$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Barrier seal for electrostatic chuck 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H02N-013/00
출원번호 US-0439010 (1995-05-11)
발명자 / 주소
  • Salfelder Joseph (Williston VT) Grimard Dennis (Ann Arbor MI) Cameron John F. (Los Altos CA) Deshpandey Chandra (Fremont CA) Ryan Robert (Sunnyvale CA) Chafin Michael G. (Underhill VT)
출원인 / 주소
  • Applied Materials, Inc. (Santa Clara CA 02)
인용정보 피인용 횟수 : 41  인용 특허 : 0

초록

An erosion resistant electrostatic chuck 20 for holding a substrate 45 having a peripheral edge 50, in an erosive environment, comprises an electrostatic member 25 including (i) an electrode 30, and (ii) an insulator 35 covering the electrode. A barrier 55 is circumferentially disposed about the ele

대표청구항

An erosion resistant electrostatic chuck for holding a substrate having a peripheral edge, in an erosive environment, the chuck comprising: (a) an electrostatic member for electrostatically holding the substrate, the electrostatic member comprising (i) an electrode, and (ii) an insulator covering th

이 특허를 인용한 특허 (41)

  1. Larsen, Grant Kenji, Active electrostatic seal and electrostatic vacuum pump.
  2. Pu Bryan ; Shan Hongching ; Ke Kuang-Han ; Welch Michael ; Sherstinsky Semyon ; Mak Alfred ; Chen Ling ; Zhang Sue ; Zuniga Leonel Arturo ; Wilson Samuel C., Apparatus for improving wafer and chuck edge protection.
  3. Luo Jih-Shiuan (Sam), Capacitor coupled chuck for carbon dioxide snow cleaning system.
  4. Muka, Richard; Murphy, Paul; Suuronen, David E., Clamp for use in processing semiconductor workpieces.
  5. Edwin C. Weldon ; Kenneth S. Collins ; Arik Donde ; Brian Lue ; Dan Maydan ; Robert J. Steger ; Timothy Dyer ; Ananda H. Kumar ; Alexander M. Veytser ; Kadthala R. Narendrnath ; Semyon L. K, Dielectric covered electrostatic chuck.
  6. Gaff, Keith William; Busche, Matthew; Ricci, Anthony; Povolny, Henry S.; Stevenot, Scott, Edge seal for lower electrode assembly.
  7. Schaefer, David; Chhatre, Ambarish; Gaff, Keith William; Lee, Sung, Edge seal for lower electrode assembly.
  8. Schaefer, David; Chhatre, Ambarish; Gaff, Keith William; Lee, Sung; Lai, Brooke Mesler, Edge seal for lower electrode assembly.
  9. Ota, Kan; Lee, William Davis, Effective algorithm for warming a twist axis for cold ion implantations.
  10. Lilleland John ; Hubacek Jerome S. ; Kennedy William S., Electrode for plasma processes and method for manufacture and use thereof.
  11. Satou, Tadayuki; Oka, Tadashi; Nakamura, Kyuzo, Electrostatic chuck and vacuum processing apparatus.
  12. Weldon, Edwin C.; Collins, Kenneth S.; Donde, Arik; Lue, Brian; Maydan, Dan; Steger, Robert J.; Dyer, Timothy; Kumar, Ananda H.; Veytser, Alexander M.; Narendrnath, Kadthala R.; Kats, Semyon L.; Khol, Electrostatic chuck having composite dielectric layer and method of manufacture.
  13. Maraschin Robert ; Shufflebotham Paul Kevin ; Barnes Michael Scott, Electrostatic clamp with lip seal for clamping substrates.
  14. Grant Kenji Larsen, Electrostatic wafer clamp having electrostatic seal for retaining gas.
  15. Larsen Grant Kenji, Electrostatic wafer clamp having low particulate contamination of wafers.
  16. Lee, William David; LaFontaine, Marvin Raymond; Purohit, Ashwin Madhukar; Gillespie, Joseph Daniel; Beckel, Donovan; Tao, Teng Chao; Slocum, Alexander Henry; Nayfeh, Samir, Gas bearing electrostatic chuck.
  17. Zheng, Hui; Tsai, Kenneth; Wang, Hong; He, Yongxiang; Garcia, III, Jesus G.; Deyo, Daniel M., Guard for electrostatic chuck.
  18. Lee, William D.; DiVergilio, William; Drummond, Steve, Heated rotary seal and bearing for chilled ion implantation system.
  19. Lee, William D.; Drummond, Steve, Inert atmospheric pressure pre-chill and post-heat.
  20. Chhatre, Rish; Schaefer, David, Installation fixture for elastomer bands.
  21. Newton, Neal, Installation fixture for elastomer bands and methods of using the same.
  22. Newton, Neal, Installation fixture having a micro-grooved non-stick surface.
  23. Van Mierlo, Hubert Adriaan; Ham, Erik Leonardus; Meijer, Hendricus Johannes Maria; Neerhof, Hendrik Antony Johannes; Ottens, Joost Jeroen; Leijtens, Johannes Adrianus Petrus; Le Kluse, Marco; Hopman, Jan; Moors, Johannes Hubertus Josephina, Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus.
  24. Durbin, Aaron; Johnson, Morgan T.; Santos, Jose A., Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed.
  25. Grant,Casey J.; Sharrow,Joel M.; Snyder,John J., Method and apparatus for etch rate uniformity control.
  26. Martinez, Linnell; Pays-Volard, David; Johnson, Chris; Johnson, David; Westerman, Russell; Grivna, Gordon M., Method and apparatus for plasma dicing a semi-conductor wafer.
  27. John Lilleland ; Jerome S. Hubacek ; William S. Kennedy, Method of manufacturing assembly for plasma reaction chamber and use thereof.
  28. Mizuno, Seiji, Method of manufacturing fuel cells and fuel cells manufactured by the method.
  29. Kenney, Mark D., Perimeter seal for backside cooling of substrates.
  30. Donde Arik ; Levinstein Hyman J. ; Wu Robert W. ; Hegedus Andreas ; Weldon Edwin C. ; Shamouilian Shamouil ; Clinton Jon T. ; Bedi Surinder S., Puncture resistant electrostatic chuck.
  31. Liu, Hsi-Shui; Wang, Yeh-Chieh; Pai, Jiun-Rong, Replaceable electrostatic chuck sidewall shield.
  32. Mochizuki,Shinya, Reticle cassette and exposure apparatus using reticle cassette.
  33. Goodman, Daniel; Keigler, Arthur; Golovato, Stephen; Felsenthal, David, Substrate processing pallet with cooling.
  34. Narendrnath, Kadthala R.; Douglas, Michael; Bedi, Surinder, Substrate support having barrier capable of detecting fluid leakage.
  35. Gerhard M. Schneider ; Hamid Noorbakhsh ; Bryan Pu ; Kaushik Vaidya ; Brad Leroy Mays ; Hung Dao ; Evans Lee ; Hongging Shan, Support assembly with thermal expansion compensation.
  36. Larsen, Grant Kenji, Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure.
  37. Moslehi Mehrdad M., Thermally conductive chuck for vacuum processor.
  38. Moslehi, Mehrdad M., Thermally conductive chuck for vacuum processor.
  39. Mehrdad M. Moslehi, Thermally conductive chuck with thermally separated sealing structures.
  40. Lee, William D.; Purohit, Ashwin M.; LaFontaine, Marvin R., Vapor compression refrigeration chuck for ion implanters.
  41. Cleeves, James Montague, Wafer temperature control apparatus and method.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로