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Heat pipe and process for manufacturing the same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0638537 (1996-04-26)
우선권정보 JP-0155309 (1995-05-30); JP-0338270 (1995-12-01)
발명자 / 주소
  • Mochizuki Masataka (Tokyo JPX) Ono Motoyuki (Tokyo JPX) Mashiko Koichi (Tokyo JPX) Saito Yuji (Tokyo JPX) Hasegawa Masashi (Tokyo JPX) Nagata Masakatsu (Tokyo JPX)
출원인 / 주소
  • Fujikura Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 56  인용 특허 : 7

초록 ▼

A heat pipe for transferring heat as the latent heat of evaporation to a radiating portion at a lower temperature by heating a heating portion of a container to evaporate a working fluid and by conveying the produced vapor to the radiating portion thereby to condense the vapor. The container is form

대표청구항 ▼

A heat pipe for a working fluid to transfer heat in the form of latent heat of evaporation, comprising a flattened hollow container formed generally into a hollow frustum of a quadrangular pyramid and confining said working fluid, wherein said container includes: a flat heating portion; a flat radia

이 특허에 인용된 특허 (7)

  1. Pravda Milton F. (Baltimore MD) Bienert Walter B. (Baltimore MD), Cooling a heat-producing electrical or electronic component.
    상세보기
  2. Hisano Katsumi (Kanagawa) Sasaki Tomiya (Kanagawa) Ishizuka Masaru (Kanagawa JPX), Cooling apparatus.
    상세보기
  3. Yatsuhashi Motoharu (Funabashi JPX) Mochizuki Masataka (Nagareyama JPX) Sugihara Shinich (Tokyo JPX), Heat exchanger using heat pipes.
    상세보기
  4. Itoh Satomi (14-2-306 Asahigaoka-machi ; Ashiya-shi ; Hyogo JPX), Heat pipe.
    상세보기
  5. Paterson Robert W. (Seneca SC), Integrated circuit cooling device having internal baffle.
    상세보기
  6. Paterson Robert W. (Seneca SC), Integrated circuit cooling device having internal cooling conduit.
    상세보기
  7. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA) Schulte John (Mountain View CA), Optimized integral heat pipe and electronic circuit module arrangement.
    상세보기

이 특허를 인용한 특허 (56)

