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Plasma processing method and apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/34
출원번호 US-0591935 (1990-10-02)
우선권정보 JP-0257290 (1989-10-02)
발명자 / 주소
  • Kokaku Yuichi (Yokohama JPX) Kataoka Hiroyuki (Pallo Alto CA) Kitoh Makoto (Yokohama JPX) Fujimaki Shigehiko (Machida JPX) Matsunuma Satoshi (Yokohama JPX) Furusawa Kenji (Yokohama JPX) Nakagawa Nobu
출원인 / 주소
  • Hitachi, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 49  인용 특허 : 12

초록

A plasma processing apparatus comprising: a vacuum container; an evacuation means for keeping the interior of the vacuum container at a pressure not higher than atmospheric pressure; a substrate support device for supporting a substrate to be subjected to plasma processing; an electrode for generati

대표청구항

A plasma processing apparatus comprising: a vacuum container; an evacuation means for keeping the interior of the vacuum container at a pressure not higher than atmospheric pressure; a substrate support means for supporting a substrate to be subjected to plasma processing; an electrode for generatin

이 특허에 인용된 특허 (12)

  1. Hazano Shigeki (Yokohama CA JPX) Shibagaki Masahiro (San Jose CA) Jyo Hidetaka (Sagamihara JPX) Sensui Reiichiro (Sagamihara JPX) Iwami Munenori (Yokohama JPX) Suzuki Noboru (Chigasaki JPX), Apparatus for producing semiconductor devices.
  2. Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA), Disk or wafer handling and coating system.
  3. Flint Alan (Los Gatos CA) Miller Ken (Mt. View CA) Shah Sushil (Sunnyvale CA), In-line disk sputtering system.
  4. Hedgcoth Virgle L. (1524 Hacienda Pl. Pomona CA 91768), Method and apparatus making magnetic recording disk.
  5. Schultheiss Eberhard (Herborn DEX) Wirz Peter (Waldernbach DEX), Method and arrangement for fabricating magneto-optical, storable, and/or deletable data carriers.
  6. Nishitani Eisuke (Yokohama JPX) Tsuzuku Susumu (Tokyo JPX) Nakatani Mitsuo (Yokohama JPX) Maehara Masaaki (Tokyo JPX) Horiuchi Mitsuaki (Hachioji JPX) Mizukami Koichiro (Akishima JPX), Method for selective deposition of metal thin film.
  7. Freeman Kenneth F. (Mountain View CA) Garrett Charles B. (San Jose CA) Harra David J. (San Francisco CA) Lei Lawrence C. (Mountain View CA), Planar magnetron sputtering device with combined circumferential and radial movement of magnetic fields.
  8. Kieser Jrg (Albstadt DEX) Sellschopp Michael (Hammersbach DEX) Geisler Michael (Wchtersbach DEX), Plasma treatment apparatus.
  9. Howard James K. (Morgan Hill CA), Process for making a thin film metal alloy magnetic recording disk with a hydrogenated carbon overcoat.
  10. Lo John C. (Endwell NY) Lu Neng-hsing (Endwell NY), Reactor for plasma desmear of high aspect ratio hole.
  11. Chow Robert (Fremont CA) Downey Steven D. (Burlingame CA), Semiconductor etching apparatus with magnetic array and vertical shield.
  12. Katsura Toshihiko (Yokohama JPX) Abe Masahiro (Yokohama JPX), Sputtering chamber structure for high-frequency bias sputtering process.

