$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Substrate processing apparatus and substrate processing method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G03D-005/00
  • G03D-003/08
출원번호 US-0594937 (1996-01-31)
우선권정보 JP-0039254 (1995-02-02); JP-0046413 (1995-02-09)
발명자 / 주소
  • Ohkura Jun (Kumamoto JPX) Iida Naruaki (Kumamoto JPX) Kudou Hiroyuki (Kumamoto-ken JPX) Tateyama Masanori (Kumamoto JPX) Sakamoto Yasuhiro (Kumamoto-ken JPX)
출원인 / 주소
  • Tokyo Electron Limited (Tokyo JPX 03)
인용정보 피인용 횟수 : 81  인용 특허 : 11

초록

A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y

대표청구항

A substrate processing apparatus for performing a plurality of processes to a substrate comprising: a common path, extending in a Y-axis direction, in which one substrate or a plurality of substrates are conveyed; a plurality of process units stacked on both sides of said common path to constitute m

이 특허에 인용된 특허 (11)

  1. Ushijima Mitsuru (Tama JPX) Akimoto Masami (Kikuyo JPX), Apparatus for coating a photo-resist film and/or developing it after being exposed.
  2. Ushijima Mitsuru (Tokyo JPX) Akimoto Masami (Kikuchi JPX), Apparatus for coating a photo-resist film and/or developing it after being exposed.
  3. Brickell Christopher G. (Mukilteo WA) Langland Kenneth A. (Seattle WA), Apparatus for detecting proper positioning of objects in a holder.
  4. Akimoto Masami (Kumamoto JPX) Yoshioka Kazutoshi (Kumamoto JPX) Iida Naruaki (Kumamoto JPX), Apparatus for processing wafer-shaped substrates.
  5. Orgami Nobutoshi (Kyoto JPX) Fukutomi Yoshiteru (Kyoto JPX), Method of heat treating a substrate with standby and treatment time periods.
  6. Akimoto Masami (Kikuyo JPX) Kimura Yoshio (Kumamoto JPX) Hirakawa Osamu (Kumamoto JPX) Anai Noriyuki (Kumamoto JPX) Tateyama Masanori (Kumamoto JPX) Sakamoto Yasuhiro (Kumamoto JPX), Resist process apparatus.
  7. Tateyama Kiyohisa (Kumamoto) Akimoto Masami (Kumamoto) Ushijima Mitsuru (Tama JPX), Resist process system.
  8. Tateyama Kiyohisa (Kumamoto JPX) Akimoto Masami (Kumamoto JPX) Ushijima Mitsuru (Tama JPX), Resist processing method.
  9. Tateyama Kiyohisa (Kumamoto JPX) Akimoto Masami (Kumamoto JPX) Ushijima Mitsuru (Tama JPX), Resist processing method.
  10. Blackwood Robert S. (Lubbock TX) Vaughn David R. (Lubbock TX) Masten Billy R. (Shallowater TX) Vaughn Timothy B. (Lubbock TX), Substrate location and detection apparatus.
  11. Yoshioka Kazutoshi (Kamoto JPX) Yokomizo Kenji (Kumamoto JPX) Akimoto Masami (Kumamoto JPX) Yoshimoto Yuji (Kikuchi JPX), Transportation-transfer device for an object of treatment.

이 특허를 인용한 특허 (81)

