|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||165/804 ; 165/10433 ; 257/714 ; 361/699|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 88 인용 특허 : 8|
Aviation fuel is used as the coolant for a microchannel heat sink for airborne electronics. The use of preexisting aviation fuel as a coolant medium eliminates the weight, size and expense of a separate liquid system dedicated solely to electronics cooling. The heat sink is comprised of a body of material having high thermal conductivity and in which are formed a set of parallel closed-ended microchannels on the order of 0.001 in. by 0.004 in. separated by a distance of 0.001 in.
A method of extracting heat from an electronics device located in an aircraft, comprising the steps of: thermally coupling said electronics device to a heat sink comprising a body of material having relatively high thermal conductivity, a plurality of microchannels having walls operating as cooling fins and being sufficiently narrow to provide convective heat transfer coefficients and a fin density which are sufficiently high to enable high heat density cooling and, thereby, to enable effective device cooling with aviation fuel as the coolant; coupling a...