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Method for controlling configuration of laser induced breakdown and ablation 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/02
출원번호 US-0224961 (1994-04-08)
발명자 / 주소
  • Mourou Gerard A. (Ann Arbor MI) Du Detao (Ann Arbor MI) Dutta Subrata K. (Ann Arbor MI) Elner Victor (Ann Arbor MI) Kurtz Ron (Ann Arbor MI) Lichter Paul R. (Ann Arbor MI) Liu Xinbing (Ann Arbor MI)
출원인 / 주소
  • The Regents of the University of Michigan (Ann Arbor MI 02)
인용정보 피인용 횟수 : 365  인용 특허 : 0

초록 ▼

In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at leas

대표청구항 ▼

A method for laser induced breakdown (LIB) of a material with a pulsed laser beam, the material being characterized by a relationship of fluence breakdown threshold versus laser pulse width that exhibits a rapid and distinct change in slope at a characteristic laser pulse width, said method comprisi

이 특허를 인용한 특허 (365)

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  142. Groen, Cale E.; Koch, Justin Lee; White, William E., Laser-induced plasma micromachining.
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  143. Kurtz, Ronald M., Laser-induced protection shield in laser surgery.
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  144. Schroeder, Joseph F.; Streltsov, Alexander, Laser-written cladding for waveguide formations in glass.
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  145. Myers, Raymond I., Lenticular refractive surgery of presbyopia, other refractive errors, and cataract retardation.
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  146. Klimov,Igor; Ammann,Hubert, Light pulse generating apparatus and method.
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  147. Frey, Rudolph W.; Bott, Steven E.; Porter, Gerrit N., Liquid filled index matching device for ophthalmic laser procedures.
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  148. Koo, Il-Gyo; Choi, Myeong Yeol; Collins, Jeremiah H.; Moore, Cameron A.; Rahman, Abdur; Collins, George J., Liquid-gas interface plasma device.
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  149. Koo, Il-Gyo; Collins, George J., Liquid-gas interface plasma device.
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  150. Stoltz,Richard; Bullington,Jeff, Man-portable optical ablation system.
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  151. Hoff, Paul; Ronning, Donald, Method and apparatus for controlled laser ablation of material.
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  152. Liu,Kuo Ching, Method and apparatus for cutting devices from substrates.
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  153. Xinbing Liu ; Ming Li, Method and apparatus for drilling holes with sub-wavelength pitch with laser.
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  154. Gaissinsky, Grigory; Kopelev, Victor; Kopelev, Stella; Oshemkov, Sergey; Guletsky, Nikolay; Dmitriev, Vladimir, Method and apparatus for generating color images in a transparent medium.
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  155. Stuart Brent C. ; Nguyen Hoang T. ; Perry Michael D., Method and apparatus for improving the quality and efficiency of ultrashort-pulse laser machining.
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  156. Ehrmann,Jonathan S.; Cordingley,James J.; Smart,Donald V.; Svetkoff,Donald J., Method and apparatus for laser marking by ablation.
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  157. Booth,Timothy J.; Yilmaz,Ismail T.; Brennan, III,James F., Method and apparatus for optical isolation in high power fiber-optic systems.
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  158. Bendett, Mark; Bischoff, Mark; Gerlach, Mario; Muehlhoff, Dirk, Method and apparatus for precision working of an eye.
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  159. Bendett, Mark; Bischoff, Mark; Gerlach, Mario; Muehlhoff, Dirk, Method and apparatus for precision working of material.
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  160. Bendett, Mark; Bischoff, Mark; Gerlach, Mario; Mühlhoff, Dirk, Method and apparatus for precision working of material.
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  161. Bendett,Mark; Bischoff,Mark; Gerlach,Mario; Muehlhoff,Dirk, Method and apparatus for precision working of material.
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  162. Corkum, Paul B.; Dupont, Emmanuel; Liu, Hui Chun; Zhu, Xiaonong, Method and apparatus for repair of defects in materials with short laser pulses.
