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Diamond-like carbon for use in VLSI and ULSI interconnect systems 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
  • H01L-031/0312
출원번호 US-0631239 (1996-04-12)
발명자 / 주소
  • Cohen Stephan Alan (Wappingers Falls NY) Edelstein Daniel Charles (New Rochelle NY) Grill Alfred (White Plains NY) Paraszczak Jurij Rostyslav (Pleasantville NY) Patel Vishnubhai Vitthalbhai (Yorktown
출원인 / 주소
  • International Business Machines, Corp. (Armonk NY 02)
인용정보 피인용 횟수 : 53  인용 특허 : 19

초록 ▼

The present invention relates to semiconductor devices comprising as one of their structural components diamond-like carbon as an insulator for spacing apart one or more levels of a conductor on an integrated circuit chip. The present invention also relates to a method for forming an integrated stru

대표청구항 ▼

A method for forming patterns in SiO2 comprising the steps of: selecting a substrate having an upper surface; forming a layer of diamond-like carbon material over said upper surface of said substrate; forming a layer of SiO2 over said material; forming a patterned layer over said SiO2 layer; introdu

이 특허에 인용된 특허 (19)

  1. Kimock Fred M. (Macungie PA) Knapp Bradley J. (Allentown PA) Finke Steven J. (Kutztown PA), Abrasion wear resistant coated substrate product.
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  2. Jaso Mark A. (Yorktown Heights NY) Jones Paul B. (Wappingers Falls NY) Meyerson Bernard S. (Yorktown Heights NY) Patel Vishnubhai V. (Yorktown Heights NY), CVD diamond or diamond-like carbon for chemical-mechanical polish etch stop.
    상세보기
  3. Beyer Klaus D. (Poughkeepsie NY) Guthrie William L. (Poughkeepsie NY) Makarewicz Stanley R. (New Windsor NY) Mendel Eric (Poughkeepsie NY) Patrick William J. (Newburgh NY) Perry Kathleen A. (Lagrange, Chem-mech polishing method for producing coplanar metal/insulator films on a substrate.
    상세보기
  4. Ashby Carol I. H. (Edgewood NM) Dishman James L. (Albuquerque NM), Composition/bandgap selective dry photochemical etching of semiconductor materials.
    상세보기
  5. Kirkpatrick Allen R. (Lexington MA), Diamond films and method of growing diamond films on nondiamond substrates.
    상세보기
  6. Garg Diwakar (Macungie PA) Tsai Wilman (Cupertino CA) Iampietro Robert L. (Emmaus PA) Kimock Fred M. (Macungie PA) Dyer Paul N. (Allentown PA), Diamond-on-a-substrate for electronic applications.
    상세보기
  7. Yanagida Toshiharu (Kanagawa JPX), Dry etching method.
    상세보기
  8. Nagano Tetsuya (Kyoto JPX) Koeda Masaru (Kyoto JPX), Dry etching method and its application.
    상세보기
  9. Nishibayashi Yoshiki (Hyogo JPX) Fujimori Naoji (Hyogo JPX), Etching method.
    상세보기
  10. Garg Diwakar (Macungie PA) Tsai Wilman (Cupertino CA) Kimock Fred M. (Macungie PA) Iampietro Robert L. (Emmaus PA) Dyer Paul N. (Allentown PA), HFCVD method for producing thick, adherent and coherent polycrystalline diamonds films.
    상세보기
  11. Wagal Suhas S. (Richardson TX) Collins Carl B. (Richardson TX), Method and apparatus for producing a layer of material from a laser ion source.
    상세보기
  12. Nishibayashi Yoshiki (Itami JPX) Shikata Shinichi (Itami JPX), Method for etching diamond.
    상세보기
  13. Purdes Andrew J. (Garland TX) Celii Francis G. (Dallas TX), Method for forming patterned diamond thin films.
    상세보기
  14. Pyke Stephen C. (Willowick OH), Method of forming suspended gate, chemically sensitive field-effect transistor.
    상세보기
  15. Hed Aharon Z. (Nashua NH), Method of making a Josephson junction with a diamond-like carbon insulating barrier.
    상세보기
  16. Yamazaki Shunpei (Tokyo JPX) Itoh Kenji (Zama JPX), Method of plasma etching amorphous carbon films.
    상세보기
  17. Wu Andrew L. (Shrewsbury MA), Planar interconnect for integrated circuits.
    상세보기
  18. Omori Masahiro (Palo Alto CA) Stoneham Edward B. (Los Altos CA), Protective coating useful as a passivation layer for semiconductor devices.
    상세보기
  19. Frenklach Michael Y. (State College PA) Spear Karl E. (State College PA) Koba Richard J. (State College PA), Synthesis of diamond powders in the gas phase.
    상세보기

