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Microchannel cooling using aviation fuels for airborne electronics 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0681343 (1996-07-22)
발명자 / 주소
  • Hamilton Robin E. (Millersville MD) Kennedy Paul G. (Grasonville MD)
출원인 / 주소
  • Northrop Grumman Corporation (Los Angeles CA 02)
인용정보 피인용 횟수 : 88  인용 특허 : 8

초록

Aviation fuel is used as the coolant for a microchannel heat sink for airborne electronics. The use of preexisting aviation fuel as a coolant medium eliminates the weight, size and expense of a separate liquid system dedicated solely to electronics cooling. The heat sink is comprised of a body of ma

대표청구항

A method of extracting heat from an electronics device located in an aircraft, comprising the steps of: thermally coupling said electronics device to a heat sink comprising a body of material having relatively high thermal conductivity, a plurality of microchannels having walls operating as cooling

이 특허에 인용된 특허 (8)

  1. Daikoku Takahiro (Ushiku JPX) Kawasaki Nobuo (Ibaraki JPX) Ashiwake Noriyuki (Tsuchiura JPX) Zushi Shizuo (Hadano JPX), Cooling apparatus for electronic device.
  2. Hatada Toshio (Tsuchiura JPX) Ohashi Shigeo (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Matsushima Hitoshi (Ryugasaki JPX) Sato Motohiro (Ibaraki JPX) Inouye Hiro, Cooling apparatus of electronic device.
  3. Nakanishi Keiichirou (Kokubunji JPX) Yamada Minoru (Iruma JPX) Masaki Akira (Meguro JPX) Imai Kuninori (Shiroyama JPX) Chiba Katuaki (Kokubunji JPX), Cooling module for integrated circuit chips.
  4. Altoz Frank E. (Catonsville MD), Dual mode heat exchanger.
  5. Tanzer Herbert J. (Topanga CA) Goodarzi Gholam A. (Torrance CA) Olaveson Richard J. (Inglewood CA), Integral extended surface cooling of power modules.
  6. Gray Vernon H. (28517 W. Oakland Road Bay Village OH 44140), Rotating heat pipe for air-conditioning.
  7. Naganuma Yoshio (Hitachi JPX) Morihara Atsushi (Katsuta JPX) Ouchi Katsunori (Hitachi JPX) Sato Koji (Hitachi JPX) Yokoyama Hiroshi (Hitachi JPX), Semiconductor cooling module.
  8. Bernhardt Anthony F. (Berkeley CA) Petersen Robert W. (Pleasanton CA), Three dimensional, multi-chip module.

이 특허를 인용한 특허 (88)

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