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  163. Haight, Richard A.; Longo, Peter P.; Wagner, Alfred, Method and apparatus for repair of reflective photomasks.
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  164. Haight,Richard A.; Longo,Peter P.; Wagner,Alfred, Method and apparatus for repair of reflective photomasks.
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  165. Zhang, Haibin; Xu, Qian, Method and apparatus for separation of strengthened glass and articles produced thereby.
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  166. Liu, Jian, Method and apparatus for welding dissimilar material with a high energy high power ultrafast laser.
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  167. Horsting, John James; Hamann, Christoph, Method and apparatus to form dimensionally consistent orifices and chamfers by laser using spatial filters.
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  168. Fournier Gerard Albert Felix,FRX ; Vigneau Joel Olivier Alfred Abel,FRX, Method and device for machining holes or shapes of varying profile using an excimer laser.
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  169. Bestenlehrer Alexander,DEX, Method and device for processing arbitrary 3D shaped surfaces by means of a laser, in particular for polishing and texturing workpieces, and for producing sealing surfaces on dies.
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  170. Lubatschowski, Holger; Ripken, Tammo; Rathjen, Christian, Method and device for the removal of material by means of laser pulses.
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  171. Burrowes,Dirk; Troitski,Igor, Method and laser system for production of laser-induced images inside and on the surface of transparent material.
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  172. Wells, Jonathon D.; Bendett, Mark P.; Savage-Leuchs, Matthias P.; Owen, James M., Method and multiple-mode device for high-power short-pulse laser ablation and CW cauterization of bodily tissues.
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  173. Couch, Bruce L.; Ehrmann, Jonathan S.; Lento, Joseph V.; Johnson, Shepard D., Method and system for high-speed, precise micromachining an array of devices.
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  174. Couch, Bruce L.; Erhmann, Jonathan S.; Chu, Yun Fee; Lento, Joseph V.; Johnson, Shepard D., Method and system for high-speed, precise micromachining an array of devices.
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  175. Couch,Bruce L.; Ehrmann,Jonathan S.; Chu,Yun Fee; Lento,Joseph V.; Johnson,Shepard D., Method and system for high-speed, precise micromachining an array of devices.
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  176. Barron,Wes; Bourliaguet,Bruno; Levesque,Marc; Cournoyer,Alain; Cantin,Daniel; Champagne,Yves, Method and system for laser marking in the volume of gemstones such as diamonds.
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  177. Frey, Rudolph W.; Gray, Gary P., Method and system for measuring an eye.
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  178. Frey, Rudolph W.; Gray, Gary P., Method and system for removal and replacement of lens material from the lens of an eye.
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  179. Troitski, Igor, Method for creating laser-induced color images within three-dimensional transparent media.
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  180. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method for cutting semiconductor substrate.
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  181. Hu, Zhendong; Che, Yong; Liu, Bing, Method for depositing crystalline titania nanoparticles and films.
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  182. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Method for dicing substrate.
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  183. Bischoff, Mark; Stobrawa, Gregor, Method for eye surgery.
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  184. Hunt, Alan J.; Mourou, Gerald; Joglekar, Ajit P.; Meyhofer, Edgar; Nees, John A.; Spooner, Greg, Method for forming nanoscale features.
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  185. Hunt,Alan J.; Mourou,Gerard; Joglekar,Ajit P.; Meyhofer,Edgar; Nees,John A.; Spooner,Greg, Method for forming nanoscale features.
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  186. Bischoff, Mark; Stobrawa, Gregor, Method for generating control data for eye surgery, and eye-surgical treatment device and method.
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  187. Lei, Weisheng; Simenson, Glenn; Matsumoto, Hisashi; Davignon, John, Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses.
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  188. Vogel, Alfred; Linz, Norbert; Freidank, Sebastian, Method for laser machining transparent materials.
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  189. Hayashi, Kenichi, Method for making marks in a transparent material by using a laser.
