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특허 상세정보

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내보내기 페이스북 공유 카카오톡 공유

Automatic chemical and mechanical polishing system for semiconductor wafers

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B24B-049/00    B24B-051/00   
미국특허분류(USC) 451/5 ; 451/285 ; 451/286 ; 451/287
출원번호 US-0333036 (1994-11-01)
발명자 / 주소
  • Lund Douglas E. (13304 Purple Sage Dallas TX 75240)
인용정보 피인용 횟수 : 134  인용 특허 : 0
초록
▼

A system and method for chemically and mechanically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The system determines the thic...

대표
청구항
▼

A method of polishing a semiconductor wafer having a substrate and a surface film, said method comprising the steps of: holding said semiconductor wafer without requiring that said wafer have a central aperture; polishing one surface of said wafer to a microscopically smooth surface; determining the thickness of said surface film, in real time, while polishing said wafer; and automatically controlling said polishing step with a control computer, said automatic controlling step including the steps of: providing measurements of said surface film thickness ...

이 특허를 인용한 특허 (134)

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