$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Thermal conductivity sheet

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-009/00
출원번호 US-0393007 (1995-04-03)
국제출원번호 PCT/JP93/00929 (1993-07-06)
§371/§102 date 19950403 (19950403)
국제공개번호 WO-9502313 (1995-01-19)
발명자 / 주소
  • Fujimori Yoshinori (Tokyo JPX) Momma Jun (Yokohama JPX) Sasaki Tomiya (Yokohama JPX) Iwasaki Hideo (Kawasaki JPX) Sakamoto Toshiya (Yokohama JPX) Endo Hiroshi (Yokohama JPX) Hisano Katsumi (Yokohama
출원인 / 주소
  • Kabushiki Kaisha Toshiba (Kawasaki JPX 03)
인용정보 피인용 횟수 : 91  인용 특허 : 0

초록

A thermal conductivity sheet is provided which is superior all in heat radiating characteristics (thermal conductivity) in the direction of sheet thickness, close-contact with respect to parts to be cooled, and electrical insulation. In a thermal conductivity sheet 1 in which a plurality of highly t

대표청구항

A thermal conductivity sheet in which a plurality of thermally conductive insulators, each insulator having two end faces, and are continuously interconnected through a flexible matrix insulator, wherein only a portion of said thermally conductive insulators are arranged obliquely in the direction o

이 특허를 인용한 특허 (91)