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  190. Kenichi Hayashi JP, Method for making marks in a transparent material by using a laser.
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  191. Kenichi Hayashi JP, Method for making marks in a transparent material by using a laser.
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  192. Kenichi Hayashi JP, Method for making marks in a transparent material by using a laser.
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  193. Tamemoto, Hiroaki, Method for manufacturing semiconductor element.
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  194. Haight, Richard Alan; Longo, Peter P.; Morris, Daniel Peter; Wagner, Alfred, Method for minimizing sample damage during the ablation of a first biological material disposed on a second biological material using a focused ultrashort pulsed laser beam wherein the slope of fluence breakdown is a function of the pulse width.
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  195. Haight Richard Alan ; Longo Peter P. ; Morris Daniel Peter ; Wagner Alfred, Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam.
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  196. Haight, Richard Alan; Longo, Peter P.; Morris, Daniel Peter; Wagner, Alfred, Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed laser beam.
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  197. Sun, Yunlong; Swenson, Edward J.; Harris, Richard S., Method for processing a memory link with a set of at least two laser pulses.
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  198. Bischoff, Mark; Hacker, Martin; Sauerbrey, Roland; Stobrawa, Gregor; Ziegler, Wolfgang, Method for processing materials with laser pulses having a large spectral bandwidth.
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  199. Kl？gl,Wendelin; Kull,Eberhard; Schmutzler,Gerd, Method for producing a hole in a body, specifically an injection hole in a fuel injector.
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  200. Yoo, Jong Hyun; Bol'shakov, Alexander A., Method for real-time optical diagnostics in laser ablation and laser processing of layered and structured materials.
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  201. Bor, Zsolt; Zadoyan, Ruben; Bouvier, Marcel; Holland, Guy V, Method for scanning a pulsed laser beam.
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  202. Raksi, Ferenc; Zadoyan, Ruben; Bouvier, Marcel; Holland, Guy V., Method for scanning a pulsed laser beam.
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  203. Lei, Weisheng; Matsumoto, Hisashi; Hardy, Gregg; Sun, Yunlong, Method of and apparatus for laser drilling holes with improved taper.
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  204. Tadashi Koyama JP; Keiji Tsunetomo JP; Masahiro Oikawa JP; Kenjiro Hamanaka JP, Method of changing the surface of a glass substrate containing silver, by using a laser beam.
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  205. Trollsas, Mikael; Ngo, Michael H.; Anukhin, Boris; Nikanorov, Alexander; Hossainy, Syed; Papp, John E.; Jayasinghe, Dudley; Solter, Zella, Method of crimping stent on catheter delivery assembly.
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  206. Trollsas, Mikael; Ngo, Michael H.; Anukhin, Boris; Nikanorov, Alexander; Hossainy, Syed; Papp, John E.; Jayasinghe, Dudley; Solter, Zella, Method of crimping stent on catheter delivery assembly.
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  207. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate and method of manufacturing a semiconductor device.
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  208. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device.
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  209. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device.
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  210. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a wafer-like object and semiconductor chip.
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  211. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting an object to be processed.
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  212. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting an object to be processed.
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  213. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting object to be processed.
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  214. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting processed object.
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  215. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method of cutting semiconductor substrate.
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  216. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method of cutting semiconductor substrate.
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  217. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion.
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  218. Roos,Edward Victor; Roeske,Franklin; Lee,Ronald S.; Benterou,Jerry J., Method of defining features on materials with a femtosecond laser.
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  219. Liu, Xinbing, Method of determining a minimum pulse width for a short pulse laser system.
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  220. Chism, II, William W., Method of direct Coulomb explosion in laser ablation of semiconductor structures.
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  221. Jun Wang JP; Hiroyuki Niino JP; Akira Yabe JP, Method of etching transparent solid material with laser beam.
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  222. Che, Yong; Hu, Zhendong, Method of fabricating an electrochemical device using ultrafast pulsed laser deposition.