이 특허를 인용한 특허 (49)

  1. Kwak, Jae Chan; Kang, Sung Kyu; Jung, Hun; Cho, Byoung Ha, Apparatus for treating substrate and method for treating substrate.
  2. Plester, George; Ehrich, Horst, Barrier coated plastic containers and coating methods therefor.
  3. Shi,Yu; Mucha,Lawrence S., Coating composition containing an epoxide additive and structures coated therewith.
  4. Hosoi, Kazuto; Shirasuna, Toshiyasu; Takada, Kazuhiko; Okamura, Ryuji; Akiyama, Kazuyoshi; Murayama, Hitoshi, Deposited film forming apparatus.
  5. Hosoi, Kazuto; Shirasuna, Toshiyasu; Takada, Kazuhiko; Okamura, Ryuji; Akiyama, Kazuyoshi; Murayama, Hitoshi, Deposited film forming apparatus and deposited film forming method.
  6. Gerd Andler DE; Wolfgang Wixwat-Ernst DE; Christoph Metzner DE; Jens-Peter Heinss DE; Klaus Goedicke DE; Siegfried Schiller DE, Device for vacuum coating slide bearings.
  7. Shajii, Ali; Gottscho, Richard; Benzerrouk, Souheil; Cowe, Andrew; Nagarkatti, Siddharth P.; Entley, William R., Distributed multi-zone plasma source systems, methods and apparatus.
  8. Shajii, Ali; Gottscho, Richard; Benzerrouk, Souheil; Cowe, Andrew; Nagarkatti, Siddharth P.; Entley, William, Distributed, concentric multi-zone plasma source systems, methods and apparatus.
  9. Stahr, Frank; Stephan, Ulf; Steinke, Olaff; Schade, Klaus, Electrode and arrangement with movable shield.
  10. Kosuke Nakamura JP; Yasushi Sawada JP; Hiroaki Kitamura JP; Yoshitami Inoue JP, Electrode for plasma generation, plasma treatment apparatus using the electrode, and plasma treatment with the apparatus.
  11. Mizuno Shigeru,JPX ; Tagami Manabu,JPX ; Yoshimura Takanori,JPX, Electrode unit for in-situ cleaning in thermal CVD apparatus.
  12. Kazuto Hosoi JP; Toshiyasu Shirasuna JP; Kazuhiko Takada JP; Ryuji Okamura JP; Kazuyoshi Akiyama JP; Hitoshi Murayama JP, Film forming apparatus.
  13. Konishi, Nobuo; Iwashita, Mitsuaki; Ohno, Hiroki; Kawamura, Shigeru; Sugiura, Masahito, Film forming method by radiating a plasma on a surface of a low dielectric constant film.
  14. Plester George,BEX ; Ehrich Horst,DEX ; Rule Mark, Hollow plastic containers with an external very thin coating of low permeability to gases and vapors through plasma-assisted deposition of inorganic substances and method and system for making the co.
  15. Fangli Hao ; Keith Dawson, Linear drive system for use in a plasma processing system.
  16. Hao, Fangli; Dawson, Keith; Lenz, Eric H., Linear drive system for use in a plasma processing system.
  17. Hao, Fangli; Dawson, Keith; Lenz, Eric H., Linear drive system for use in a plasma processing system.
  18. Strang, Eric J.; Mitrovic, Andrej S., Method and structure to segment RF coupling to silicon electrode.
  19. Vanden Brande, Pierre, Method and system for galvanizing by plasma evaporation.
  20. Plester, George; Ehrich, Horst; Rule, Mark, Method for coating a plastic container with vacuum vapor deposition.
  21. Matsumoto Shigeharu,JPX ; Kikuchi Kazuo,JPX, Method for forming a thin film of a metal compound by vacuum deposition.
  22. Krisko,Annette J.; Bond,Bob; Stanek,Roger; Pfaff,Gary; Hartig,Klaus, Methods and apparatuses for depositing film on both sides of a pane.
  23. George Plester BE; Horst Ehrich DE, Methods for measuring the degree of ionization and the rate of evaporation in a vapor deposition coating system.
  24. Rule, Mark; Shi, Yu; Gebele, Thomas; Grimm, Helmut; Budke, Elisabeth, Multilayer polymeric/inorganic oxide structure with top coat for enhanced gas or vapor barrier and method for making same.