  1. Iwatsu Haruo,JPX, Accommodating apparatus and substrate processing system.
  2. Harvey Danial D., Anti-wafer breakage detection system.
  3. Harvey Danial D., Anti-wafer breakage detection system.
  4. Emami, Ramin, Apparatus and method for edge bead removal.
  5. Hideya Tanaka JP; Kenichi Miyamoto JP; Minoru Kubota JP; Walter Swanson JP, Apparatus and method for washing substrate.
  6. Tanaka Hideya,JPX ; Miyamoto Kenichi,JPX ; Kubota Minoru,JPX ; Swanson Walter,JPX, Apparatus and method for washing substrate.
  7. Kimura Yoshio,JPX ; Ueda Issei,JPX, Apparatus for processing a substrate.
  8. Park, Jae Heon, Apparatus for processing wafers.
  9. Jacob David E., Apparatus method for determining the presence or absence of a wafer on a wafer holder.
  10. Yoshioka Kazutoshi,JPX, Baking apparatus and baking method.
  11. Yoshioka Kazutoshi,JPX, Baking apparatus and baking method.
  12. Emami, Ramin, Capillary ring.
  13. Iida Naruaki,JPX ; Kozawa Seiji,JPX, Carrier apparatus with more than one carrier belts and processing apparatus therewith.
  14. Fujimoto Akihiro,JPX, Coating apparatus and coating method.
  15. Nagamine Shuichi,JPX ; Akimoto Masami,JPX ; Nishiya Akira,JPX ; Kosugi Hitoshi,JPX, Developing apparatus and developing nozzle.
  16. Nguyen, Binh Quoc; Phillips, Alton, Device for handling wafers in microelectronic manufacturing.
  17. James A. Cameron ; Steven G. Reyling, Dual arm substrate handling robot with a batch loader.
  18. Miyai Tsuneo,JPX ; Imai Yuji,JPX, Exposure apparatus.
  19. Grob, Burkhart H. C., Feed and load unit.
  20. Danna,Mark; Hine,Roger G.; Bonom,Anthony C., Integrated system for tool front-end workpiece handling.
  21. Nakashima, Satoshi; Okase, Wataru; Matsuo, Takenobu; Hyakuzuka, Tameyasu; Yagi, Yasushi; Harima, Yoshiyuki; Yamauchi, Jun; Taniyama, Hiroki; Park, Kyungho; Tanaka, Yoshitsugu; Kato, Yoshinori; Sato, , Liquid treatment system and liquid treatment method.
  22. Akimoto Masami,JPX ; Deguchi Yoichi,JPX, Method and apparatus for processing resist.
  23. Akimoto Masami,JPX ; Deguchi Yoichi,JPX, Method and apparatus for processing substrate.
  24. Elliott, Martin R.; Rice, Michael R.; Lowrance, Robert B.; Hudgens, Jeffrey C.; Englhardt, Eric A., Method and apparatus for supplying substrates to a processing tool.
  25. Hosek, Martin, Method for transporting a substrate with a substrate support.
  26. Imanishi,Makoto; Narita,Shoriki; Ikeya,Masahiko; Kanayama,Shinji; Mae,Takaharu, Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore.
  27. Imanishi, Makoto; Narita, Shoriki; Ikeya, Masahiko; Kanayama, Shinji; Mae, Takaharu, Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor.
  28. Rice, Michael R.; Lowrance, Robert B.; Elliott, Martin R.; Hudgens, Jeffrey C.; Englhardt, Eric A., Methods and apparatus for transporting substrate carriers.
  29. Rice,Michael R.; Lowrance,Robert B.; Elliott,Martin R.; Hudgens,Jeffrey C.; Englhardt,Eric A., Methods and apparatus for transporting substrate carriers.
  30. Rice,Michael R.; Lowrance,Robert B.; Elliott,Martin R.; Hudgens,Jeffrey C.; Englhardt,Eric A., Methods and apparatus for transporting substrate carriers.
  31. Rice,Michael R.; Lowrance,Robert B.; Elliott,Martin R.; Hudgens,Jeffrey C.; Englhardt,Eric A., Methods and apparatus for transporting substrate carriers.