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  223. Dugan, Mark; Clark, William; Said, Ali A.; Maynard, Robert L.; Bado, Philippe, Method of index trimming a waveguide and apparatus formed of the same.
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  224. Trollsas, Mikael; Ngo, Michael H.; Anukhin, Boris; Nikanorov, Alexander; Hossainy, Syed; Papp, John E.; Jayasinghe, Dudley; Solter, Zella, Method of making a stent.
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  225. Yang, Shih-Sheng, Method of making pattern for decorative piece.
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  226. Wu, Patrick P., Method of making stents with radiopaque markers.
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  227. Wu, Patrick P., Method of making stents with radiopaque markers.
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  228. Zadoyan, Ruben; Karavitis, Michael; Kurtz, Ronald M., Method of making sub-surface photoalterations in a material.
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  229. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of manufacturing a semiconductor device formed using a substrate cutting method.
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  230. Bischoff, Mark; Hacker, Martin; Sauerbrey, Roland; Stobrawa, Gregor; Ziegler, Wolfgang, Method of material processing with laser pulses having a large spectral bandwidth and apparatus for carrying out said method.
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  231. Momma Carslen,DEX ; Nolte Siefan,DEX ; Alvensleben Ferdinand von,DEX ; Bolz Armin,DEX, Method of producing microstructural medical implants.
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  232. Lei, Weisheng; Simenson, Glenn; Howerton, Jeff; Unrath, Mark, Method of providing consistent quality of target material removal by lasers having different output performance characteristics.
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  233. Wu, Patrick P., Method of removing stent islands from a stent.
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  234. Wachter,Eric A.; Fisher,Walter G.; Smolik,John T., Methods and apparatus for multi-photon photo-activation of therapeutic agents.
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  235. Stegmann, Heiko, Methods and apparatus for the preparation of microscopy samples by using pulsed light.
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  236. Clowes, John Redvers; Almeida, Paulo; Grudinin, Anatoly Borisovich; Dupriez, Pascal; Codemard, Christophe, Methods and apparatus pertaining to picosecond pulsed fiber based lasers.
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  237. Cordingley, James J.; Ehrmann, Jonathan S.; Filgas, David M.; Johnson, Shepard D.; Lee, Joohan; Smart, Donald V.; Svetkoff, Donald J., Methods and systems for thermal-based laser processing a multi-material device.
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  238. Cordingley, James J.; Ehrmann, Jonathan S.; Filgas, David M.; Johnson, Shepard D.; Lee, Joohan; Smart, Donald V.; Svetkoff, Donald J., Methods and systems for thermal-based laser processing a multi-material device.
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  239. Cordingley,James J.; Ehrmann,Jonathan S.; Filgas,David M.; Johnson,Shepard D.; Lee,Joohan; Smart,Donald V.; Svetkoff,Donald J., Methods and systems for thermal-based laser processing a multi-material device.
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  240. Cordingley,James J.; Ehrmann,Jonathan S.; Griffiths,Joseph J.; Johnson,Shepard D.; Lee,Joohan; Smart,Donald V.; Svetkoff,Donald J., Methods and systems for thermal-based laser processing a multi-material device.
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  241. Gaudiosi, David; Vaissie, Laurent, Methods and systems for trimming circuits.
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  242. Vaissié, Laurent, Methods and systems for trimming circuits.
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  243. Forsman, Andrew C.; Johnson, Billy L.; Lundgren, Erik H.; Bertch, Timothy C.; Moeller, Charles P.; Carmichael, James A., Methods and systems for use in laser machining.
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  244. Grenon Brian J. ; Haight Richard A. ; Hayden Dennis M. ; Hibbs Michael S. ; Levin J. Peter ; Neary Timothy E. ; Rochefort Raymond E. ; Schmidt Dennis A. ; Smolinski Jacek G. ; Wagner Alfred, Methods for repair of photomasks.
