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Endpoint regulator and method for regulating a change in wafer thickness in chemical-mechanical planarization of semicon 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-037/04
출원번호 US-0600461 (1996-02-13)
발명자 / 주소
  • Iyer Ravi (Boise ID)
출원인 / 주소
  • Micron Technology, Inc. (Boise ID 02)
인용정보 피인용 횟수 : 89  인용 특허 : 0

초록 ▼

The present invention is an endpoint regulator that controls the endpoint in chemical-mechanical planarization of a semiconductor wafer on a polishing pad. The endpoint regulator has a chuck with a mounting surface to which the wafer is attachable, and a spacer connected to the chuck around the peri

대표청구항 ▼

An endpoint regulator for controlling the endpoint of a semiconductor wafer in semiconductor chemical-mechanical planarization processes, comprising: a chuck having a mounting surface to which the wafer is attachable; and a spacer connected to the chuck and substantially surrounding the chuck around

이 특허를 인용한 특허 (89)

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