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Triangulation-based 3D imaging and processing method and system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01B-011/24
출원번호 US-0658579 (1996-07-29)
발명자 / 주소
  • Svetkoff Donald J. (Ann Arbor MI) Rohrer Donald K. (Whitmore Lake MI) Kelley Robert W. (Ann Arbor MI)
출원인 / 주소
  • General Scanning Inc, (Simi Valley CA 02)
인용정보 피인용 횟수 : 36  인용 특허 : 0

초록

A triangulation-based method and system for high speed 3D and gray scale imaging and associated pre-processing of digitized information allows for estimation or filtering of height and gray scale values. This estimation is based upon the confidence level of the information obtained from a pair of se

대표청구항

A triangulation-based 3D processing method for generating transformed height and gray scale values, the method comprising the steps of: generating a first pair of data values represented by height data and intensity data obtained from a first direction with respect to an object; generating a second

이 특허를 인용한 특허 (36)

  1. Lehnen David Charles ; LeBeau Christopher John, Apparatus and method for acquiring multiple images.
  2. Ben-Dove Shimshon,ILX ; Fridhendler Michael,ILX ; Lanzet Igal,ILX ; Kuperman Igor,ILX, Apparatus and method for optically measuring an object surface contour.
  3. Beaty Elwin M. ; Mork David P., Apparatus for three dimensional inspection of electronic components.
  4. Buckley B. Shawn ; Chen Jihong,CNXITX 430074 ; Yang Dao Shan,CNX ; Zhou Hui Cheng,CNXITX 430074, Computer aided inspection machine.
  5. Fairley,Christopher R.; Fu,Tao Yi; Tsai,Bin Ming Benjamin; Young,Scott A., Confocal wafer depth scanning inspection method.
  6. Fairley, Christopher R.; Fu, Tao-Yi; Tsai, Bin-Ming Benjamin; Young, Scott A., Confocal wafer inspection method and apparatus using fly lens arrangement.
  7. Fairley,Christopher R.; Fu,Tao Yi; Tsai,Bin Ming Benjamin; Young,Scott A., Confocal wafer inspection method and apparatus using fly lens arrangement.
  8. Fairley, Christopher R.; Fu, Tao-Yi; Tsai, Bin-Ming Benjanim; Young, Scott A., Confocal wafer inspection system and method.
  9. Keller, Hubert; Rudolf, Michael, Crankshaft testing method.
  10. Beaty,Elwin M.; Mork,David P., Electronic component products and method of manufacturing electronic component products.
  11. Beaty,Elwin M.; Mork,David P., Electronic component products made according to a process that includes a method for three dimensional inspection.
  12. Lavelle,Joseph P.; Schuet,Stefan R., High speed three-dimensional laser scanner with real time processing.
  13. Puah, Yong Joo; Tang, Hak Wee; Teo, Soon Poo, Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components.
  14. Leonard,Patrick F.; Scarpine,Victor; Evans,Frank, Method and apparatus for evaluating integrated circuit packages having three dimensional features.
  15. Lehnen David Charles ; Gering Marcus J., Method and apparatus for generating a stereoscopic image.
  16. Rozin, Daniel H., Method and apparatus for generating three-dimensional representations of objects.
  17. Beaty Elwin M. ; Mork David P., Method and apparatus for three dimensional inspection of electronic components.
  18. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  19. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  20. Svetkoff, Donald J.; Kilgus, Donald B. T.; Lin, Warren; Ehrmann, Jonathan S., Method and system for 3D imaging of target regions.
  21. Donald J. Svetkoff ; Donald B. T. Kilgus ; Jonathan S. Ehrmann, Method and system for high speed measuring of microscopic targets.
  22. Donald J. Svetkoff ; Donald B. T. Kilgus ; Warren Lin ; Jonathan S. Ehrmann, Method and system for high speed measuring of microscopic targets.
  23. Svetkoff,Donald J.; Kilgus,Donald B. T.; Lin,Warren; Ehrmann,Jonathan S., Method and system for high speed measuring of microscopic targets.
  24. Takahashi Fumiyuki,JPX ; Tsukahara Hiroyuki,JPX ; Oshima Yoshitaka,JPX ; Nishiyama Youji,JPX ; Fuse Takashi,JPX, Method for inspecting height, and a height inspection apparatus to carry out the method.
  25. Greisz Mark J., Method for marking workpieces.
  26. Mei, Zequn, Method of making lead-free solder and solder paste with improved wetting and shelf life.
  27. Beaty,Elwin M.; Mork,David P., Method of manufacturing electronic components including a method for three dimensional inspection.
  28. Beaty Elwin M. ; Mork David P., Process for three dimensional inspection of electronic components.
  29. Schelinski,Uwe; Scholles,Michael; Wolter,Alexander, Scanner and method for operating a scanner.
  30. Gokturk,Salih Burak; Rafii,Abbas, Subject segmentation and tracking using 3D sensing technology for video compression in multimedia applications.
  31. Liu, Lifeng; Wallack, Aaron S.; Marrion, Cyril C., System and method for finding correspondence between cameras in a three-dimensional vision system.
  32. Liu, Lifeng; Wallack, Aaron S.; Marrion, Jr., Cyril C.; Michael, David J., System and method for finding correspondence between cameras in a three-dimensional vision system.
  33. Beaty Elwin M. ; Mork David P., Three dimensional inspection system.
  34. Svetkoff Donald J. ; Rohrer Donald K. ; Kelley Robert W., Triangulation-based 3-D imaging and processing method and system.
  35. Downes Stuart D., Verification gauge for an electronic package lead inspection apparatus.
  36. Stuart D. Downes, Verification gauge for an electronic package lead inspection apparatus.
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