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Twin fan cooling device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • H01L-023/467
출원번호 US-0621448 (1996-03-25)
발명자 / 주소
  • Dodson Douglas A. (5995 Avenida Encinas Carlsbad CA 92008)
인용정보 피인용 횟수 : 41  인용 특허 : 13

초록

A cooling device for an electronic component, such as a computer processor, generally comprises a heat sink and a pair of fans. The fans are redundant in that sufficient cooling is supplied should one fan fail. The fans are independently powered and are inspectable and independently replaceable in s

대표청구항

A cooling device for an electronic component having a heat-emitting surface; said cooling device comprising: a heat sink including: a base plate including: a bottom including: a surface adapted for substantial surface contact with the heat-emitting surface the electronic component; a top including:

이 특허에 인용된 특허 (13)

  1. Wright Kurt O. (Sun Valley CA) Brehm Timothy L. (Irvine CA) Berger Duaine E. (Los Angeles CA) Matsuoka Paul S. (Culver City CA), Air baffle assembly for electronic circuit mounting frame.
  2. Tajima Tsuneaki (Tokyo JPX) Matsuo Yohichi (Tokyo JPX), Air cooling equipment for electronic systems.
  3. Lin Shih-jen (No. 360 ; Tanan Rd. Taipei TWX), Cooling device for CPU.
  4. Niklos John R. (Worthington OH), Cooling device for electronic components arranged in a vertical series and vertical series of electronic devices contain.
  5. Agee Keith D. (Torrance CA) Faulkner Fredrik E. (Rolling Hills Estates CA), Cooling system for a sealed enclosure.
  6. Hwang Un-Pah (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Dual-pull air cooling for a computer frame.
  7. Dunn Robert M. (Endicott NY) Schulman Martin D. (Wappingers NY) Timko ; Jr. Nicholas (Johnson City NY), Electronic circuit module cooling.
  8. Lee Lawrence Y. (Santa Ana CA), Electronic cooling chassis.
  9. Stelzer Sean R. (Farmington Hills MI), Engine cooling fan assembly with snap-on retainers.
  10. Papst Georg (St. Georgen DEX) Wrobel Guenter (Villingen DEX) Koletzki Ulrich (St. Georgen DEX), Heat sink for electronic devices.
  11. Bailey Norman W. (Sacramento CA), Low profile integrated heat sink and fan assembly.
  12. Washizu Katsushi (Numazu JPX), Motor fan unit.
  13. Yasuda Hiroshi (Kanagawa JPX) Yokoya Satoshi (Kanagawa JPX) Takao Nobutaka (Kanagawa JPX) Todo Akira (Saitama JPX), Radiotelephone apparatus.

이 특허를 인용한 특허 (41)

  1. Tavallaei Siamak ; Kotzur Gary B., Apparatus for initiating generation of an inter-processor interrupt by a peripheral device not directly connected to any.
  2. Tavallaei Siamak ; Rose Eric E., Bus protocol violation monitor systems and methods.
  3. Tavallaei Siamak ; Miller Joseph P., Bus ring-back and voltage over-shoot reduction techniques coupled with hot-pluggability.
  4. San Yaun Lin TW, CPU cooling arrangement.
  5. Busch, Diane S.; Davis, Alvin G.; Megarity, William M.; Ruggles, April E.; Wormsbecher, Paul A., Central electronics complex (‘CEC’) and fan structure.
  6. Jacob Nelik, Computer component cooling assembly.
  7. Nelik Jacob, Computer component cooling assembly.
  8. Tavallaei Siamak ; Autor Jeffrey S. ; Vu An T. ; Lacombe John S., Computer system comprising a method and apparatus for periodic testing of redundant devices.
  9. Sands Steve ; McAnally Andrew L. ; Mills R. Steven, Computer with an improved cooling system and a method for cooling a computer.
  10. Nakazono, Eiichiro; Yamashita, Akitomo, Cooling device motor having a hydrodynamic bearing with a unitary shaft thrust supporter.
  11. Mok,Lawrence S.; Quinones,Pablo D., Cooling device using multiple fans and heat sinks.
  12. Schaffer, Michael J., Electromagnetic noise reduction device.
  13. Schaffer,Michael J., Electromagnetic noise reduction device.
  14. Schaffer, Michael J., Electromagnetic noise suppression device.
  15. Kodaira Yuichi,JPX ; Ogawara Toshiki,JPX, Electronic component cooling apparatus including elongated heat sink.
  16. Winkler,Wolfgang Arno, Equipment fan.
  17. Hung, Te Fu, Heat dissipating module.
  18. Peng,Xue Wen, Heat dissipation device having a dual-fan arrangement.
  19. Horng Alex,TWX, Heat dissipation fan.
  20. Horng Alex,TWX, Heat dissipation fan.
  21. Horng Alex,TWX, Heat dissipation fan.
  22. Amou Mitsuru,JPX ; Mehara Koji,JPX, Heat sink apparatus.
  23. Rembold Dale ; McDonald Michael R., Heat sink including pedestal.
  24. Miyahara Masaharu,JPX ; Suga Kenji,JPX ; Tada Hisao,JPX ; Tate Sumio,JPX ; Sugimoto Kazuhiko,JPX, Heat sink unit for cooling a plurality of exothermic units, and electronic apparatus comprising the same.
  25. Artman, Paul T.; Wobig, Eric C., Heat sink with intermediate fan element.
  26. Chuang Wen-Hao,TWX, Heat sink with multi-layer dispersion space.
  27. Chang, Shun-Chen; Lin, Kuo-Cheng; Huang, Wen-Shi, Heat-dissipating module.
  28. Chang,Shun Chen; Lin,Kuo Cheng; Huang,Wen Shi, Heat-dissipating module.
  29. Huang, Wen-Shi; Wen, Chao-Wu; Chuang, Te-Tsai; Hsu, Ida, Heat-dissipating module.
  30. Nielsen, Erik R.; Bargerhuff, Richard A.; Massey, Carl, Heatsink with a plurality of fans.
  31. Rothschild, Philon, Housing for data storage devices or for accommodating such devices.
  32. Busby, Daniel; Pawelka, Gerhard; McCaffrey, Robert J.; Colucci, Jr., Jos?, Latching mechanism for securing a computer component into a housing.
  33. Lacombe John S. ; Santin Jose A. ; Tavallaei Siamak, Method and apparatus for determining computer system power supply redundancy level.
  34. Tavallaei Siamak ; Lacombe John S. ; Autor Jeffrey S. ; Santin Jose A., Method and apparatus for responding to actuation of a power supply switch for a computing system.
  35. Corbett,Jesse V.; Steiner,David J.; Johnson,Donald C., Method of removing foreign particles from heat transfer surfaces of heat sinks.
  36. Dodson Douglas A., Multiple fan cooling device.
  37. Tavallaei Siamak ; Olson Robert F., Power interlock with fault indicators for computer system.
  38. Chiu Chia-Pin, Push and pull dual-fan heat sink design.
  39. Cheng, Jui-Hung, Radiator fan.
  40. Robillard, David; Busby, Daniel; DeRuntz, Otto; Degerstrom, Mike; Haney, Richard M., Simplified power and data connector for use with chassis system that houses multiple processors.
  41. Tavallaei Siamak, System and method for providing a dual interrupt mechanism to designate the occurrence and termination of an event.
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