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Electrically insulated envelope heat pipe

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0607897 (1996-02-27)
발명자 / 주소
  • Meyer
  • IV George A. (Conestoga PA) Garner Scott D. (Lititz PA)
출원인 / 주소
  • Thermacore, Inc. (Lancaster PA 02)
인용정보 피인용 횟수 : 64  인용 특허 : 0

초록

The disclosure is for a heat pipe in the form of a simple foil envelope and a method of constructing such a heat pipe. Two plastic coated metal foil sheets are sealed together on all four edges to enclose a semi-rigid channeled sheet of plastic foam, and the envelope is evacuated and loaded with a s

대표청구항

A heat pipe comprising: a metal foil casing comprising two metal foil sheets joined and sealed together around the peripheral edges of the foil sheets to form an envelope, with non-condensible gases evacuated from the envelope; a sheet of foam material enclosed within the envelope so that the foil s

이 특허를 인용한 특허 (64)

  1. Elzey,Dana M.; Wadley,Haydn N. G., Active energy absorbing cellular metals and method of manufacturing and using the same.
  2. Bhatia, Rakesh, Apparatus for cooling a heat dissipating device located within a portable computer.
  3. Bhatia Rakesh ; Padilla Robert D., Apparatus for managing heat in a computer environment or the like.
  4. Reis,Bradley E.; Skandakumaran,Prathib; Smalc,Martin David; Shives,Gary D.; Kostyak,Gary Stephen; Norley,Julian, Base heat spreader with fins.
  5. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device.
  6. Ohmi, Motosuke; Kato, Eisaku; Tonosaki, Minehiro, Cooling device, electronic apparatus, display unit, and method of producing cooling device.
  7. Ohmi, Motosuke; Kato, Eisaku; Tonosaki, Minehiro, Cooling device, electronic apparatus, display unit, and method of producing cooling device.
  8. Ohmi,Motosuke; Kato,Eisaku; Tonosaki,Minehiro, Cooling device, electronic apparatus, display unit, and method of producing cooling device.
  9. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporator employing a liquid superheat tolerant wick.
  10. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Evaporator for a heat transfer system.
  11. Khrustalev, Dmitry; Cologer, Pete; Garzon, Jessica Maria; Stouffer, Charles; Feenan, Dave; Baker, Jeff; Beres, Matthew C., Evaporator for use in a heat transfer system.
  12. Kroliczek, Edward J.; Khrustalev, Dmitry; Morgan, Michael J., Evaporator including a wick for use in a two-phase heat transfer system.
  13. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Evaporators for heat transfer systems.
  14. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.
  15. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.
  16. Masaaki Yamamoto JP; Jun Niekawa JP; Yuichi Kimura JP; Kenichi Namba JP, Flat type heat pipe.
  17. John H. Rosenfeld ; Nelson J. Gernert ; David B. Sarraf ; Peter Wollen ; Frank Surina ; John Fale, Flexible heat pipe.
  18. Koichi Inoue JP; Chiyoshi Sasaki JP, Heat conducting apparatus and electronic apparatus having the same.
  19. Queheillalt,Douglas T.; Wadley,Haydn N. G.; Katsumi,Yasushi, Heat exchange foam.
  20. Zhao, Yuan; Chen, Chunglung, Heat pipe dissipating system and method.
  21. Kawahara,Youji; Mochizuki,Masataka; Mashiko,Koichi; Kiyooka,Fumitoshi; Agata,Hiroaki, Heat pipe excellent in reflux characteristic.
  22. Meng, Jin Gong; Hwang, Ching Bai, Heat spreader with vapor chamber and method of manufacturing the same.
  23. Hwang, Ching-Bai; Meng, Jin-Gong, Heat spreader with vapor chamber defined therein and method of manufacturing the same.
  24. Hashimoto,Toshio, Heat transfer element, cooling device and electronic device having the element.
  25. Thors, Petur, Heat transfer surface for electronic cooling.
  26. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, David A., Heat transfer system.
  27. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Heat transfer system.
  28. Makino, Takuya; Hara, Masaki, Heat transport device and electronic device.
