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Mold runner removal from a substrate-based packaged electronic device

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/28
출원번호 US-0214339 (1994-03-16)
발명자 / 주소
  • Freyman Bruce J. (Tempe AZ) Briar John (Phoenix AZ) Heo Young W. (Seongnam KRX) Shim Il K. (Seoul KRX)
출원인 / 주소
  • Amkor Electronics, Inc. (Chandler AZ 02) Anam Industrial Co., Ltd. (Seoul KRX 03)
인용정보 피인용 횟수 : 65  인용 특허 : 0

초록

According to the invention, an electronic device mounted on a substrate is encapsulated using a standard two-piece mold. A novel degating region is formed on a surface of the substrate to allow removal of excess encapsulant formed on the surface during molding without damaging the remainder of the d

대표청구항

A substrate-based packaged electronic device, comprising: a substrate having first and second surfaces; a degating region on the first surface of the substrate; a degating region material on the degating region; a structure for making external electrical connection from the substrate-based packaged

이 특허를 인용한 특허 (65)

  1. Pollack, Michael G.; Pamula, Vamsee K.; Fair, Richard B., Apparatuses and methods for manipulating droplets.
  2. Pollack, Michael G.; Pamula, Vamsee K.; Fair, Richard B., Apparatuses and methods for manipulating droplets.
  3. Pollack, Michael G; Pamula, Vamsee K; Fair, Richard B, Apparatuses and methods for manipulating droplets.
  4. Huang,Chien Ping; Ho,Tzong Da; Yu,Isaac, Ball grid array substrate strip with warpage-preventive linkage structure.
  5. Steven Webster, Bond wire pressure sensor die package.
  6. Wensel, Richard W., Carrier substrate and carrier assembly using residual organic compounds to facilitate gate break.
  7. Chien-Chih, Chen; Lai, Yu-Ting; Lai, Chin-Wen, Chip carrier, semiconductor package and fabricating method thereof.
  8. Usui,Ryosuke; Mizuhara,Hideki; Igarashi,Yusuke; Sakamoto,Noriaki, Circuit device manufacturing method including mounting circuit elements on a conductive foil, forming separation grooves in the foil, and etching the rear of the foil.
  9. Briar, John, Disposable mold runner gate for substrate based electronic packages.
  10. John Briar SG, Disposable mold runner gate for substrate based electronic packages.
  11. Choi,Hee Kook; Yoo,Cheol Joon, Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture.
  12. Huang Chien Ping,TWX ; Yu Kevin,TWX ; Huang Chih Ming,TWX, Encapsulating method of substrate based electronic device.
  13. Fjelstad, Joseph C., Flexible circuit assemblies without solder and methods for their manufacture.
  14. Freyman Bruce J. ; Briar John ; Maxcy Jack C., Grid array assembly of circuit boards with singulation grooves.
  15. Lin, Arthur K.; Anderson, Robert A.; Singh, Kuljeet, Grounding of package substrates.
  16. Manteghi Kamran, High density leaded ball-grid array package.
  17. Sheppard Robert P. ; Combs Edward G., Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package.
  18. Lee, Dal Jae; Cho, Nam Ju; Park, Soo-San; Kim, Jaepil; Hur, Sungpil; Jin, Hyeong Kug; Han, JongMin; Lim, SungJae; Kwon, HyoungChul, Integrated circuit package system with molding vents.
  19. Williams,Vernon M.; Gifford,Michael D., Leadframe and method for reducing mold compound adhesion problems.
  20. Kim, SungJin, Matrix type printed circuit board for semiconductor packages.
  21. Tsai, Ming-Chin, Method and apparatus for determining disposition of via hole on printed circuit board.
  22. Lin Wen-Yen,TWX ; Lee Ting-Chuan,TWX, Method and structure for packaging an integrated circuit with readily removed excess encapsulant on degating region.
  23. Steven Webster, Method for forming a bond wire pressure sensor die package.
  24. Steven Webster, Method for forming a flip chip pressure sensor die package.
  25. Murugan,Selvarajan, Method for integrated circuit packaging.
  26. Huang Chien-Ping,TWX ; Ke Chun-Chi,TWX, Method for making a semiconductor package.