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  245. Grenon Brian J. ; Haight Richard A. ; Hayden Dennis M. ; Hibbs Michael S. ; Levin J. Peter ; Neary Timothy E. ; Rochefort Raymond E. ; Schmidt Dennis A. ; Smolinski Jacek G. ; Wagner Alfred, Methods for repair of photomasks.
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  246. Zhang, Haibin; Xu, Qian, Methods for separation of strengthened glass.
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  247. Thomas, James W.; Cargill, Robert L.; Wool, Mitchell R., Methods for stripping and modifying surfaces with laser-induced ablation.
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  248. Lei, Weisheng; Simenson, Glenn; Matsumoto, Hisashi; Davignon, John, Micromachining with short-pulsed, solid-state UV laser.
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  249. Vockrodt, Jason; Hansen, Matthew; Klingbeil, Kevin, Modeling of laser output from a pulsed laser to achieve a consistent cutting process.
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  250. Chen, Li; Von Oepen, Randolf, Multiple beam laser system for forming stents.
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  251. Chen, Li; Von Oepen, Randolf, Multiple beam laser system for forming stents.
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  252. Chen, Li; Von Oepen, Randolf, Multiple beam laser system for forming stents.
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  253. Chen, Li; von Oepen, Randolf, Multiple beam laser system for forming stents.
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  254. Chen, Li; von Oepen, Randolf, Multiple beam laser system for forming stents.
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  255. Lei, Weisheng; Sun, Yunlong; Osako, Yasu; Davignon, John; Simenson, Glenn; Matsumoto, Hisashi, Multiple laser wavelength and pulse width process drilling.
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  256. Wells, Jonathan D.; Bendett, Mark P.; Savage-Leuchs, Matthias P.; Owen, James M., Multiple-mode device for high-power short-pulse laser ablation and CW cauterization of bodily tissues.
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  257. Wells, Jonathon D.; Bendett, Mark P.; Savage-Leuchs, Matthias P.; Owen, James M., Multiple-mode device for high-power short-pulse laser ablation and CW cauterization of bodily tissues.
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  258. Goldshleger, Ilya; Holland, Guy; Raksi, Ferenc, Optical coherence tomographic system for ophthalmic surgery.
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  259. Smithson, Robert Leland Wee; Hill, Jeffrey Bruce; Le Blanc, Stephen Paul, Optical fiber or waveguide lens.
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  260. Raksi, Ferenc, Optical system for ophthalmic surgical laser.
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  261. Raksi, Ferenc; Buck, Jesse, Optical system for ophthalmic surgical laser.
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  262. Raksi, Ferenc; Buck, Jesse, Optical system for ophthalmic surgical laser.
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  263. Raksi, Ferenc; Buck, Jesse, Optical system for ophthalmic surgical laser.
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  264. Raksi, Ferenc; Buck, Jesse, Optical system for ophthalmic surgical laser.
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  265. Raksi, Ferenc; Buck, Jesse, Optical system with movable lens for ophthalmic surgical laser.
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  266. Raksi, Ferenc; Buck, Jesse, Optical system with multiple scanners for ophthalmic surgical laser.
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  267. Sun, Yunlong; Hainsey, Robert F.; Sun, Lei, Passivation processing over a memory link.
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  268. Richard, Jenkin A.; Benerofe, Steven J.; Chamness, Eric V.; Guan, George H., Passive connectivity of waveguides for optical components.
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  269. Raksi, Ferenc, Patient interface defogger.
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  270. Raksi, Ferenc; Goldshleger, Ilya, Patient interface with variable applanation.
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  271. Raksi, Ferenc, Photodisruptive laser fragmentation of tissue.
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  272. Kurtz, Ronald M.; Raksi, Ferenc; Goldstein, Peter, Photodisruptive laser treatment of the crystalline lens.
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  273. Shinohara, Wataru, Photoelectric converter device and method for its manufacture.
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  274. Liu, Xinbing; Li, Ming, Photonic crystal formed by laser machining and having holes with sub-wavelength pitch.
