초록 ▼

A high speed, high accuracy, three-dimensional inspection system for ball and pin grid assemblies. The system uses a three-dimensional scanner to gather data which is analyzed to yield height position measurements along with overall packaged dimensions. The grid array to be scanned is placed upon a

A high speed, high accuracy, three-dimensional inspection system for ball and pin grid assemblies. The system uses a three-dimensional scanner to gather data which is analyzed to yield height position measurements along with overall packaged dimensions. The grid array to be scanned is placed upon a fixture above a motion control table. The motion control system is controlled by a personal computer and has a high resolution. The parts can be presented in single trays, tray stackers, tubes or other carriers. Array packages are handled either manually or automatically. In the manual mode, arrays are loaded onto the fixture by hand before activated the image processing hardware. Alternatively, an automatic pick and place module may be used to load the grid array packages on the fixture. The fixture consists of a plate with a cavity the size of the grid array package being inspected. The size of the cavity can be adjusted to fit different size parts. In addition to the height and position measurements, measurements of spacing, coplanarity, standoff, grid pitch, ball diameter, ball position, and package warp can be performed. With regard to pin grid arrays, bent or missing pins can be detected with the system. With regard to ball grid arrays, missing balls can be detected.

대표청구항 ▼

An apparatus for inspecting a grid array, comprising: (a) a three-dimensional laser scanner for projecting and scanning a beam of laser light across the grid array; (b) collection means for collecting light scattered from the grid array by the beam of laser light to generate a first set of three-dim

An apparatus for inspecting a grid array, comprising: (a) a three-dimensional laser scanner for projecting and scanning a beam of laser light across the grid array; (b) collection means for collecting light scattered from the grid array by the beam of laser light to generate a first set of three-dimensional and intensity information; (c) a computer for controlling the laser scanner and collection means and for receiving the first set of three-dimensional and intensity information, the computer further comprising: (i) means for storing the first set of three-dimensional and intensity information into the computer; and (ii) data processing means for extracting height and dimensional data for the grid array from the first set of three-dimensional and intensity information; (d) coarse position determining means, coupled to the data processing means, for analyzing the extracted dimensional data to generate a coarse position location for a grid array element; and (e) fine position determining means, coupled to the data processing means, for analyzing the extracted height data to generate a fine position location for the grid array element.