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In-situ wafer temperature control apparatus for single wafer tools 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0519373 (1995-08-25)
발명자 / 주소
  • Hasegawa Isahiro (Stormville NY) Muller Karl Paul (Wappingers Falls NY) Poschenriedes Bernhard L. (Poughkeepsie NY) Timme Hans-Joerg (Wappingers Falls NY) Van Kessel Theodore (Millbrook NY)
출원인 / 주소
  • Siemens Aktiengesellschaft (Munich DEX 03) International Business Machines Corporation (Armonk NY 02) Kabushiki Kaisha Toshiba (Kanagawa-Ken JPX 03)
인용정보 피인용 횟수 : 59  인용 특허 : 4

초록

A temperature control apparatus for single wafer etching tools comprising a cathode electrode, an isolation layer, and chuck means, respectfully, which are vertically stacked to support a wafer to be etched. A layer of thermoelectric elements is disposed between the isolation layer and the chuck mea

대표청구항

In a temperature control apparatus for single wafer etching tool of the type having a cathode electrode and chuck means for holding a wafer, the chuck means being disposed on the cathode electrode, wherein the chuck means supports the wafer at a given temperature, the improvement comprising: a therm

이 특허에 인용된 특허 (4)

  1. Washizuka Shoichi (Yokohama JPX) Ohta Takao (Tokyo JPX), Apparatus for measuring the electrical characteristics of a semiconductor wafer.
  2. Karasawa Wataru (Yokohama JPX), Electrical characteristics measurement method and measurement apparatus therefor.
  3. Blaske T. Allen (Plano TX) Hendricks Terry J. (Garland TX), Method and apparatus for fabricating a thermoelectric array.
  4. Hirano Yoshihisa (Tokyo JPX) Tahara Yoshifumi (Tokyo JPX) Hasegawa Isahiro (Tokyo JPX) Horioka Keiji (Tokyo JPX), Method of adjusting the temperature of a semiconductor wafer.

이 특허를 인용한 특허 (59)