  27. Lin, Arthur K.; Anderson, Robert A.; Singh, Kuljeet, Method of dissipating static electric charge from a chip assembly during a manufacturing operation.
  28. Huang Chien Ping,TWX ; Huang Yang Chun,TWX ; Yu Kevin,TWX ; Chen Sheng-Fang,TWX, Method of encapsulating a chip.
  29. Wensel Richard W., Method of fabricating a semiconductor device utilizing a residual organic compound to facilitate gate break on a carrier substrate.
  30. Huemoeller, Ronald P.; Sheridan, Richard P., Method of making a chip carrier package using laser ablation.
  31. Sheppard Robert P. ; Combs Edward G., Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffener.
  32. Kim Sung Jin,KRX, Method of molding ball grid array semiconductor packages.
  33. John Briar SG; Raymundo M. Camenforte SG, Method of molding flexible circuit with molded stiffener.
  34. Briar, John; Camenforte, Raymundo M., Molded stiffener for flexible circuit molding.
  35. Norman Lee Owens, Multi-strand substrate for ball-grid array assemblies and method.
  36. Owen,Norman Lee, Multi-strand substrate for ball-grid array assemblies and method.
  37. Owens, Norman Lee, Multi-strand substrate for ball-grid array assemblies and method.
  38. Owens,Norman Lee, Multi-strand substrate for ball-grid array assemblies and method.
  39. Wang Wu-Chang,TWX ; Yeh Yung-I,TWX ; Chen Kun-Ching,TWX ; Wu Shyh-Ing,TWX, Packaged semiconductor substrate.
  40. Lin Yung-Sen,TWX, Packaging process and structure of electronic device.
  41. Chiang, Juang-Sheng, Packaging substrate with electrostatic discharge protection.
  42. Heo Young Wook,KRX, Printed circuit board for ball grid array semiconductor package.
  43. Kim Sung Jin,KRX, Printed circuit board for ball grid array semiconductor packages.
  44. Chen Shih-Li,TWX, Process for releasing a runner from an electronic device package on a laminate plate.
  45. Hiroshi Haji JP, Resin mold electric part and producing method therefor.
  46. Murata, Akihiro, Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument.
  47. Chen Kun-Ching,TWX ; Chen Tao-Yu,TWX ; Yeh Yung-I,TWX ; Wang Wu-Chang,TWX ; Lee Chun-Che,TWX ; Huang Chun-Hsiung,TWX ; Wu Shyh-Ing,TWX, Semiconductor packaging device.
  48. Camenforte, Raymundo M.; Briar, John, Single unit automated assembly of flex enhanced ball grid array packages.
  49. Camenforte, Raymundo M.; Briar, John, Single unit automated assembly of flex enhanced ball grid array packages.
  50. Lamourelle Fran.cedilla.ois,FRX, Solder ball array package and a method of encapsulation.
  51. Chang Su Yuan,TWX, Substrate board for semiconductor package.
  52. Lim Hong Woo,KRX, Substrate having gate recesses or slots and molding device and molding method thereof.
  53. Chien-Ping Huang TW; Tzong-Da Ho TW; Chen-Hsu Hsiao TW, Substrate of semiconductor package.
  54. Hsu Kao-Yu,TWX ; Lee Shih Chang,TWX ; Kung Wei-Chun,TWX, Substrate strip for use in packaging semiconductor chips.
  55. Kao-Yu Hsu TW; Shih Chang Lee TW; Wei-Chun Kung TW, Substrate strip for use in packaging semiconductor chips and method for making the substrate strip.
  56. Catoen, Bruce; Gorgenyi, Louis, System for use in performance of injection molding operations.
  57. Wensel Richard W., Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device.
  58. Wensel Richard W., Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device.
  59. Wensel Richard W., Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device.
  60. Wensel, Richard W., Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device.
  61. Richard W. Wensel, Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device.
  62. Wensel Richard W., Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device.
  63. Wensel, Richard W., Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device.
  64. Wensel, Richard W., Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device.
  65. Wensel, Richard W., Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device.
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