[특허]Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages

Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/552 H01L-023/04 H01L-023/043
출원번호	US-0372289 (1995-01-13)
발명자 / 주소	Strobel David J. (Poway CA) Czajkowski David R. (La Jolla CA)
출원인 / 주소	Space Electronics, Inc. (San Diego CA 02)
인용정보	피인용 횟수 : 43 인용 특허 : 0

초록 ▼

The radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose the integrated circuit die within, wherein the lid and the base are each constructed from a high-Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high-Z material disposed between the integrated circuit die and a base, in combination with a high-Z material lid to substantially block incident radiation.

대표청구항 ▼

A radiation shielded integrated circuit device to protect an integrated circuit die having an associated total dose tolerance from damage caused by naturally occurring ionizing radiation in outer space, comprising: a generally flat shielding base member constructed from a high Z material to reduce substantially the amount of ionizing radiation including electron radiation passing therethrough, wherein the integrated circuit die is secured directly to an inner top surface of said flat base member; upstanding shielding sidewalls extending from the peripheral edges of said flat base member and being constructed from a high Z material to reduce substantially the amount of ionizing radiation including electron radiation passing therethrough; means for defining feedthrough openings in said shielding sidewalls; a plurality of leads extending through said openings in said shielding sidewalls to facilitate an electrical connection with the die; wherein the die is received on said top surface in a centrally disposed position thereon and substantially spaced apart from said sidewalls; a plurality of wire bonds connected directly between said leads and the die for facilitating the electrical connection therebetween; and a shielding lid member constructed from said high Z material to reduce substantially the amount of ionizing radiation including electron radiation passing therethrough, said lid member being secured to said sidewalls to enclose substantially the integrated circuit die for reducing the ionizing radiation received at the integrated circuit die to a level less than the total dose tolerance.

이 특허를 인용한 특허 (43)

Patterson, Janet, Apparatus for shielding integrated circuit devices.
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Patterson, Janet, Apparatus for shielding integrated circuit devices.
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Abe, Shuji; Kudo, Katsuya; Isoda, Tsutomu; Oosawa, Masami; Fujihara, Mikine, Cable modem module and transmitter-receiver.
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Kogasaka, Yoshinori; Matsuzaki, Satoru; Sato, Keiichiro; Saito, Shuji, Connection structure for radio frequency circuit that exceeds in RF characteristics.
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Van Antwerp, William P.; Karre, Sheana; Prokop, Adrian; Stinson, Sara Akiko; Fong, Jason; Rosenberg, James J., Device and method for circuit protection during radiation sterilization.
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Alcoe, David James; Coffin, Jeffrey Thomas; Gaynes, Michael Anthony; Hamel, Harvey Charles; Interrante, Mario J.; Peterson, Brenda Lee; Shannon, Megan J.; Sablinski, William Edward; Spring, Christoph, EMI shielding for semiconductor chip carriers.
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Rose, James Wilson; Durocher, Kevin Matthew; Sherman, Donna Marie; Astley, Oliver Richard, Electrical interface for a sensor array.
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Alexandre, Jean-Marc, Electronic system operating under irradiation, process for designing such a system and application thereof to the control of a mobile robot.
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Hillman,Robert, Error detection and correction method and system for memory devices.
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Shah, Tushar T.; Sturcken, Keith K.; Wright, Steven, Insitu radiation protection of integrated circuits.
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Shah, Tushar T.; Sturcken, Keith K.; Wright, Steven, Insitu radiation protection of integrated circuits.
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Tajul, Arosh Baroky; Chua, Janet BeeYin, Light emitting device having a metal can package for improved heat dissipation.
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Tuttle, Mark E.; Deak, James G., Magnetic shield for integrated circuit packaging.
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Longden,Larry L.; Patterson,Janet, Method and apparatus for shielding an integrated circuit from radiation.
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Van Antwerp, William P.; Karre, Sheana; Prokop, Adrian; Stinson, Sara Akiko; Fong, Jason; Rosenberg, James J., Method for circuit protection during radiation sterilization.
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Patterson,Janet, Method for shielding integrated circuit devices.
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Mahadevan,Dave S.; Chapman,Michael E.; Salian,Arvind S., Method of forming a semiconductor package and structure thereof.
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Spielberger, Richard K.; Katti, Romney R., Methods for providing a magnetic shield for an integrated circuit having magnetoresistive memory cells.
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Loeppert Peter V. ; Schafer David E., Miniature silicon condenser microphone.
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Edwards, Carl S.; Featherby, Michael; Strobel, David J., Optimized nuclear radiation shielding within composite structures for combined man made and natural radiation environments.
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Jensen Ronald J. ; Spielberger Richard K. ; Nguyen Toan Dinh ; Jacobsen William F., Radiation enhanced chip encapsulant.
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Joseph Benedetto, Radiation shield and radiation shielded integrated circuit device.
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Benedetto, Joseph M., Radiation shielded carriers for sensitive electronics.
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Kuang, Raymond, Radiation shielding die carrier package.
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Strobel,David J.; Czajkowski,David R., Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages.
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Czajkowski David ; Eggleston Neil ; Patterson Janet, Radiation shielding of three dimensional multi-chip modules.
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Czjakowski, David R.; Eggleston, Neil; Patterson, Janet S., Radiation shielding of three dimensional multi-chip modules.
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Czjakowski, David R.; Eggleston, Neil; Patterson, Janet S., Radiation shielding of three dimensional multi-chip modules.
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Benedetto Joseph M., Raised pedestal radiation shield for sensitive electronics.
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Hillman, Robert A.; Conrad, Mark Steven, Self-correcting computer.
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Hillman,Robert Allen; Conrad,Mark Steven, Self-correcting computer.
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Chou, Ta-Te; Tian, Yong-Qi; Li, Xian, Semiconductor device and method for manufacturing a semiconductor device.
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Chou, Ta-Te; Tian, Yong-Qi; Li, Xian, Semiconductor device and method for manufacturing a semiconductor device.
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Yang,JunYoung; Kim,KiDon; Han,JongHo; Lee,JunHong, Semiconductor device package.
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Hurst Allan T. ; Spielberger Richard K., Shielded package for magnetic devices.
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Spielberger, Richard K.; Katti, Romney R., Shielding arrangement to protect a circuit from stray magnetic fields.
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Spielberger, Richard K.; Katti, Romney R., Shielding arrangement to protect a circuit from stray magnetic fields.
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Spielberger,Richard K.; Katti,Romney R., Shielding arrangement to protect a circuit from stray magnetic fields.
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McCollum,John, Transistor having fully-depleted junctions to reduce capacitance and increase radiation immunity in an integrated circuit.
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Darren Lloyd Stout, Very low magnetic field integrated circuit.
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Wakana, Yoshinori; Kamoshida, Masaru; Igarashi, Takeshi; Kanno, Kiyotaka, Waterproof component-suppressing electronic control device.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages 원문보기

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Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

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이 특허를 인용한 특허 (43)

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