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  1. David P. Mancini ; Steven M. Smith ; Douglas J. Resnick, Amorphous carbon layer for improved adhesion of photoresist and method of fabrication.
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  2. Jin Sungho ; Liu Ruichen ; Pai Chien-Shing ; Zhu Wei, Article comprising fluorinated amorphous carbon and process for fabricating article.
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  3. Pai Chien-Shing ; Zhu Wei, Article comprising fluorinated diamond-like carbon and method for fabricating article.
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  4. Campi, Jim G.; Van Den Broeke, Douglas J., Binary and phase-shift photomasks.
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  5. Kazuyoshi Ueno JP, COPPER WIRING STRUCTURE COMPRISING A COPPER MATERIAL BURIED IN A HOLLOW OF AN INSULATING FILM AND A CARBON LAYER BETWEEN THE HOLLOW AND THE COPPER MATERIAL IN SEMICONDUCTOR DEVICE AND METHOD FABRICAT.
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  6. Kazuyoshi Ueno JP, COPPER WIRING STRUCTURE COMPRISING A COPPER MATERIAL BURIED IN A HOLLOW OF AN INSULATING FILM AND A CARBON LAYER BETWEEN THE HOLLOW AND THE COPPER MATERIAL IN SEMICONDUCTOR DEVICE AND METHOD OF FABRI.
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  7. Veerasamy Vijayen S. ; Petrmichl Rudolph Hugo ; Thomsen Scott V., Coated article including a DLC inclusive layer(s) and a layer(s) deposited using siloxane gas, and corresponding method.
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  8. Veerasamy, Vijayen S., Coated article with DLC inclusive layer(s) having increased hydrogen content at surface area.
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  9. Tatsuya Usami JP, Fabrication process for a semiconductor device with damascene interconnect lines of the same level separated by insulators with different dielectric constants.
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  10. Veerasamy Vijayen S., Highly tetrahedral amorphous carbon coating on glass.
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  11. Veerasamy Vijayen S., Highly tetrahedral amorphous carbon coating on glass.
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  12. Veerasamy, Vijayen S., Highly tetrahedral amorphous carbon coating on glass.
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  13. Veerasamy Vijayen S. ; Petrmichl Rudolph Hugo ; Thomsen Scott V., Hydrophobic coating including DLC and/or FAS on substrate.
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  14. Veerasamy Vijayen S., Hydrophobic coating including DLC on substrate.
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  15. Vijayen S. Veerasamy, Hydrophobic coating including DLC on substrate.
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  17. Veerasamy Vijayen S. ; Petrmichl Rudolph Hugo, Hydrophobic coating with DLC & FAS on substrate.
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  18. Berthold,J철rg; Schwarzl,Siegfried, Integrated electrical circuit and method for fabricating it.
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  19. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl ; Scott V. Thomsen, Low-E coating system including protective DLC.
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  20. Tuqiang Ni ; Nancy Tran, Method and apparatus for side wall passivation for organic etch.
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  21. Clevenger, Lawrence A.; Hsu, Louis L.; Wang, Li-Kong; Yuan, Tsomg-Dih, Method and structure for providing improved thermal conduction for silicon semiconductor devices.
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  22. Clevenger,Lawrence A.; Hsu,Louis L.; Wang,Li Kong; Yuan,Tsorng Dih, Method and structure for providing improved thermal conduction for silicon semiconductor devices.
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  23. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl, Method of depositing DLC inclusive coating on substrate.
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  24. Fairbairn, Kevin; Rice, Michael; Weidman, Timothy; Ngai, Christopher S; Latchford, Ian Scot; Bencher, Christopher Dennis; Wang, Yuxiang May, Method of depositing an amorphous carbon layer.
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  25. Fairbairn,Kevin; Rice,Michael; Weidman,Timothy; Ngai,Christopher S; Latchford,Ian Scot; Bencher,Christopher Dennis; Wang,Yuxiang May, Method of depositing an amorphous carbon layer.
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  26. Fairbairn,Kevin; Rice,Michael; Weidman,Timothy; Ngai,Christopher S; Latchford,Ian Scot; Bencher,Christopher Dennis; Wang,Yuxiang May, Method of depositing an amorphous carbon layer.