  1. Gaff, Keith William; Singh, Harmeet; Comendant, Keith; Vahedi, Vahid, Adjusting substrate temperature to improve CD uniformity.
  2. Gaff, Keith William; Singh, Harmeet; Comendant, Keith; Vahedi, Vahid, Adjusting substrate temperature to improve CD uniformity.
  3. Kiehlbauch, Mark, Apparatus and methods for capacitively coupled plasma vapor processing of semiconductor wafers.
  4. Kiehlbauch, Mark, Apparatus and methods for capacitively coupled plasma vapor processing of semiconductor wafers.
  5. Crabb, Kevin Matthew; Engesser, Philipp; Badam, Vijay Kumar, Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus.
  6. Maeda, Shusaku; Ishiguro, Kouji, Charged particle beam device.
  7. Shamouilian Shamouil ; Kholodenko Arnold ; Salimian Siamak ; Noorbakhsh Hamid ; Quiles Efrain ; Grimard Dennis S., Chuck having pressurized zones of heat transfer gas.
  8. Lofy, John, Condensation and humidity sensors for thermoelectric devices.
  9. Lofy, John D., Condensation and humidity sensors for thermoelectric devices.
  10. Pease, John; Benjamin, Neil, Current peak spreading schemes for multiplexed heated array.
  11. Fitzsimmons, John A.; Kline, Thomas A.; White, Patrick F., Detecting leaks in a fluid cooling system by sensing for a drop of fluid pressure in the system.
  12. Takada, Kazuya, Electrostatic chuck and base member for use in the same.
  13. Choi, Youn Sok; Sung, Jeong Hyoun; Soh, Sang Yoon, Electrostatic chuck assembly, semiconductor manufacturing apparatus having the same, and method of measuring temperature of electrostatic chuck.
  14. Logan Joseph ; Tompkins Robert, Electrostatic chuck employing thermoelectric cooling.
  15. Matyushkin, Alexander; Koosau, Dennis; Panagopoulos, Theodoros; Holland, John, Electrostatic chuck having a plurality of heater coils.
  16. Shamouilian Shamouil ; Kholodenko Arnold ; Kats Semyon ; Sherstinsky Semyon ; Clinton Jon ; Bedi Surinder, Electrostatic chuck with improved temperature control and puncture resistance.
  17. Tatsumi, Yoshiaki; Sugawara, Toshifumi, Electrostatic chuck, glass substrate processing method, and said glass substrate.
  18. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.
  19. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.
  20. Petrovski, Dusko, Heating and cooling systems for seating assemblies.
  21. Gaff, Keith William; Comendant, Keith, Heating plate with diode planar heater zones for semiconductor processing.
  22. Singh, Harmeet; Gaff, Keith; Benjamin, Neil; Comendant, Keith, Heating plate with heating zones for substrate processing and method of use thereof.
  23. Singh, Harmeet, Heating plate with planar heater zones for semiconductor processing.
  24. Singh, Harmeet, Heating plate with planar heater zones for semiconductor processing.
  25. Singh, Harmeet; Gaff, Keith; Benjamin, Neil; Comendant, Keith, Heating plate with planar heater zones for semiconductor processing.
  26. Singh, Harmeet; Gaff, Keith; Benjamin, Neil; Comendant, Keith, Heating plate with planar heater zones for semiconductor processing.
  27. Singh, Harmeet; Gaff, Keith; Benjamin, Neil; Comendant, Keith, Heating plate with planar heating zones for semiconductor processing.
  28. Ohata, Mitsunori, High rate method for stable temperature control of a substrate.
  29. Ohata, Mitsunori, High rate method for stable temperature control of a substrate.
  30. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Method and system for controlling an operation of a thermoelectric device.
  31. Tsukamoto,Yuji, Method for multi-step temperature control of a substrate.
  32. Singh, Harmeet, Methods of fault detection for multiplexed heater array.
  33. Brykalski, Michael; Marquette, David, Moisture abatement in heating operation of climate controlled systems.
  34. Pease, John; Benjamin, Neil, Multiplexed heater array using AC drive for semiconductor processing.
  35. Pease, John; Benjamin, Nell, Multiplexed heater array using AC drive for semiconductor processing.
  36. Cho Thomas K. ; Ishikawa Tetsuya, Pedestal with a thermally controlled platen.
  37. Cho, Thomas K.; Ishikawa, Tetsuya, Pedestal with a thermally controlled platen.
  38. Gaff, Keith William; Anderson, Tom; Comendant, Keith; Lu, Ralph Jan-Pin; Robertson, Paul; Pape, Eric A.; Benjamin, Neil, Power switching system for ESC with array of thermal control elements.
  39. Zhang, Tao; Waldmann, Ole; Pape, Eric A., Reducing temperature transition in a substrate support.
  40. Fawcett, Adrian, Sample block apparatus and method for maintaining a microcard on a sample block.
  41. Maxwell Kenneth ; Aranovich Julio, Semiconductor processing system with a thermoelectric cooling/heating device.
  42. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate processing with rapid temperature gradient control.
  43. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate support assembly.
  44. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate support assembly having rapid temperature control.
  45. Matyushkin, Alexander; Koosau, Dennis; Panagopoulos, Theodoros; Holland, John, Substrate support with electrostatic chuck having dual temperature zones.
  46. Singh, Harmeet; Gaff, Keith; Benjamin, Neil; Comendant, Keith, Substrate supports with multi-layer structure including independent operated heater zones.
  47. Pease, John, System and method for monitoring temperatures of and controlling multiplexed heater array.
  48. Pease, John, System and method for monitoring temperatures of and controlling multiplexed heater array.
  49. Tsukamoto, Yuji, Temperature controlled substrate holder having erosion resistant insulating layer for a substrate processing system.
  50. Tsukamoto, Yuji, Temperature controlled substrate holder having erosion resistant insulating layer for a substrate processing system.
  51. Tsukamoto, Yuji; Strang, Eric J., Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system.
  52. Tsukamoto, Yuji; Strang, Eric J., Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system.
  53. Flanigan, Allen, Thermal exchanger for a wafer chuck.
  54. Gaff, Keith William; Comendant, Keith; Ricci, Anthony, Thermal plate with planar thermal zones for semiconductor processing.
  55. Gaff, Keith William; Comendant, Keith; Ricci, Anthony, Thermal plate with planar thermal zones for semiconductor processing.
  56. Lofy, John, Thermoelectric device.
  57. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Thermoelectric device controls and methods.
  58. Inaba, Masahiko; Clark, Jay Christopher; Comiskey, Brian, Thermoelectric device with internal sensor.
  59. Steinman, Adam Joseph; Bunyak, Kenneth James; Orlando, Bruno Antonio, Vehicle headliner assembly for zonal comfort.
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