초록 ▼

There is provided a component for use in electronic packaging. The component is a composite having a graphite matrix which is infiltrated with a metal or a metal alloy and the external surfaces of the composite then coated with a metallic layer to provide environmental and mechanical protection. The

There is provided a component for use in electronic packaging. The component is a composite having a graphite matrix which is infiltrated with a metal or a metal alloy and the external surfaces of the composite then coated with a metallic layer to provide environmental and mechanical protection. The packaging components are lightweight, have a coefficient of thermal expansion close to that of a silicon based integrated circuit device and further, have a high coefficient of thermal conductivity.

대표청구항 ▼

An electronic package, comprising: a base formed from a metal infiltrated graphite composite, said base being hermetic and free of open pores and coated with a metallic layer; a cover; a leadframe disposed between said base and said cover; and a dielectric sealant bonding said base to said cover wit

An electronic package, comprising: a base formed from a metal infiltrated graphite composite, said base being hermetic and free of open pores and coated with a metallic layer; a cover; a leadframe disposed between said base and said cover; and a dielectric sealant bonding said base to said cover with said leadframe disposed therebetween.