초록 ▼

A process for the selective variation in density of particulate matter codeposited within metallic matrices deposited onto articles utilizing increased levels of rotation of said articles during plating cycle to attain said selective codeposition density. The attainment of varying densities of codep

A process for the selective variation in density of particulate matter codeposited within metallic matrices deposited onto articles utilizing increased levels of rotation of said articles during plating cycle to attain said selective codeposition density. The attainment of varying densities of codeposited particulate matter in the plated layer along the surface of the substrate is particularly useful in cost reduction and improved product performance.

대표청구항 ▼

A composite electrolessly plated article of generally cylindrical shape having a single axis of symmetry, said article comprising a substrate having finely divided insoluble particulate matter dispersed within a metallic coating electrolessly plated thereon, said plated article having a differential

A composite electrolessly plated article of generally cylindrical shape having a single axis of symmetry, said article comprising a substrate having finely divided insoluble particulate matter dispersed within a metallic coating electrolessly plated thereon, said plated article having a differential percent of particulate matter codeposited at different locations along the surface of the substrate of said article, said substrate having a first geometry of at least one depression along one portion of said surface and a second geometry of at least one raised area along another portion of said surface different from said first geometry, wherein the density of said particulate matter within said coating on said surface of said first geometry is different from the density of said particulate matter within said coating on the surface of said second geometry, said differential percent density being achieved through an increased rotational speed of the substrate during the plating process in comparison to a slower rotational speed necessary for a more uniform electroless codeposition of particulate matter across the surface of the substrate.