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Metal sputtering target assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B21D-022/16
출원번호 US-0690988 (1996-08-01)
발명자 / 주소
  • Emigh Roger Alan (Post Falls ID) Willett William Bryce (Veradale WA)
출원인 / 주소
  • Johnson Matthey Electronics, Inc. (Spokane WA 02)
인용정보 피인용 횟수 : 37  인용 특허 : 19

초록

Described is a method of manufacturing a sputtering target or backing plate for a sputtering target that minimizes metal waste and reduces manufacturing steps. The target or backing plate is made from a substantially circular metal blank by progressively deforming circumferential bands until the bla

대표청구항

A method of making a metal sputtering target assembly comprising a sputtering target having a top which includes a target surface, having substantially the same microstructure as the metal from which the target surface is made, and an extension, comprising: providing a metal blank; clamping the meta

이 특허에 인용된 특허 (19)

  1. Shagun Vladimir A. (ulitsa 50 let SSSR ; I4 ; kv. 63 Ufa SUX) Domrachev Vladimir A. (ulitsa Sotsialisticheskaya ; 47 ; kv. 64 Ufa SUX) Balykin Pavel S. (ulitsa Entuziastov ; I ; kv. 2I2 Ufa SUX) Soko, Apparatus for applying film coatings onto substrates in vacuum.
  2. Aichert Hans (Hanau am Main DEX) Gegenwart Rainer (Rodermark DEX) Kukla Reiner (Hanau am Main DEX) Wilmes Klaus (Bad Orb DEX) Kieser Jorg (Forchheim DEX), Cathode sputtering apparatus on the magnetron principle with a hollow cathode and a cylindrical target.
  3. Bergmann Erich (Mels CHX) Braus Jurgen (Walldor DEX), Composite material having a slide layer applied by cathode sputtering.
  4. Bergmann Erich (Mels CHX) Braus Jurgen (Walldorf DEX), Composite material having a slide layer applied by cathode sputtering.
  5. Hillman Gary (Livingston NJ), Cooling device for a sputter target and source.
  6. Arita Yoji (Yokohama JPX), Magnetron sputtering apparatus.
  7. Hata Tomonobu (Ishikawa JPX), Magnetron sputtering method and apparatus.
  8. Lauterbach Richard (Munich DEX) Keller Hartmut (Poecking DEX), Method for attaching disc- or plate-shaped targets to cooling plates for sputtering systems.
  9. Nobutani Tohru (Kadoma JPX) Nakamoto Atsuhiro (Kadoma JPX) Izumi Hideo (Kadoma JPX) Miyano Takahiro (Kadoma JPX), Method for forming conducting metal layer on inorganic substrate.
  10. Lannutti Susan M. (Columbus OH) Wickersham ; Jr. Charles E. (Columbus OH), Method of bonding a titanium containing sputter target to a backing plate and bonded target/backing plate assemblies pro.
  11. Kraft Derald H. (Canton OH), Method of making V-grooved sheet metal pulleys.
  12. Critton Thomas J. (East Amherst NY) Johnson Donald S. (Fort Erie NY CAX) Pukalo Walter P. (Blasdell NY) Yorio Ralph (Easton PA), Method of making torsional vibration damper having a roll spun housing.
  13. Strothers Susan D. (Spokane WA) Delano Robert G. (Valleyford WA) Steed Garold L. (Spokane WA), Method of manufacturing sputtering target assembly.
  14. Kusakabe Kenji (Itami JPX) Yamauchi Keiji (Itami JPX), Semiconductor production apparatus.
  15. Qamar, Sohail S.; Conard, Harry W.; Hamilton, Lowell E., Sputter target design.
  16. Fukasawa Yoshiharu (Yokohama JPX) Kawai Mituo (Yokohama JPX) Ishihara Hideo (Yokohama JPX) Umeki Takenori (Yokohama JPX) Oana Yasuhisa (Yokohama JPX), Sputtering alloy target and method of producing an alloy film.
  17. Nishiyama Hiroshi (Mukou JPX) Nakamura Takeshi (Uji JPX) Kato Suehiro (Nagaokakyo JPX) Ando Kenji (Kyoto JPX), Sputtering apparatus.
  18. Shimamura Hideaki (Yokohama JPX) Sakata Masao (Yokohama JPX) Kobayashi Shigeru (Tokyo JPX) Yoneoka Yuji (Yokohama JPX) Kamei Tsuneaki (Kanagawa JPX) Kawahito Tsuneyoshi (Yokohama JPX) Fujita Shoyo (G, Sputtering process and an apparatus for carrying out the same.
  19. Fukasawa Yoshiharu (Tokyo JPX) Yamaguchi Satoshi (Tokyo JPX) Ishihara Hideo (Tokyo JPX), Sputtering target.