  1. Clere, Thomas M., Agglomerated hexagonal boron nitride powders, method of making, and uses thereof.
  2. Hardin, Randall; Keihl, John; Lytle, Duane, Anchoring inserts, electrode assemblies, and plasma processing chambers.
  3. Hardin, Randall; Keihl, Jonathan; Lytle, Duane, Anchoring inserts, electrode assemblies, and plasma processing chambers.
  4. Horiuchi Michio,JPX ; Muramatsu Shigetsugu,JPX, Anisotropic stress buffer and semiconductor device using the same.
  5. Shaddock, David Mulford; Tao, Deng; De Bock, Hendrik Pieter Jacobus; Zhong, Dalong; Eastman, Christopher Michael; Durocher, Kevin Matthew; Weaver, Jr., Stanton Earl, Article including thermal interface element and method of preparation.
  6. Pruss, Eugene A.; Clere, Thomas M., Boron nitride agglomerated powder and devices comprising the powder.
  7. Houle, Sabina J.; Koning, Paul A.; Chrysler, Greg M., Carbon-carbon and/or metal-carbon fiber composite heat spreader.
  8. Sabina J. Houle ; Paul A. Koning ; Greg M. Chrysler, Carbon-carbon and/or metal-carbon fiber composite heat spreader.
  9. Houle, Sabina J.; Koning, Paul A.; Chrysler, Greg M., Carbon-carbon and/or metal-carbon fiber composite heat spreaders.
  10. Houle,Sabina J.; Koning,Paul A.; Chrysler,Greg M., Carbon-carbon and/or metal-carbon fiber composite heat spreaders.
  11. Hill, Richard F.; Smythe, Robert Michael, Compliant multilayered thermally-conductive interface assemblies.
  12. Gungor Mehmet N. ; Gardner ; Jr. J. Donald ; Larimer William R., Composite substrate carrier for high power electronic devices.
  13. Chung, Deborah Duen Ling, Conformable interface materials for improving thermal contacts.
  14. Craig G. Heim ; Wade Leslie Hooker ; Ajit Kumar Trivedi, Cooling method for electronic components.
  15. Heim Craig G. ; Hooker Wade Leslie ; Trivedi Ajit Kumar, Cooling structure for electronic components.
  16. Reis, Bradley E.; Smalc, Martin David; Laser, Brian J.; Kostyak, Gary Stephen; Skandakumaran, Prathib; Getz, Matthew G.; Frastaci, Michael, Cycling LED heat spreader.
  17. Reis,Bradley E.; Smalc,Martin David; Laser,Brian J.; Kostyak,Gary Stephen; Skandakumaran,Prathib; Getz,Matthew G.; Frastaci,Michael, Cycling LED heat spreader.
  18. Chrysler, Gregory M.; Maveety, James G., Die having a via filled with a heat-dissipating material.
  19. Daly, Phillip F.; Vanden Bussche, Kurt M., Efficient self cooling heat exchanger.
  20. Sagal, E. Mikhail; Panek, Jeffrey; McCullough, Kevin A., Elastomeric heat sink with a pressure sensitive adhesive backing.
  21. Kita,Yukinori, Electric junction box.
  22. Patrick, Roger; Dhindsa, Raj; Bettencourt, Greg; Marakhtanov, Alexei, Electrode assembly and plasma processing chamber utilizing thermally conductive gasket.
  23. Patrick, Roger; Dhindsa, Raj; Bettencourt, Greg; Marakhtanov, Alexei, Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings.
  24. Wang Chia-Hua,TWX ; Ho Ming-Che,TWX ; Chuans Wen-Shan,TWX, Evenly heat-dissipating apparatus.
  25. Kuribayashi Eiichirou,JPX ; Nishida Keigo,JPX ; Ohnari Yoshihide,JPX, Film distinguished in coriona resistant characteristic and insulated wires, coils and motors comprising the film as an insulation material.
  26. McCullough, Kevin A.; Sagal, E. Mikhail; Miller, James D., Flexible glove-like heat sink.
  27. Fletcher,R. David; Chen,Yunquan, Flexible heat exchangers for medical cooling and warming applications.
  28. McCutcheon, Jeffrey W.; Narum, Timothy N.; Soo, Philip P.; Liu, Yaoqi J., Flexible heat sink.
  29. McCutcheon,Jeffrey W.; Narum,Timothy N.; Soo,Philip P.; Liu,Yaoqi J., Flexible heat sink.
  30. Krassowski, Daniel W.; Chen, Gary G., Heat dissipating component using high conducting inserts.
  31. Yamaguchi, Yoshitaka; Iwai, Taisuke; Hirose, Shinichi; Kondo, Daiyu; Soga, Ikuo; Yagishita, Yohei; Sakita, Yukie, Heat radiation material, electronic device and method of manufacturing electronic device.
  32. Zhu, Xi-Jian; Lin, Ran, Heat sink and electronic device using same.
  33. Reis,Bradley E.; Smalc,Martin David; Laser,Brian J.; Kostyak,Gary Stephen; Skandakumaran,Prathib; Getz,Matthew G.; Frastaci,Michael, Heat spreaders with vias.
  34. Reis, Bradley E.; Cartiglia, James R., Heat spreading circuit assembly.
  35. Thompson, Alex; Ward, Terence G., Heat transfer plate.
  36. Tokuhira, Hideshi; Date, Hiroaki; Uchida, Hiroki; Ishinabe, Minoru, Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body.
  37. Faybishenko,Victor; Burfield,Ashley, Heat-transfer interface device between a source of heat and a heat-receiving object.
  38. Pujari, Vimal K.; Collins, William T.; Kutsch, Jeffrey J., High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them.
  39. Pujari, Vimal K.; Collins, William T.; Kutsch, Jeffrey J.; Clere, Thomas M.; Pruss, Eugene A., High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them.
  40. Pujari, Vimal K.; Collins, William T.; Kutsch, Jeffrey J., High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them.
  41. Clere, Thomas M.; Labour?, S?verine M., Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof.
  42. McCullough, Kevin A.; Miller, James D.; Sagal, Mikhail, Injection moldable elastomeric gasket.
  43. Unger Scott M. ; Riddle Guy T., Integrated circuit heat transfer element and method.
