; Keesey, Timothy; Treinen, James P.; Crockett, John A., Offset connector with compressible conductor.
  38. Drapeau David J. ; Moye Christopher A., Planar interconnects using compressible wire bundle contacts.
  39. Viscarra, Alberto F.; Winslow, David T.; Ables, Billy D.; Ketola, Kurt S.; Krause, Kurt J.; Rolston, Kevin C.; Sauer, Rohn; Chow, James R., Process for fabricating a three dimensional molded feed structure.
  40. Viscarra, Alberto F.; Heinrich, Ethan S.; Campbell, Melvin S.; Winslow, David T.; Rolston, Kevin C.; Vidaurri, Rosalio S., Process for fabricating an origami formed antenna radiating structure.
  41. Viscarra, Alberto F.; Heinrich, Ethan S.; Campbell, Melvin S.; Winslow, David T.; Rolston, Kevin C.; Vidaurri, Rosalio S., Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle.
  42. Sciarretta William A. ; Setzco Paul ; Arangio James D., RF connector having a compliant contact.
  43. Allison, Robert C.; Rowland, Jerold K.; Sharpe, Thomas M., RF filtered DC interconnect.
  44. Quan, Clifton; Yang, Fangchou; Kim, Hee Kyung; Viscarra, Alberto F., RF transition with 3-dimensional molded RF structure.
  45. Rollin, Jean-Marc; Reid, J. Robert; Sherrer, David; Stacy, Will; Vanhille, Ken; Oliver, J. Marcus; Smith, Tim, Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
  46. Hovey, Ian; Reid, J. Robert; Sherrer, David; Stacy, Will; Vanhille, Ken, Substrate-free interconnected electronic mechanical structural systems.
  47. Hovey, Ian; Reid, J. Robert; Sherrer, David; Stacy, Will; Vanhille, Ken, Substrate-free interconnected electronic mechanical structural systems.
  48. Hovey, Ian; Reid, J. Robert; Sherrer, David; Stacy, Will; Vanhille, Ken, Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration.
  49. Margomenos, Alexandros; Rida, Amin, System and method for improving performance of coplanar waveguide bends at mm-wave frequencies.
  50. Kim, Hee Kyung; Yang, Fangchou; Viscarra, Alberto F.; Quan, Clifton; Pruden, Derek, Systems and methods for assembling lightweight RF antenna structures.
  51. Vanhille, Kenneth; Sherrer, David, Thermal management.
  52. Howard Claudio S. ; Quan Clifton ; Winslow David T. ; Matterer Veronica P., Threaded double sided compressed wire bundle connector.
  53. Margomenos, Alexandros; Yönak, Serdar Hakki, Three dimensional integrated automotive radars and methods of manufacturing the same.
  54. Rida, Amin; Yang, Li; Margomenos, Alexandros; Tentzeris, Manos, Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications.
  55. Fonataine, Daniel L.; Sherrer, David, Three-dimensional matrix structure for defining a coaxial transmission line channel.
  56. Houck, William D.; Sherrer, David W., Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume.
  57. Houck, William D.; Sherrer, David W., Three-dimensional microstructures having a re-entrant shape aperture and methods of formation.
  58. Parker, Ernest; Wang, Fan; White, James William; Pierce, Michael Robert; Stephenson, Randall; Wiley, David L., Transformer-based power converters with 3D printed microchannel heat sink.
  59. Sherrer, David, Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof.
  60. Swarup, Arvind; Davitt, David, Transmission line circuit assemblies and processes for fabrication.
  61. Okamoto,Douglas Seiji; Sweeney,Anthony C.; Gaudette,Thomas M., Transmission line orientation transition.
  62. Timothy D. Keesey ; Clifton Quan ; Douglas A. Hubbard ; David E. Roberts ; Chris E. Schutzenberger ; Raymond C. Tugwell ; Gerald A. Cox ; Stephen R. Kerner, Vertical interconnect between coaxial and rectangular coaxial transmission line via compressible center conductors.
  63. Timothy D. Keesey ; Clifton Quan ; Douglas A. Hubbard ; David E. Roberts ; Chris E. Schutzenberger ; Raymond C. Tugwell ; Gerald A. Cox, Vertical interconnect between coaxial or GCPW circuits and airline via compressible center conductors.
  64. Vanhille, Kenneth; Sherrer, David, Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels.
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