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Multiple intake duct microprocessor cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0578984 (1995-12-27)
발명자 / 주소
  • Nelson Daryl J. (Beaverton OR)
출원인 / 주소
  • Intel Corporation (Santa Clara CA 02)
인용정보 피인용 횟수 : 51  인용 특허 : 11

초록

An apparatus for cooling the components within an enclosed computer system. The apparatus includes a first compartment containing a power supply and a fan, a second compartment containing a variety of electrical components and an air duct containing the computer system microprocessor. The air duct d

대표청구항

In a computer system enclosure containing a processor, a power supply and at least one electrical component, a cooling system comprising: an air duct containing said processor, said air duct directing a first air flow from the exterior of said enclosure over said processor to an inlet opening of a f

이 특허에 인용된 특허 (11)

  1. Gourdine Meredith C. (Houston TX), Apparatus and method for cooling heat generating electronic components in a cabinet.
  2. Gourdine Meredith C. (Houston TX), Apparatus and method for cooling heat generating electronic components in a cabinet.
  3. Lin Mike (No. 56 ; Lane 55 Dong-Rong Rd. ; Sei-Rong Village Da-Lei Hsiang ; Tai-Chung Hsien TWX), CPU heat dissipating device.
  4. Swensen Michael W. (Austin TX) Martin William C. (Austin TX) Kight Henry H. (Austin TX), Computer cooling system using recycled coolant.
  5. Katooka Masao (Kawanishi JPX) Kawashima Yoshimasa (Kobe JPX) Sakurada Makoto (Yao JPX) Makitani Atsushi (Toyonaka JPX), Cooling structure for power supply device.
  6. Christison, Alan M., Cooling system for automatic bowling pin spotter.
  7. Gagnon Kevin M. (1668 Larwood Rd. Lemon Grove CA 91945) Goulter Victor H. (485 Molimo Dr. San Francisco CA 94127-1655), Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control p.
  8. Swindler Dan (Austin TX), Heat sink/component access door for portable computers.
  9. Larabell Henri J. (Cupertino CA) Davis Richard S. (Palo Alto CA), Modular enclosure apparatus.
  10. Maroushek Timothy R. (Lino Lakes MN), Modular stacked housing arrangement.
  11. Elko Gary W. (Summit NJ) Howard Paul (Hinsdale IL) Quinlan Daniel A. (Andover MA), Option slot filler board.

이 특허를 인용한 특허 (51)