  32. Rice,Michael R.; Lowrance,Robert B.; Elliott,Martin R.; Hudgens,Jeffrey C.; Englhardt,Eric A., Methods and apparatus for transporting substrate carriers.
  33. Shah, Vinay K.; Hudgens, Jeffrey C., Methods and apparatus for transporting substrate carriers.
  34. Ogura, Hiroyuki; Mitsuhashi, Tsuyoshi; Fukutomi, Yoshiteru; Morinishi, Kenya; Kawamatsu, Yasuo; Nagashima, Hiromichi, Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units.
  35. Ogura, Hiroyuki; Mitsuhashi, Tsuyoshi; Fukutomi, Yoshiteru; Morinishi, Kenya; Kawamatsu, Yasuo; Nagashima, Hiromichi, Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units.
  36. Yoshio Kimura JP; Issei Ueda JP, Multistage spin type substrate processing system.
  37. Sundar, Satish; Matthews, Ned G., Pneumatically actuated flexure gripper for wafer handling robots.
  38. Akimoto Masami,JPX ; Deguchi Yoichi,JPX, Processing apparatus.
  39. Akimoto Masami,JPX ; Ueda Issei,JPX, Processing system.
  40. Akimoto Masami,JPX, Resist coating-developing system.
  41. Akimoto Masami,JPX, Resist process method and system.
  42. Nichols, Michael J.; Guarracina, Louis J., Self-sterilizing automated incubator.
  43. Choi Jin-Young,KRX ; Kang Hee-Young,KRX ; Park Kyung-Dae,KRX ; Kim Tae-Su,KRX ; Lee Jun-Seong,KRX ; Kim Dong-Ho,KRX ; Kang Sung-Yun,KRX ; Ryu Jai-Moon,KRX ; Kang Han-Kil,KRX, Semiconductor wafer processing system.
  44. Savage, Richard N.; Menagh, Frank S.; Carvalheira, Helder R.; Troiani, Philip A.; Cossentine, Dan L.; Vaughan, Eric R.; Mayer, Bruce E., Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system.
  45. Savage, Richard N.; Menagh, Frank S.; Carvalheira, Helder R.; Troiani, Philip A.; Cossentine, Dan L.; Vaughan, Eric R.; Mayer, Bruce E., Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system.
  46. Rice,Michael Robert; Elliott,Martin R.; Lowrance,Robert B.; Hudgens,Jeffrey C.; Englhardt,Eric Andrew, Substrate carrier handler that unloads substrate carriers directly from a moving conveyer.
  47. Rice, Michael Robert; Elliott, Martin R.; Lowrance, Robert B.; Hudgens, Jeffrey C.; Englhardt, Eric Andrew, Substrate carrier handler that unloads substrate carriers directly from a moving conveyor.
  48. Rice,Michael Robert; Elliott,Martin R.; Lowrance,Robert B.; Hudgens,Jeffrey C.; Englhardt,Eric Andrew, Substrate carrier handler that unloads substrate carriers directly from a moving conveyor.
  49. Rice,Michael Robert; Elliott,Martin R.; Lowrance,Robert B.; Hudgens,Jeffrey C.; Englhardt,Eric Andrew, Substrate carrier handler that unloads substrate carriers directly from a moving conveyor.
  50. Issei Ueda JP, Substrate processing apparatus.
  51. Joichi Nishimura JP; Masami Ohtani JP; Yasuhiko Hashimoto JP, Substrate processing apparatus.
  52. Masatoshi Deguchi JP, Substrate processing apparatus.
  53. Matsuyama Yuji,JPX, Substrate processing apparatus.
  54. Nishimura, Joichi; Ohtani, Masami; Hashimoto, Yasuhiko, Substrate processing apparatus.
  55. Ohtani Masami,JPX ; Matsunaga Minobu,JPX ; Ueyama Tutomu,JPX ; Kitakado Ryuji,JPX ; Aoki Kaoru,JPX ; Tsuji Masao,JPX, Substrate processing apparatus.
  56. Ueda Issei,JPX, Substrate processing apparatus.
  57. Ueda Issei,JPX, Substrate processing apparatus.
  58. Ueda Issei,JPX, Substrate processing apparatus.
  59. Yasuda, Shuichi; Kanaoka, Masashi; Kaneyama, Koji; Miyagi, Tadashi; Shigemori, Kazuhito; Asano, Toru; Toriyama, Yukio; Taguchi, Takashi; Mitsuhashi, Tsuyoshi; Okumura, Tsuyoshi, Substrate processing apparatus.
