[특허]Method for molding using venting pin

Method for molding using venting pin 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B29C-033/10 B29C-045/02
출원번호	US-0160310 (1993-12-02)
발명자 / 주소	Drummond Brian (Austin TX)
출원인 / 주소	Motorola, Inc. (Schaumburg IL 02)
인용정보	피인용 횟수 : 41 인용 특허 : 0

초록 ▼

A molding method is used to mold a semiconductor device within a molded carrier ring. A mold tool (30) has an upper platen (32) and a lower platen (34). Each platen has a package cavity (36) and a carrier ring cavity (38). Between the package and ring cavities is a venting hole (60) having a venting pin (63) slidably fit therein. The venting pin includes a flat surface (64) that allows air which is forced from the package cavity during molding to escape through a narrow gap. The gap size is made small enough to prevent the passage of resin to flow through. Thus, the invention permits the mold tool to be compression cleaned and prevents mold tool down-time previously experienced when molding resin gets dogged in traditional venting holes. In another embodiment, the venting pin can be placed within the package cavity and also serve as an ejector pin.

대표청구항 ▼

A method for molding comprising the steps of: providing a resin compound for molding; providing a mold tool having first and second platens which oppose one another, each of the first and second platens comprising a package cavity, a package ring cavity which surrounds the package cavity, a clamping area next to the package cavity, and a clamping relief cavity next to the clamping area, said clamping area and said clamping relief area being located between the package cavity and the package ring cavity, and wherein at least one of the first and second platens comprises: a venting hole extending from the clamping relief cavity, the venting hole having a first diameter and a first portion; and a venting pin slidably fit within the venting hole and having at least one flat formed thereon, wherein the at least one flat has a depth from a circumference of the venting pin which creates a gap between the venting pin and the venting hole, and wherein the gap is sufficiently small to prevent seepage of the resin compound into the venting hole; providing a lead frame having a semiconductor element coupled thereto; bringing the first and second platens together such that the package cavity, the clamping area, the clamping relief cavity, and the package ring cavity of the first platen are aligned with the package cavity, the clamping area, the clamping relief cavity, and the package ring cavity, respectively, of the second platen, such that the lead frame is positioned between the first and second platens, and such that the semiconductor element is contained within the package cavity of each of the first and second platens and portions of the lead frame extend into the package cavity and the package ring cavity; retracting the venting pin into the venting hole, wherein upon retracting the gap is created between the at least one flat of the venting pin and the venting hole and the at least one flat extends beyond the first portion of the venting hole; and introducing the resin compound into the package cavity of each of the first and second platens to encapsulate the semiconductor element, thereby forcing air from the package cavity to the clamping relief cavity and through the gap created between the at least one flat of the venting pin and the venting hole; wherein the step of retracting is performed before the step of introducing the resin compound.

이 특허를 인용한 특허 (41)

Karmazyn, Michael J., Angular encapsulation of tandem stacked printed circuit boards.
상세보기
Cheon, Seungjin, Apparatus for manufacturing semiconductor package and method for manufacturing semiconductor package using the same.
상세보기
Leonard E. Mess, Ball grid array (BGA) encapsulation mold.
상세보기
Mess Leonard E., Ball grid array (BGA) encapsulation mold.
상세보기
Mess Leonard E., Ball grid array (BGA) encapsulation mold.
상세보기
Tetreault Real Joseph,CAX ; Tremblay Joseph Georges Alain,CAX, Biasing mold for integrated circuit chip assembly encapsulation.
상세보기
Killoran, Steve; Debenedictis, Anthony; Geschke, David; Taverner, Kevin, Die insert for molding a speaker grille.
상세보기
Killoran, Steve; Debenedictis, Anthony; Geschke, David; Taverner, Kevin, Die insert for molding a speaker grille and method of forming same.
상세보기
Wieder,Klaus A., Ejector pin and method.
상세보기
Mess, Leonard E., Encapsulation method in a molding machine for an electronic device.
상세보기
Loren Norman S., Gas injection apparatus for gas assisted injection molding system.
상세보기
Takano Masuo,JPX, Injection molding apparatus having a divided degassing pin.
상세보기
Seroka, Edward, Insert for a tire mold vent.
상세보기
Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
상세보기
Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
상세보기
Knerr, Mark D., Low pressure cylinder head outer die components for core gas removal.
상세보기
McGrane Kevin,GBX, Method and apparatus for encapsulating electronic components.
상세보기
Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
상세보기
Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
상세보기
Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
상세보기
Winget Larry J., Method and mold to make plastic articles having reduced surface defects and assembly for use therein.
상세보기
James,Steven L.; Tandy, deceased,William D.; Tandy, legal representative,Lori, Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting.
상세보기
Ahmad, Syed Sajid, Method of Interconnecting substrates for electrical coupling of microelectronic components.
상세보기
Cobbley,Chad A., Method of encapsulating interconnecting units in packaged microelectronic devices.
상세보기
Cobbley,Chad A., Method of encapsulating packaged microelectronic devices with a barrier.
상세보기
Daihisa, Takuji; Konno, Mitsugu, Method of removing extraneous matter from injection mold.
상세보기
Leonard E. Mess, Methods for ball grid array (BGA) encapsulation mold.
상세보기
Bolken, Todd O., Microelectronic devices and microelectronic die packages.
상세보기
Tsuchida, Kiyoshi, Mold cleaning sheet and manufacturing method of a semiconductor device using the same.
상세보기
Murphy John F., Mold for use in plastic injection molding system and venting pin assembly for use therein.
상세보기
Wieder, Klaus A., Mold vent and method.
상세보기
Ito, Tetsuo; Yoshida, Takayuki; Fukuda, Toshiyuki; Ochi, Takao, Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same.
상세보기
Cantillep, Loreto Ycong, PBGA singulated substrate for model melamine cleaning.
상세보기
Loreto Ycong Cantillep SG, PBGA singulated substrate for model melamine cleaning.
상세보기
Cobbley, Chad A., Packaged microelectronic devices with interconnecting units.
상세보기
James, Stephen L.; Cobbley, Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
상세보기
James,Stephen L.; Cobbley,Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
상세보기
Konishi,Masahiro; Orita,Hiroki; Takada,Toshiyuki, Resin molding die and production method for semiconductor devices using the same.
상세보기
James,Steven L.; Tandy, legal representative,Lori; Tandy, deceased,William D., Semiconductor component having dummy segments with trapped corner air.
상세보기
Farnworth, Warren M., Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece.
상세보기
Gao, Zheng Yu; Ho, Shu Chuen, Vacuum molding apparatus.
상세보기

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Method for molding using venting pin 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허를 인용한 특허 (41)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

연합인증

Method for molding using venting pin 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

전체(0) 논문(0) 특허(0) 보고서(0)

이 특허를 인용한 특허 (41)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트