  1. Malone,Christopher G.; Simon,Glenn C.; Bolich,Bryan; Tam,Victoria Tsang, Air duct with airtight seal.
  2. John R. Sterner, Apparatus to enhance cooling of electronic device.
  3. John R. Sterner, Apparatus to enhance cooling of electronic device.
  4. John R. Sterner, Apparatus to enhance cooling of electronic device.
  5. John R. Sterner, Apparatus to enhance cooling of electronic device.
  6. John R. Sterner, Apparatus to enhance cooling of electronic device.
  7. John R. Sterner, Apparatus to enhance cooling of electronic device.
  8. Sterner,John R., Apparatus to enhance cooling of electronic device.
  9. Diemunsch Guy,FRX, Component cooling arrangement in electronic equipment with internal power supply.
  10. Abraham, Benjamin; Briden, John J., Computer chassis.
  11. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, Computer chassis for dual offset opposing main boards.
  12. Liu, Lei, Computer enclosure.
  13. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, Computer rack cooling system.
  14. Coglitore,Giovanni; Gallo,Nikolai; Randall,Jack, Computer rack cooling system.
  15. Coglitore,Giovanni, Computer rack cooling system with variable airflow impedance.
  16. James Doustou, III ; Ralph Larsen ; Klaus J. Schneller ; Arthur R. Nigro, Jr., Computer system.
  17. Tozune, Toshimasa; Takashima, Shigekazu; Akabori, Takahiro, Cooling apparatus.
  18. Ozaki, Yuzo; Nakai, Yasuhiro; Sonehara, Takashi; Hokao, Shigeyuki; Mizoguchi, Motoshi, Cooling device, cooling method, and electronic apparatus.
  19. Arbogast,Porter; Crane,Robert L.; Eland,Michael P.; Hanzlik,Steven E.; Roesner,Arlen L.; Tuttle,Erick J.; Searby,Tom J., Duct for cooling multiple components in a processor-based device.
  20. Arbogast,Porter; Crane,Robert L.; Eland,Michael P.; Hanzlik,Steven E.; Roesner,Arlen L.; Tuttle,Erick J.; Searby,Tom J., Duct for cooling multiple components in a processor-based device.
  21. Kurosu, Shigeru; Kitaru, Katsunori; Momose, Takayuki; Inoue, Akira; Otsuka, Sumio; Kaino, Masazumi; Araya, Masao; Kobayashi, Norio, Electronic apparatus and cooling method thereof.
  22. Kurosu, Shigeru; Kitaru, Katsunori; Momose, Takayuki; Inoue, Akira; Otsuka, Sumio; Kaino, Masazumi; Araya, Masao; Kobayashi, Norio, Electronic apparatus and cooling method thereof.
  23. Kurosu, Shigeru; Kitaru, Katsunori; Momose, Takayuki; Inoue, Akira; Otsuka, Sumio; Kaino, Masazumi; Araya, Masao; Kobayashi, Norio, Electronic apparatus and cooling method thereof.
  24. Arai, Satoru; Ariga, Koji; Tashiro, Naoki; Mamata, Tohru, Electronic apparatus and method of cooling the electronic apparatus.
  25. Arai,Satoru; Ariga,Koji; Tashiro,Naoki; Mamata,Tohru, Electronic apparatus and method of cooling the electronic apparatus.
  26. Yang, Shun Chieh; Chen, Chi Hong, Electronic device.
  27. Tian, Bo; Wu, Kang, Electronic device with heat dissipation structure.
  28. Jeudi, Jean-Marie, Electronic equipment assembly.
  29. Lofland Steve ; Nelson Daryl James ; Pollard ; II Lloyd L. ; Webb James Stacker ; Noble Scott L., Fan duct module.
  30. Noble, Scott L., Fan duct module.
  31. Kuo,Yi Lung, Fan for cooling a computer.
  32. Ellsworth, Jr., Michael J.; Lehman, Bret W.; Matteson, Jason A.; Schmidt, Roger R., Frame level partial cooling boost for drawer and/or node level processors.
  33. Chen, Chen; Sun, Hong-Zhi; Li, Yang, Heat dissipation system.
  34. Sygulla, John Michael; Ramakrishnan, Arun; Slowiak, Greg, Hierarchical system manager rollback.
  35. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, High density computer equipment storage system.
  36. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, High density computer equipment storage system.
  37. Giovanni Coglitore ; Nikolai Gallo ; Jack Randall, High density computer equipment storage system.
  38. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, High density computer equipment storage systems.
  39. Lin, Te-Chang, Industrial computer chassis structure with power source disposed centrally.
  40. Charles W. Frank, Jr. ; Thomas D. Hanan ; Wally Szeremeta, Integrated computer module with airflow accelerator.
  41. Korinsky, George K.; Crawford, Craig, Method and apparatus for dissipating heat from an electronic device.
  42. Korinsky, George K.; Crawford, Craig, Method and apparatus for dissipating heat from an electronic device.
  43. Yi Lung,Kuo, Placement structure of an integrated motherboard for small form factor computer.
  44. Coglitore, Giovanni, Portion of a bank of computer chassis mounted to rack bars.
  45. Seibold, Lawrence B., Power supply cooling system.
  46. Nishikawa, Jun; Inoue, Toru; Nishi, Shinji; Nishinaka, Yuzo; Watanabe, Toru; Yamashita, Yoshiharu, Receiver apparatus.
  47. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  48. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  49. Espinoza-Ibarra, Ricardo; Barr, Andrew H., System fan management based on system loading options for a system having replaceable electronics modules.
  50. Espinoza-Ibarra, Ricardo; Barr, Andrew H., System fan management based on system loading options for a system having replaceable electronics modules.
  51. Ong, Tony, Thermal control system.
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