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Electronic equipment and lap-top type electronic equipment 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0489623 (1995-06-12)
우선권정보 JP-0056804 (1993-03-17)
발명자 / 주소
  • Ohashi Shigeo (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Tanaka Takeo (Minori-machi JPX) Iwai Susumu (Hadano JPX)
출원인 / 주소
  • Hitachi, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 75  인용 특허 : 0

초록 ▼

A flat shaped header having a heat receiving side is attached to a semiconductor element mounted on a circuit board. The header having the heat receiving side is connected to another header having a heat receiving side attached to a plurality of heat radiating fins so as to form a heat exchanging ra

대표청구항 ▼

An electronic equipment comprising a body of equipment containing at least one electronic circuit board mounting a plurality of semiconductor elements thereon, at least one flat shaped header having a heat receiving side with an inside flow passage capable of flowing cooling liquid and thermally con

이 특허를 인용한 특허 (75)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station.
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  2. Sasaki, Chiyoshi, Apparatus for cooling a box with heat generating elements received therein and a method for cooling same.
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  3. Senyk, Borys S.; Moresco, Larry L., Apparatus for cooling a computer.
    상세보기
  4. Bhatia Rakesh, Apparatus for cooling electronic components within a computer system enclosure.
    상세보기
  5. Uttam Shyamalindu Ghoshal, Apparatus for dense chip packaging using heat pipes and thermoelectric coolers.
    상세보기
  6. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Combined air and refrigeration cooling for computer systems.
    상세보기
  7. Scott, Alexander Robin Walter, Computer cooling apparatus.
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  8. Scott, Alexander Robin Walter, Computer cooling apparatus.
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  9. Scott,Alexander Robin Walter, Computer cooling apparatus.
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  10. Lyon, Geoff Sean; Holden, Michael James, Computer cooling system with preferential cooling device selection.
    상세보기
  11. Minamitani, Rintaro; Ohashi, Shigeo; Kondo, Yoshihiro; Yoshitomi, Yuji; Naganawa, Takashi; Nakanishi, Masato; Nakagawa, Tsuyoshi, Cooling device of electronic apparatus.
    상세보기
  12. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
    상세보기
  13. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
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  14. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
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  15. Cheon Kioan, Cooling system for computer.
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  16. Suzuki Masahiro,JPX, Cooling system for electronic packages.
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  17. Suzuki Masahiro,JPX, Cooling system for electronic packages.
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  18. Suzuki, Masahiro, Cooling system for electronic packages.
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  19. O'Connor Michael ; Haley Kevin ; Bhatia Rakesh ; Adams Daniel Thomas ; Kast Michael Andrew, Cooling system for thin profile electronic and computer devices.
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  20. Ishikawa, Kenichi; Hisano, Katsumi, Cooling unit for cooling a heat generating component and electronic apparatus having the cooling unit.
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  21. Hata,Yukihiko; Tomioka,Kentaro; Tanimoto,Mitsuyoshi, Cooling unit having a plurality of heat-radiating fins, and electronic apparatus with the cooling unit.
    상세보기
  22. Ishikawa, Kenichi; Hisano, Katsumi, Cooling unit including radiator for radiating heat of heat generating component, and electronic apparatus including the cooling unit.
    상세보기
  23. Shook,James Gill; Lovette,James, Decoupled spring-loaded mounting apparatus and method of manufacturing thereof.
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  24. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
    상세보기
  25. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
    상세보기
  26. Laing, Oliver, Device for the local cooling or heating of an object.
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  27. Kondo, Yoshihiro; Matsushita, Shinji; Ohashi, Shigeo; Naganawa, Takashi; Minamitani, Rintaro; Nakagawa, Tsuyoshi; Yoshitomi, Yuuji; Nakanishi, Masato; Katou, Hajime, Electronic apparatus.
    상세보기
  28. Kondo, Yoshihiro; Matsushita, Shinji; Ohashi, Shigeo; Naganawa, Takashi; Minamitani, Rintaro; Nakagawa, Tsuyoshi; Yoshitomi, Yuuji; Nakanishi, Masato; Katou, Hajime, Electronic apparatus.
    상세보기
  29. Ohashi, Shigeo; Ashiwake, Noriyuki; Naganawa, Takashi; Kitano, Makoto; Minamitani, Rintaro; Kondo, Yoshihiro; Nakagawa, Tsuyoshi, Electronic apparatus.
    상세보기
  30. Tomioka, Kentaro; Hisano, Katsumi; Takamatsu, Tomonao; Tanimoto, Mitsuyoshi; Kusaka, Hiroyuki; Kinoshita, Teruo, Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component.
    상세보기
  31. Akira Ueda JP; Masumi Suzuki JP; Minoru Hirano JP, Electronic apparatus having a heat dissipation member.
