초록 ▼

A clip assembly for retaining a semiconductor wafer on a pedestal during processing of the wafer, and releasing the wafer for removal from the pedestal after processing, includes a pair of tines each having a lower sloping surface for contacting an edge of an associated semiconductor wafer, and a le

A clip assembly for retaining a semiconductor wafer on a pedestal during processing of the wafer, and releasing the wafer for removal from the pedestal after processing, includes a pair of tines each having a lower sloping surface for contacting an edge of an associated semiconductor wafer, and a ledge provided immediately above the lower sloping surface inward from a shared leading edge serves to catch debris or particulate material, preventing it from falling onto the surface of the semiconductor wafer. A metal spring, biasing the clip head into contact with the wafer, has an upper portion molded into the electrically non-conductive material of the clip head behind a front face thereof, whereby the spring and clip head form a monolithic assembly.

대표청구항 ▼

A retention clip apparatus for removably securing a semiconductor wafer on a pedestal, said clip apparatus comprising: a clip head including: a rearmost depression tab; at least a first tine at a frontmost portion of said clip head, said first tine including a lower front face downwardly sloping fro

A retention clip apparatus for removably securing a semiconductor wafer on a pedestal, said clip apparatus comprising: a clip head including: a rearmost depression tab; at least a first tine at a frontmost portion of said clip head, said first tine including a lower front face downwardly sloping from a front leading edge toward said depression tab, said lower front face providing a surface for contacting an associated semiconductor wafer, an upper front face downwardly sloping from a top surface toward said front leading edge and joined thereto; a lower front face above which said first tine projects away from and outward; a base member; and spring bias means having a portion of one end monolithically molded into material of said clip head proximate said lower front face thereof, and another end secured to said base member, for biasing said clip head toward an associated said semiconductor wafer.