이 특허를 인용한 특허 (37)

  1. Ivanov, Eugene Y.; Theado, Erich; Smathers, David B., Circular groove pressing mechanism and method for sputtering target manufacturing.
  2. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  3. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  4. Kulkarni Shailesh ; Lam Raymond K. F. ; Sica Tony, Fabrication of clad hollow cathode magnetron sputter targets.
  5. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
  6. Michaluk, Christopher A.; Huber, Jr., Louis E., High purity niobium and products containing the same, and methods of making the same.
  7. Christopher A. Michaluk ; Louis E. Huber ; Mark N. Kawchak ; James D. Maguire, High purity tantalum, products containing the same, and methods of making the same.
  8. Michaluk, Christopher A.; Huber, Louis E.; Kawchak, Mark N.; Maguire, Jr., James D., High purity tantalum, products containing the same, and methods of making the same.
  9. Michaluk, Christopher A.; Huber, Louis E.; Kawchak, Mark N.; Maguire, Jr., James D., High purity tantalum, products containing the same, and methods of making the same.
  10. Michaluk,Christopher A.; Huber,Louis E.; Kawchak,Mark N.; Maguire, Jr.,James D., High purity tantalum, products containing the same, and methods of making the same.
  11. Melvin K. Holcomb ; William E. Barnes ; Steven L. Bardus, Insert target assembly and method of making same.
  12. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
  13. Klintenstedt, Kjel; Olsson, Sven Olov; Rudman, Lars Johan, Method and a press tool for manufacturing a separation disk.
  14. Facey,Joseph C.; Ward,Ivan, Method for centering a sputter target onto a backing plate and the assembly thereof.
  15. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  16. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  17. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
  18. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
  19. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
  20. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  21. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  22. Carpenter, Craig M.; Maguire, Jr., James D., Methods of producing deformed metal articles.
  23. Carpenter, Craig M.; Maguire, Jr., James D., Methods of producing deformed metal articles.
  24. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
  25. Okabe, Takeo; Nagasawa, Masaru, Packaging device and packaging method for hollow cathode type sputtering target.
  26. Langer, Klaus; Pardess, Klaus; Holm, Dittmar; Gruneisen, Albrecht, Plate for the spin drum of a centrifuge with spacers and process for its manufacture.
  27. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  28. Facey, Joseph C.; Ward, Ivan, Sputter target and backing plate assembly.
  29. Facey, Joseph C.; Ward, Ivan, Sputter target and backing plate assembly.
  30. Hukushima, Atsushi, Sputtering target and manufacturing method thereof.
  31. West, Brian T.; Cox, Michael S.; Oh, Jeonghoon, Sputtering target with backside cooling grooves.
  32. West, Brian T.; Cox, Michael S.; Oh, Jeonghoon, Sputtering target with backside cooling grooves.
  33. Laporte, Jean-Michel, Target.
  34. Adams, Jesse D.; Korgan, Grant; Malekos, Steven; Renard-Le Galloudec, Nathalie; Sentoku, Yasuhiko; Cowan, Thomas E., Targets and processes for fabricating same.
  35. Cowan, Thomas; Malekos, Steven; Korgan, Grant; Adams, Jesse; Sentoku, Yasuhiko; Le Galloudec, Nathalie; Fuchs, Julien, Targets and processes for fabricating same.
  36. Malekos, Steven; Korgan, Grant; Adams, Jesse D., Targets and processes for fabricating same.
  37. Smathers, David B.; Holcomb, Melvin K.; Land, Eric, Variable thickness plate for forming variable wall thickness physical vapor deposition target.
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