    상세보기
  32. Akira Ueda JP; Masumi Suzuki JP; Minoru Hirano JP; Toyokazu Hamaguchi JP; Shigeru Hidesawa JP, Electronic apparatus having a heat dissipation member.
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  33. Ueda Akira,JPX ; Suzuki Masumi,JPX ; Hirano Minoru,JPX ; Hamaguchi Toyokazu,JPX ; Hidesawa Shigeru,JPX, Electronic apparatus having a heat dissipation member.
    상세보기
  34. Ueda, Akira; Suzuki, Masumi; Hirano, Minoru; Hamaguchi, Toyokazu; Hidesawa, Shigeru, Electronic apparatus having a heat dissipation member.
    상세보기
  35. Ueda, Akira; Suzuki, Masumi; Hirano, Minoru; Hamaguchi, Toyokazu; Hidesawa, Shigeru, Electronic apparatus having a heat dissipation member.
    상세보기
  36. Ishikawa, Kenichi; Hisano, Katsumi, Electronic apparatus including a circulation path for circulating cooling medium.
    상세보기
  37. Ishikawa, Kenichi; Hisano, Katsumi, Electronic apparatus including a cooling unit for cooling a heat generating component.
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  38. Nishii Kota,JPX ; Kimura Kouichi,JPX ; Ishizuki Masanobu,JPX ; Adachi Katsura,JPX ; Uchida Hiroki,JPX, Electronic apparatus, housing for electronic apparatus and housing manufacturing method.
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  39. Aoki, Hitoshi; Kubota, Junichi; Komatsubara, Takeo; Motegi, Junichi; Kakinuma, Hirotaka; Otsuka, Naoki; Matsuoka, Masaya, Electronic device.
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  40. Ishimine, Junichi; Suzuki, Masahiro, Electronic device.
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  41. Dessiatoun, Serguei V.; Ivakhnenko, Igor, Enhanced heat transfer structure with heat transfer members of variable density.
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  42. Rakesh Bhatia ; Karen Regis, Fan based heat exchanger.
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  43. Han, Tai-Sheng, Fixing device for interface card fluid-cooling structure.
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  44. Bhatia Rakesh, Flat fan heat exchanger and use thereof in a computing device.
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  45. Chang, Shyy-Woei, Heat dissipation device with liquid coolant.
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  46. Bhatia Rakesh, Heat exchanger for a portable computing device and docking station.
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  47. Lian Bin ; Dishongh Terrance J. ; Searls Damion T. ; Dujari Prateek J., Heat sink with integrated fluid circulation pump.
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  48. Zuo, Jon, Heat spreader with oscillating flow.
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  49. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
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  50. Ohashi, Shigeo; Kondo, Yoshihiro; Minamitani, Rintaro; Naganawa, Takashi; Yoshitomi, Yuuji; Nakanishi, Masato; Katou, Hajime; Nakagawa, Tsuyoshi, Liquid circulation cooling system for electronic apparatus.
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  51. He,Li; Lee,Tsung Lung, Liquid cooling device.
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  52. Matsushita,Shinji; Oikawa,Hironori, Liquid cooling module.
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  53. Minamitani, Rintaro; Kitano, Makoto; Ashiwake, Noriyuki; Ohashi, Shigeo; Kondo, Yoshihiro; Naganawa, Takashi; Yoshitomi, Yuji; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using the same.
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  59. Ishimine, Junichi; Suzuki, Masahiro; Miyo, Masahiro; Fujisaki, Akihiko; Takemura, Keizo; Wei, Jie; Kawashima, Hisashi; Udagawa, Yoshiaki; Yamamoto, Haruhiko; Mochizuki, Masahiro, Liquid-cooled electronic apparatus.
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  66. Huang Bin-Juine,TWX, Network-type heat pipe device.
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  67. Malone,Christopher Gregory; Simon,Glenn Cochran, One or more heat exchanger components in major part operably locatable outside computer chassis.
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  68. Liu, I-Ming, Radiator plate rapid cooling apparatus.
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  69. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use.
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  70. Chen, Chin-Ping, Semi-closed air cooling type radiator.
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  71. Adachi Kazutaka,JPX ; Ashizawa Hiroyuki,JPX, Speed change ratio controller for continuously variable transmission.
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  72. Hileman Vince P., Spray cooled module with removable spray cooled sub-module.
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  73. Shari Lynn Slovikosky, System and method for cooling a central processing unit.
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  74. Lehman, Bret W.; Matteson, Jason Aaron; White, Graham Michael, System for cooling a component in a computer system.
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  75. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
    상세보기

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