이 특허를 인용한 특허 (42)

1. Bradley Jean-Claude, Bipolar electrochemical connection of materials.

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2. Lochun, Darren; Ireland, John J., Circuit elements having an embedded conductive trace and methods of manufacture.

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3. Brown Harold M., Clay-containing textile material treating composition and method.

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4. Morris George W,GBX ; Treen Andrew S,GBX ; Grant Ian,GBX, Composite materials.

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5. Farrar Paul A., Copper metallurgy in integrated circuits.

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6. Farrar, Paul A., Copper metallurgy in integrated circuits.

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7. Farrar,Paul A., Electronic apparatus having a core conductive structure within an insulating layer.

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8. Deng, Tao; Arias, Francisco; Ismagilov, Rustem F.; Kenis, Paul J. A.; Whitesides, George M., Fabrication of metallic microstructures via exposure of photosensitive composition.

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9. Deng,Tao; Arias,Francisco; Ismagilov,Rustem F.; Kenis,Paul J. A.; Whitesides,George M., Fabrication of metallic microstructures via exposure of photosensitive composition.

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10. Deng, Tao; Arias, Francisco; Ismagilov, Rustem F.; Kenis, Paul J. A.; Whitesides, George M., Fabrication of metallic microstructures via exposure of photosensitive compostion.

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11. Farrar Paul A., Forming submicron integrated-circuit wiring from gold, silver, copper and other metals.

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12. Farrar Paul A., Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals.

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13. Farrar, Paul A., Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals.

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14. Farrar,Paul A., Hplasma treatment.

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15. Farrar, Paul A., Integrated circuit and seed layers.

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16. Farrar,Paul A., Integrated circuit and seed layers.

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17. Farrar,Paul A., Integrated circuit and seed layers.

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18. Farrar Paul A., Integrated circuit with oxidation-resistant polymeric layer.

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19. Farrar, Paul A., Mask on a polymer having an opening width less than that of the opening in the polymer.

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20. Farnworth, Warren M.; Duesman, Kevin G., Method and apparatus for electrolytic plating of surface metals.

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21. Ahn,Kie Y.; Forbes,Leonard, Method for making integrated circuits.

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22. Dubin, Valery, Method for making interconnects and diffusion barriers in integrated circuits.

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23. Carter, Kenneth Raymond; Hart, Mark Whitney; Hawker, Craig Jon; Scott, John Campbell, Method of forming metallized pattern.

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24. Ahn, Kie Y.; Forbes, Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.

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25. Ahn, Kie Y.; Forbes, Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.

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26. Ahn,Kie Y.; Forbes,Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.

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27. Ahn Kie Y. ; Forbes Leonard, Methods for making copper and other metal interconnections in integrated circuits.

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28. Ahn,Kie Y.; Forbes,Leonard, Methods for making copper and other metal interconnections in integrated circuits.

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29. Ahn,Kie Y.; Forbes,Leonard, Methods for making integrated-circuit wiring from copper, silver, gold, and other metals.

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30. Ahn,Kie Y.; Forbes,Leonard, Methods for making integrated-circuit wiring from copper, silver, gold, and other metals.

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31. Ahn,Kie Y.; Forbes,Leonard, Methods for making integrated-circuit wiring from copper, silver, gold, and other metals.

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32. Valery Dubin, Methods for making interconnects and diffusion barriers in integrated circuits.

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33. Ahn,Kie Y.; Forbes,Leonard; Eldridge,Jerome M., Multilevel copper interconnect with double passivation.

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34. Ahn,Kie Y.; Forbes,Leonard, Multilevel copper interconnects with low-k dielectrics and air gaps.

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35. Ahn,Kie Y.; Forbes,Leonard, Multilevel copper interconnects with low-k dielectrics and air gaps.

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36. Jean-Claude Bradley, Process of making bipolar electrodeposited catalysts and catalysts so made.

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37. Ahn,Kie Y.; Forbes,Leonard, Selective electroless-plated copper metallization.

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38. Farrar, Paul A., Structures and methods to enhance copper metallization.

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39. Farrar, Paul A., Structures and methods to enhance copper metallization.

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40. Farrar, Paul A., Structures and methods to enhance copper metallization.

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41. Farrar,Paul A., Structures and methods to enhance copper metallization.

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42. Farrar,Paul A., Structures and methods to enhance copper metallization.

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