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Electroless plating process for the manufacture of printed circuit boards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/02
출원번호 US-0558900 (1995-11-16)
발명자 / 주소
  • Cane Frank N. (3058 Plumstead Way San Jose CA 95148)
인용정보 피인용 횟수 : 214  인용 특허 : 0

초록 ▼

There is disclosed a process for electroless plating of a conductive metal layer onto the surface of a non-conductive substrate, in which the substrate surface is prepared for receiving a coating of activator using conventional methods, and the coating of activator is applied by contacting the subst

대표청구항 ▼

An electroless plating process comprising the steps of: a) preparing a surface of a non-conductive substrate by treatment of such surface with alkaline permanganate or by plasma desmearing; b) contacting the prepared surface resulting from step a) with a stabilized sensitizing solution comprising (i

이 특허를 인용한 특허 (214)

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