  44. Unger Scott M. ; Riddle Guy T., Integrated circuit subassembly with thermally anisotropic heat transfer element.
  45. Reis,Bradley E.; Cartiglia,James R., LED with integral via.
  46. Yu, Hung-Ta, Light bar and backlight module.
  47. Hill, Richard F.; Smythe, Robert Michael, Memory modules including compliant multilayered thermally-conductive interface assemblies.
  48. Ji, Sunny, Metal earpad.
  49. Clere, Thomas M., Method for making high thermal diffusivity boron nitride powders.
  50. Clere,Thomas M., Method for making high thermal diffusivity boron nitride powders.
  51. McCullough,Kevin A., Method of applying phase change thermal interface materials.
  52. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Simons,Robert E., Method of fabrication for a thermal spreader using thermal conduits.
  53. Bootle John D. ; Burzesi Frank, Method of making thermal core material and material so made.
  54. Foster, Jon S., Method of manufacturing athermally conductive drive belt.
  55. Chrysler, Gregory M.; Maveety, James G., Micro-chimney and thermosiphon die-level cooling.
  56. McCullough, Kevin A.; Sagal, E. Mikhail; Miller, James D., Overplated thermally conductive part with EMI shielding.
  57. McCullough, Kevin A., Print thermally conductive interface assembly.
  58. Hwang,Ming Hang; Cheng,Yu Chiang; Chen,Chao Yi; Kuo,Hsin Lung; Lee,Bin Wei; Hsiao,Wei Chung, Printed circuit board structure and manufacturing method thereof.
  59. Iwai, Taisuke; Kondo, Daiyu; Yamaguchi, Yoshitaka; Soga, Ikuo; Hirose, Shinichi, Sheet structure and method of manufacturing sheet structure.
  60. Chiu, Chia-Pin; Shipley, James C.; Simmons, Craig B., Short carbon fiber enhanced thermal grease.
  61. Bettencourt, Greg; Dhindsa, Raj; Diercks, George; Hardin, Randall A.; Keihl, Jon; Lytle, Duane; Marakhtanov, Alexei; Patrick, Roger; Pegg, John; Spencer, Shannon, Showerhead electrode assemblies and plasma processing chambers incorporating the same.
  62. Stevenson, Tom; Dhindsa, Rajinder, Showerhead electrode assemblies for plasma processing apparatuses.
  63. Stevenson, Tom; Dhindsa, Rajinder, Showerhead electrode assemblies for plasma processing apparatuses.
  64. Bettencourt, Greg; Dhindsa, Raj; Diercks, George; Hardin, Randall A.; Keihl, Jon; Lytle, Duane; Marakhtanov, Alexei; Patrick, Roger; Pegg, John; Spencer, Shannon, Showerhead electrodes.
  65. Grip, Robert E.; Rawdon, Blaine K.; Jalewalia, Gurpreet S., Structurally isolated thermal interface.
  66. Panek, Jeffrey, Structure and method of attaching a heat transfer part having a compressible interface.
  67. Yang,Wen Kun; Yang,Wen Pin, Structure of image sensor module and a method for manufacturing of wafer level package.
  68. Dhindsa, Rajinder, Temperature controlled hot edge ring assembly.
  69. Oda, Takuya, Thermal conductive member, manufacturing method of the thermal conductive member, heat radiating component, and semiconductor package.
  70. Misra, Sanjay, Thermal diffusion apparatus.
  71. Merrill, Natalie A.; Delano, Andrew D.; Steele, David E., Thermal interface material and method of making and using the same.
  72. Merrill, Natalie; Delano, Andrew; Steele, David, Thermal interface material and method of making and using the same.
  73. Rauch, Robert A., Thermal interface wafer and method of making and using the same.
  74. Rauch, Robert A., Thermal interface wafer and method of making and using the same.
  75. Rauch,Robert A., Thermal interface wafer and method of making and using the same.
  76. Ferru, Gilles, Thermal isolation of electronic devices in submount used for LEDs lighting applications.
  77. Choong-Un Kim ; Seung-Mun You, Thermal joint and method of use.
  78. Jewram, Radesh; Misra, Sanjay, Thermally and electrically conductive interconnect structures.
  79. Foster, Jon S., Thermally conductive drive belt.
  80. Sagal, E. Mikhail, Thermally conductive elastomeric heat dissipation assembly with snap-in heat transfer conduit.
  81. Macpherson, Aaron Steve; Kant, Rishi; Kelsic, Gary F., Thermally conductive overmold for a disc drive actuator assembly.
  82. McCullough, Kevin A., Thermally conductive silk-screenable interface material.
  83. McCullough, Kevin A., Thermally conductive silk-screenable interface material.
  84. Zhuo Qizhuo ; Harris Ronald M. ; Skovran Dennis C. ; Lightner Leo F. ; Randall Michael S. ; Stygar Vernon E., Thermally conductive thermoplastic.
  85. Chandrakant M. Yagnik ; Roy E. Barth ; R. Knox Pitzer, Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof.
  86. Yagnik, Chandrakant M.; Barth, Roy E.; Pitzer, R. Knox, Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof.
  87. Yagnik,Chandrakant M.; Barth,Roy E.; Pitzer,R. Knox, Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof.
  88. Xu, Zhiyue; Yu, Chengjiao; Zhao, Lei; Wang, Ke, Ultrahigh temperature elastic metal composites.
  89. White, Joseph M.; Delano, Andrew D., Variable height thermal interface.
  90. Yuasa,Mitsuhiro; Enjoji,Keiichi; Homma,Koji, Wafer supporter.
  91. Takamatsu, Tomonao; Hattori, Hitoshi; Iwasaki, Hideo; Fukushima, Harunobu; Hosaka, Rika; Jimbo, Tomohiko; Sadotomo, Tetsuya; Harada, Tomokazu; Ota, Satoshi; Nakano, Makoto; Shindo, Yasutaka; Gotanda, Katsumi, X-ray computed tomographic apparatus.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트