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  27. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl ; Scott V. Thomsen, Method of deposition DLC inclusive layer(s) using hydrocarbon and/or siloxane gas(es).
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  28. Oda Noriaki,JPX, Method of fabricating a semiconductor device.
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  29. Veerasamy, Vijayen S.; Petrmichl, Rudolph Hugo, Method of ion beam milling a glass substrate prior to depositing a coating system thereon, and corresponding system for carrying out the same.
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  30. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl, Method of ion beam milling substrate prior to depositing diamond like carbon layer thereon.
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  31. Veerasamy, Vijayen S.; Petrmichl, Rudolph Hugo, Method of making a coated article including DLC and FAS.
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  32. Veerasamy, Vijayen S.; Petrmichl, Rudolph Hugo; Thomsen, Scott V., Method of making coated article including DLC inclusive layer over low-E coating.
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  33. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl ; Scott V. Thomsen, Method of making coated article including diamond-like carbon (DLC) and FAS.
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  34. Veerasamy, Vijayen S., Method of making coated article including layer(s) of diamond-like carbon which may be hydrophobic.
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  35. Veerasamy, Vijayen S., Method of making coating article including carbon coating on glass.
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  36. Veerasamy,Vijayen S., Method of making heat treatable coated article with diamond-like carbon (DLC) inclusive layer.
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  37. Veerasamy, Vijayen S., Method of making heat treatable coated article with protective layer.
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  38. Vijayen S. Veerasamy, Method of making hydrophobic coated article.
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  39. Nguyen, Son Van; Robertson, Neil Leslie; Dinan, Thomas Edward; Pham, Thao Duc, Method of manufacturing high aspect ratio photolithographic features.
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  40. Sugiyama Osamu,JPX ; Miya Yukio,JPX ; Koike Ryota,JPX ; Toida Takashi,JPX ; Sekine Toshiichi,JPX, Method of removing hard carbon film formed on inner circumferential surface of guide bush.
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  41. Ravi, Kramadhati V.; Garner, Michael C., Methods of forming a high conductivity diamond film and structures formed thereby.
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  42. Ravi,Kramadhati V.; Garner,Michael C., Methods of forming a high conductivity diamond film and structures formed thereby.
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  43. Ravi,Kramadhati V.; Garner,Michael C., Methods of forming a high conductivity diamond film and structures formed thereby.
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  44. Kim, Bok Hoen; Rathi, Sudha; Ahn, Sang H.; Bencher, Christopher D.; Wang, Yuxiang May; M'Saad, Hichem; Silvetti, Mario D.; Fung, Miguel; Jung, Keebum; Zhu, Lei, Nitrogen-free dielectric anti-reflective coating and hardmask.
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  45. Golecki, Ilan, Non-mechanical fabrication of carbon-containing work pieces.
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  46. Vijayen S. Veerasamy, Process for depositing DLC inclusive coating with surface roughness on substrate.
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  47. Bencher, Christopher Dennis, Removable amorphous carbon CMP stop.
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  48. Bencher,Christopher Dennis, Removable amorphous carbon CMP stop.
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  49. Bencher,Christopher Dennis, Removable amorphous carbon CMP stop.
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  50. Matsubara Yoshihisa,JPX, Semiconductor device and method of manufacturing the same.
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  51. Veerasamy, Vijayen S.; Petrmichl, Rudolph Hugo; Thomsen, Scott V., Solar management coating system including protective DLC.
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  52. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl ; Scott V. Thomsen, Solar management coating system including protective DLC.
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  53. Tanga, Michifumi; Takahashi, Kojiro, Supports for immobilizing DNA or the like.
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