  29. Makino, Takuya; Hara, Masaki, Heat transport device and electronic device.
  30. Makino,Takuya; Hara,Masaki, Heat transport device and electronic device.
  31. Dussinger Peter M. ; Myers Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
  32. Dussinger, Peter M.; Myers, Thomas L.; Rosenfeld, John H.; Minnerly, Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.
  33. Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
  34. Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
  35. Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
  36. Dussinger,Peter M.; Myers,Thomas L.; Rosenfeld,John H.; Minnerly,Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.
  37. Bhatia Rakesh, Keyboard having an integral heat pipe.
  38. Bakke, Allan P, Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability.
  39. Kroliczek,Edward J.; Yun,James Seokgeun; Nikitkin,Michael; Wolf, Sr.,David A., Manufacture of a heat transfer system.
  40. Wadley, Haydn N. G.; Queheillalt, Douglas T.; Haj-Hariri, Hossein; Evans, Anthony G.; Peterson, George P.; Kurtz, Robert; Long, G. Douglas; Murty, Yellapu V., Method and apparatus for jet blast deflection.
  41. Ervin,Kenneth D.; Wadley,Haydn N. G., Method for manufacture of truss core sandwich structures and related structures thereof.
  42. Keyes, Thomas Joseph; Bass, James, Method of manufacturing a thermoplastic tubular jacket.
  43. Ponnappan Rengasamy ; Leland John E., Micro channel heat pipe having wire cloth wick and method of fabrication.
  44. Moore David A., Molded heat exchanger structure for portable computer.
  45. Touzov,Igor Victorovich, Multi-surface heat sink film.
  46. Albert, Donald F.; Andrews, Greg R.; Bruno, Joseph W., Organic, open cell foam materials, their carbonized derivatives, and methods for producing same.
  47. Albert, Donald F; Andrews, Greg R; Bruno, Joseph W, Organic, open cell foam materials, their carbonized derivatives, and methods for producing same.
  48. Albert,Donald F.; Andrews,Greg R.; Bruno,Joseph W., Organic, open cell foam materials, their carbonized derivatives, and methods for producing same.
  49. Ueki, Tatsuhiko; Yamamoto, Masaaki; Kimura, Yuichi, Plate-type heat pipe and method for manufacturing the same.
  50. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Sintered grooved wick with particle web.
  51. Garner,Scott D.; Lindemuth,James E.; Toth,Jerome E.; Rosenfeld,John H.; Minnerly,Kenneth G., Sintered grooved wick with particle web.
  52. Li Jia Hao,TWX, Structure of a super-thin heat plate.
  53. Kroliczek, Edward J.; Yun, James; Bugby, David; Wolf, Sr., David A., Thermal management system.
  54. Kroliczek, Edward J.; Yun, James S.; Bugby, David C.; Wolf, Sr., David A., Thermal management systems.
  55. Kroliczek, Edward J.; Yun, James Soekgeun; Bugby, David C.; Wolf, Sr., David A., Thermal management systems including venting systems.
  56. Belady,Christian L; Peterson,Eric C.; Boudreaux,Brent A; Harris,Shaun L.; Zeighami,Roy M., Thermal pouch interface.
  57. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Thermodynamic system including a heat transfer system having an evaporator and a condenser.
  58. Sasaki,Yasumi; Ooi,Yasuyuki, Thin sheet type heat pipe.
  59. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Tower heat sink with sintered grooved wick.
  60. Kroliczek, Edward J.; Khrustalev, Dmitry; Morgan, Michael J., Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems.
  61. Siu, Wing Ming, Vapor augmented heatsink with multi-wick structure.
  62. Lindemuth, James E.; Rosenfeld, John H., Vapor chamber with sintered grooved wick.
  63. Lindemuth,James E.; Rosenfeld,John H., Vapor chamber with sintered grooved wick.
  64. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Wick having liquid superheat tolerance and being resistant to back-conduction, evaporator employing a liquid superheat tolerant wick, and loop heat pipe incorporating same.
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