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  275. Wottke, Matthias; Narr, Andre; Reinstein, Dan Z., Planning system and procedure for eye surgery.
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  276. Anukhin, Boris; Ngo, Michael H.; Trollsas, Mikael; Hossainy, Syed; Papp, John, Polymer scaffolds having a low crossing profile.
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  277. Gaudiosi, David; Greenberg, Michael; Mielke, Michael; Booth, Tim; Masor, Gordon, Polymer tubing laser micromachining.
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  278. Stoltz, Richard; Bullington, Jeff, Portable optical ablation system.
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  279. Vaissi？,Laurent; Brennan, III,James Francis, Post amplification optical isolator.
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  280. Kurtz, Ronald M.; Raksi, Ferenc; Karavitis, Michael, Precise targeting of surgical photodisruption.
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  281. Kurtz, Ronald M.; Raksi, Ferenc; Karavitis, Michael, Precise targeting of surgical photodisruption.
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  282. Kurtz, Ronald M.; Raksi, Ferenc; Karavitis, Michael, Precise targeting of surgical photodisruption.
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  283. Kononchuk, Oleg, Process for treating a structure.
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  284. Sun, Yunlong; Swenson, Edward J.; Harris, Richard S., Processing a memory link with a set of at least two laser pulses.
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  285. Sun,Yunlong; Swenson,Edward J.; Harris,Richard S., Processing a memory link with a set of at least two laser pulses.
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  286. Papastathopoulos, Evangelos; Stobrawa, Gregor; Bischoff, Mark, Producing cut surfaces in a transparent material by means of optical radiation.
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  287. Ichikawa, Yuki; Hu, Zhengong; Liu, Bing; Che, Yong, Production of fine particles of functional ceramic by using pulsed laser.
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  288. Yamamoto,Tadashi; Harter,Donald J.; Patel,Rajesh S.; Arai,Alan Y., Pulsed laser processing with controlled thermal and physical alterations.
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  289. Frey, Rudolph W.; Bott, Steven E., Purkinjie image-based alignment of suction ring in ophthalmic applications.
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  290. Bischoff, Mark; Muehlhoff, Dirk; Stobrawa, Gregor, Re-treatment for ophthalmic correction of refraction.
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  291. Bischoff, Mark; Muehlhoff, Dirk; Stobrawa, Gregor, Re-treatment for ophthalmic correction of refraction.
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  292. Bischoff, Mark; Muehlhoff, Dirk; Stobrawa, Gregor, Re-treatment for ophthalmic correction of refraction.
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  293. Flanigan, Philip S.; Hayden, Dennis M.; Hibbs, Michael S.; Neary, Timothy E., Repair of masks to promote adhesion of patches.
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  294. Pacetti, Stephen; Bei, Joan; Wang, Karen; Liu, Annie, Scaffolds having radiopaque markers.
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  295. Liu, Kuo-Ching; Fang, Pei Hsien; Dere, Dan; Liu, Jenn; Huang, Jih-Chuang; Lucero, Antonio; Pinkham, Scott; Oltrogge, Steven; Middlebusher, Duane, Scribing sapphire substrates with a solid state UV laser.
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  296. Liu, Kuo-Ching; Fang, Pei Hsien; Dere, Daniel J.; Liu, Jenn; Huang, Jih-Chuang; Lucero, Antonio; Pinkham, Scott; Oltrogge, Steven; Middlebusher, Duane, Scribing sapphire substrates with a solid state UV laser with edge detection.
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  297. Bergt, Michael; Stobrawa, Gregor, Sectioning a transparent material using optical radiation.
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  298. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Semiconductor chip manufacturing method.
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  299. Tamemoto, Hiroaki, Semiconductor element.
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  300. Stoltz,Richard, Semiconductor manufacturing using optical ablation.
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  301. Fukumitsu, Kenshi; Fukuyo, Fumitsugu; Uchiyama, Naoki; Sugiura, Ryuji; Atsumi, Kazuhiro, Semiconductor substrate cutting method.
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