  1. Searls, Damion T.; Dishongh, Terrance J.; Pullen, David, Apparatus and method for passive phase change thermal management.
    상세보기
  2. Du, Jianjun, Computer power supply.
    상세보기
  3. Lopatinsky,Edward L.; Schaefer,Dan K.; Rosenfeld,Saveliy T.; Fedoseyev,Lev A., Cooler for electronic devices.
    상세보기
  4. Mochizuki Masataka,JPX ; Mashiko Koichi,JPX ; Goto Kazuhiko,JPX ; Saito Yuji,JPX, Cooler for electronic devices.
    상세보기
  5. Mochizuki Masataka,JPX ; Mashiko Koichi,JPX ; Goto Kazuhiko,JPX ; Saito Yuji,JPX ; Eguchi Katsuo,JPX ; Nagaki Yoshihiro,JPX ; Takamiya Akihiro,JPX ; Nguyen Thang Toan,JPX, Cooler for electronic devices.
    상세보기
  6. Guy R. Wagner, Cooling apparatus for electronic devices.
    상세보기
  7. Reyzin, Ilya; Bhatti, Mohinder Singh; Ghosh, Debashis, Cooling assembly.
    상세보기
  8. Meyer, IV, George Anthony; Sun, Chien Hung; Hsieh, Ming Kuei, Cooling device.
    상세보기
  9. Le Gal Claude,FRX, Cooling device for an electronic power system.
    상세보기
  10. Hayong Yun KR; Geunbae Lim KR; Jung Hyun Lee KR; Yukeun Eugene Pak KR, Cooling device using capillary pumped loop.
    상세보기
  11. Yamamoto Masaaki,JPX ; Niekawa Jun,JPX ; Ueki Tatuhiko,JPX ; Ikeda Masami,JPX ; Sasaki Ken,JPX, Cooling device with heat pipe.
    상세보기
  12. Mecredy ; III Henry E. ; Dunens Egons K., Cooling fan with heat pipe-defined fan housing portion.
    상세보기
  13. Chen Yang-Shiau,TWX, Die set for welding a panel like heat pipe to a heat sink.
    상세보기
  14. Bhatia Rakesh ; Regis Karen M., Electronic component lid that provides improved thermal dissipation.
    상세보기
  15. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.
    상세보기
  16. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.
    상세보기
  17. Li Hsi-Shang,TWX ; Hsiao Chen-Ang,TWX, Flat plate heat pipe cooling system for electronic equipment enclosure.
    상세보기
  18. Hul Chun Hsu TW, Geometrical streamline flow guiding and heat-dissipating structure.
    상세보기
  19. Johnson Charles E. ; Morrell Edward A., Heat dissipating enclosure for electronic components.
    상세보기
  20. Hao, Mingliang; Zhao, Jun, Heat dissipation device.
    상세보기
  21. Peng, Xue-Wen; Li, Jun-Hai, Heat dissipation device.
    상세보기
  22. Ishida, Yoshio; Shutou, Akimi, Heat pipe and method for processing the same.
    상세보기
  23. Ishida, Yoshio; Shutou, Akimi; Doi, Takashi, Heat pipe and method for processing the same.
    상세보기
  24. Ikeda, Masami; Kimura, Yuichi, Heat sink.
    상세보기
  25. Johnson, Eric Arthur; Stutzman, Randall Joseph, Heat sink for convection cooling in horizontal applications.
    상세보기
  26. Hashimoto, Mitsuo; Yazawa, Kazuaki; Ishida, Yuichi; Ryoson, Hiroyuki, Heat spreader, electronic apparatus, and heat spreader manufacturing method.
    상세보기
  27. Mochizuki, Masataka; Takenaka, Eiji; Nguyen, Thang; Kaviany, Massoud, Heat transfer device.
    상세보기
  28. Mochizuki,Masataka; Takenaka,Eiji; Nguyen,Thang; Kaviany,Massoud, Heat transfer device.
    상세보기
  29. Shirakami, Takashi; Yamazaki, Naoya; Iino, Kazuhiro; Tada, Yoshiaki; Ueda, Satoshi, Heat transfer mechanism, heat dissipation system, and communication apparatus.
    상세보기
  30. Win-Haw, Chen; Mao-Ching, Lin, Heat-dissipating device.
    상세보기
  31. Meyer, IV, George Anthony; Sun, Chien-Hung; Chen, Chieh-Ping; Lu, Yung-Tai; Hsieh, Ming-Kuei, Heat-dissipating module having loop-type vapor chamber.
    상세보기
  32. Dussinger Peter M. ; Myers Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
    상세보기
  33. Dussinger, Peter M.; Myers, Thomas L.; Rosenfeld, John H.; Minnerly, Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.
    상세보기
  34. Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
    상세보기
  35. Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
    상세보기
  36. Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
    상세보기
  37. Dussinger,Peter M.; Myers,Thomas L.; Rosenfeld,John H.; Minnerly,Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.
    상세보기
  38. Walker, Jay S.; Jorasch, James A.; Sparico, Thomas M.; Gelman, Geoffrey M., Method and apparatus for directing a game in accordance with speed of play.
    상세보기
  39. Brunschwiler, Thomas J.; Kloter, Urs; Linderman, Ryan Joseph; Michel, Bruno; Rothuizen, Hugo E.; Waelchli, Reio, Method and device for cooling a heat generating component.
    상세보기
  40. Hsu,Hul Chun, Method for forming end surface of heat pipe and structure thereof.
    상세보기
  41. Zheng, Wen-Chun, Nearly isothermal heat pipe heat sink.
    상세보기
  42. Bhatti, Mohinder Singh; Reyzin, Ilya; Joshi, Shrikant Mukund, Orientation insensitive thermosiphon capable of operation in upside down position.
    상세보기
  43. Roper, Christopher S.; Cumberland, Robert W., Planar heat pipe with architected core and vapor tolerant arterial wick.
    상세보기
  44. Ikeda Masami,JPX ; Yamamoto Masaaki,JPX ; Ueki Tatsuhiko,JPX ; Sasaki Ken,JPX, Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe.
    상세보기
  45. Hanazeder, Erwin, Pneumatic tube station.
    상세보기
  46. Nadal, Vincent T., Solid fuel cooking device.
    상세보기
  47. Chun-Hsin Lu TW; Pao-Lung Lin TW; Nien-Tien Cheng TW, Thermal module inspecting device.
    상세보기
  48. Reyzin, Ilya; Bhatti, Mohinder Singh; Ghosh, Debashis; Joshi, Shrikant Mukund, Thermosiphon for electronics cooling with high performance boiling and condensing surfaces.
    상세보기
  49. Rice, Jeremy; Spaulding, Jeffrey S.; Nguyen, Huan D., Thermosiphon systems for electronic devices.
    상세보기
  50. Rice, Jeremy; Spaulding, Jeffrey S.; Nguyen, Huan D., Thermosiphon systems for electronic devices.
    상세보기
  51. Rice, Jeremy, Thermosiphon systems with nested tubes.
    상세보기
  52. Rice, Jeremy, Thermosiphon systems with nested tubes.
    상세보기
  53. Siu, Wing Ming, Vapor augmented heatsink with multi-wick structure.
    상세보기
  54. Searls, Damion T.; Dishongh, Terrance J.; Dujari, Prateek J.; Lian, Bin, Vapor chamber active heat sink.
    상세보기
  55. Busch, Diane S., Vapor chamber heat sink with cross member and protruding boss.
    상세보기
  56. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Wick having liquid superheat tolerance and being resistant to back-conduction, evaporator employing a liquid superheat tolerant wick, and loop heat pipe incorporating same.
    상세보기

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