  25. Rule, Mark; Shi, Yu; Gebele, Thomas; Grimm, Helmut; Budke, Elisabeth, Multilayer polymeric/inorganic oxide structure with top coat for enhanced gas or vapor barrier and method for making same.
  26. Rule, Mark; Shi, Yu; Ehrich, Horst, Multilayer polymeric/zero valent material structure for enhanced gas or vapor barrier and UV barrier and method for making same.
  27. Rule, Mark; Shi, Yu; Ehrich, Horst, Multilayer polymeric/zero valent material structure for enhanced gas or vapor barrier and uv barrier and method for making same.
  28. Ogawa Yoichi,JPX ; Mizumura Tetsuo,JPX ; Yano Akira,JPX ; Kusada Hideo,JPX ; Kubota Takashi,JPX ; Asano Michio,JPX ; Wakai Kunio,JPX, Plasma CVD apparatus.
  29. Yoichi Ogawa JP; Tetsuo Mizumura JP; Akira Yano JP; Hideo Kusada JP; Takashi Kubota JP; Michio Asano JP; Kunio Wakai JP, Plasma CVD apparatus.
  30. Yamanaka, Kazuto; Sato, Akio, Plasma processing apparatus and method of manufacturing magnetic recording medium.
  31. Motokawa, Takeharu; Ooiwa, Tokuhisa; Demura, Kensuke; Yoshimori, Tomoaki; Karyu, Makoto; Kase, Yoshihisa; Azumano, Hidehito, Plasma processing apparatus and plasma processing method.
  32. Plester George,BEX ; Ehrich Horst,DEX, Plasma-enhanced vacuum vapor deposition system including systems for evaporation of a solid, producing an electric arc discharge and measuring ionization and evaporation.
  33. Plester George,BEX ; Ehrich Horst,DEX ; Rule Mark ; Pickel Herbert,DEX ; Humele Heinz,DEX, Plastic containers with an external gas barrier coating.
  34. Humele, Heinz; Pickel, Herbert; Plester, George; Ehrich, Horst; Rule, Mark, Plastic containers with an external gas barrier coating, method and system for coating containers using vapor deposition, method for recycling coated containers, and method for packaging a beverage.
  35. Reimer, Paul; Sabouri, Pedram; Smith, Dennis, Processing apparatus having integrated pumping system.
  36. Reimer,Peter; Sabouri,Pedram; Smith,Dennis R., Processing apparatus having integrated pumping system.
  37. Lee,Jae cheol; Lim,Chang bin; Han,Kwi young, Reaction apparatus for atomic layer deposition.
  38. Ogawa Takashi,JPX, Semiconductor manufacturing apparatus.
  39. Gottscho, Richard; Dhindsa, Rajinder; Srinivasan, Mukund, Small plasma chamber systems and methods.
  40. Gottscho, Richard; Dhindsa, Rajinder; Srinivasan, Mukund, Small plasma chamber systems and methods.
  41. Kobayashi Masahiko,JPX ; Takahashi Nobuyuki,JPX, Sputtering apparatus.
  42. Brabender, Dennis M; Kokoschke, Jeffrey L, Sputtering apparatus including target mounting and control.
  43. Hwang, Chul Joo; Han, Jeung Hoon; Kim, Young Hoon; Seo, Seung Hoon, Substrate treating apparatus and method.
  44. James Mikel Atkinson ; Hirohiko Nishiki JP; Patrick L. Guthrie, System and method for DC sputtering oxide films with a finned anode.
  45. Fairbairn, Kevin P.; Barnes, Michael S.; Bluck, Terry; Xu, Ren; Liu, Charles; Kerns, Ralph, System and method for commercial fabrication of patterned media.
  46. Barnes, Michael S.; Bluck, Terry, System and method for dual-sided sputter etch of substrates.
  47. Barnes, Michael S.; Bluck, Terry, System and method for dual-sided sputter etch of substrates.
  48. Hudson, Eric, System, method and apparatus of a wedge-shaped parallel plate plasma reactor for substrate processing.
  49. Shajii, Ali; Gottscho, Richard; Benzerrouk, Souheil; Cowe, Andrew; Nagarkatti, Siddharth P.; Entley, William R., Systems, methods and apparatus for choked flow element extraction.
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