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Polishing apparatus having endpoint detection device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/00
  • B24B-051/00
출원번호 US-0577536 (1995-12-22)
우선권정보 JP-0336422 (1994-12-22)
발명자 / 주소
  • Takahashi Tsutomu (Yokohama JPX) Tohyama Keiichi (Kawasaki JPX) Takahashi Tamami (Yamato JPX)
출원인 / 주소
  • Ebara Corporation (Tokyo JPX 03)
인용정보 피인용 횟수 : 139  인용 특허 : 0

초록 ▼

A polishing apparatus has an automated endpoint detection device to determine if an endpoint of polishing has been reached without removing the wafer from a top ring of the polishing apparatus. When a pre-determined inspection time is reached in a process of polishing, the wafer is moved laterally a

대표청구항 ▼

A polishing apparatus having a turntable, top ring means for pressing an object to be polished onto said turntable during polishing of a surface of the object, and an endpoint detection means for detecting an endpoint for stopping polishing of the surface of the object, said endpoint detection means

이 특허를 인용한 특허 (139)

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