  60. Akimoto, Masami, Substrate processing apparatus and substrate processing method.
  61. Akimoto,Masami, Substrate processing apparatus and substrate processing method.
  62. Masami Akimoto JP, Substrate processing apparatus and substrate processing method.
  63. Akimoto Masami,JPX ; Ueda Issei,JPX, Substrate processing apparatus having an interface section including two stacked substrate waiting table.
  64. Murata, Akira; Ueda, Issei; Kuroda, Osamu; Kimoto, Kouji; Yoshida, Masahiro, Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program.
  65. Nakaharada, Masahiro; Iida, Naruaki; Morikawa, Katsuhiro; Enokida, Suguru, Substrate transfer method and apparatus.
  66. Fukutomi, Yoshiteru; Mitsuhashi, Tsuyoshi; Ogura, Hiroyuki; Morinishi, Kenya; Kawamatsu, Yasuo; Nagashima, Hiromichi, Substrate treating apparatus.
  67. Fukutomi, Yoshiteru; Mitsuhashi, Tsuyoshi; Ogura, Hiroyuki; Morinishi, Kenya; Kawamatsu, Yasuo; Nagashima, Hiromichi, Substrate treating apparatus using horizontal treatment cell arrangements with parallel treatment lines.
  68. Ogura, Hiroyuki; Mitsuhashi, Tsuyoshi; Fukutomi, Yoshiteru; Morinishi, Kenya; Kawamatsu, Yasuo; Nagashima, Hiromichi, Substrate treating apparatus with inter-unit buffers.
  69. Ogura, Hiroyuki; Morinishi, Kenya; Mitsuhashi, Tsuyoshi; Kawamatsu, Yasuo; Fukutomi, Yoshiteru; Nagashima, Hiromichi, Substrate treating apparatus with inter-unit buffers.
  70. Ogura, Hiroyuki; Mitsuhashi, Tsuyoshi; Fukutomi, Yoshiteru; Morinishi, Kenya; Kawamatsu, Yasuo; Nagashima, Hiromichi, Substrate treating apparatus with parallel substrate treatment lines simultaneously treating a plurality of substrates.
  71. Ogura, Hiroyuki; Mitsuhashi, Tsuyoshi; Fukutomi, Yoshiteru; Morinishi, Kenya; Kawamatsu, Yasuo; Nagashima, Hiromichi, Substrate treating apparatus with substrate reordering.
  72. Fukutomi, Yoshiteru; Mitsuhashi, Tsuyoshi; Ogura, Hiroyuki; Morinishi, Kenya; Kawamatsu, Yasuo; Nagashima, Hiromichi, Substrate treating apparatus with vertical treatment arrangement including vertical blowout and exhaust units.
  73. Fujimoto Akihiro,JPX, Substrate treatment apparatus.
  74. Allen Sam H., System for sorting multiple semiconductor wafers.
  75. Rice, Michael Robert; Lowrance, Robert B.; Elliott, Martin R.; Hudgens, Jeffrey C.; Englhardt, Eric A., System for transporting substrate carriers.
  76. Rice, Michael Robert; Lowrance, Robert B.; Elliott, Martin R.; Hudgens, Jeffrey C.; Englhardt, Eric A., System for transporting substrate carriers.
  77. Rice,Michael Robert; Lowrance,Robert B.; Elliott,Martin R.; Hudgens,Jeffrey C.; Englhardt,Eric A., System for transporting substrate carriers.
  78. Rice,Michael Robert; Lowrance,Robert B.; Elliott,Martin R.; Hudgens,Jeffrey C.; Englhardt,Eric A., System for transporting substrate carriers.
  79. Kobayashi, Kenichi; Nakayama, Youichi; Shiki, Keiichiro, Target object processing system and method of controlling the same.
  80. Rice, Michael R.; Englhardt, Eric A.; Lowrance, Robert B.; Elliott, Martin R.; Hudgens, Jeffrey C., Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event.
  81. Okada, Keiji; Sato, Fumiaki; Nakaoka, Hiroaki, Wafer processing system, wafer processing method, and ion implantation system.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로