이 특허를 인용한 특허 (499)

1. Pacetti, Stephen Dirk; DesNoyer, Jessica; Chen, Yung Ming; Kleiner, Lothar; Hossainy, Syed F. A., Abluminal, multilayer coating constructs for drug-delivery stents.

   상세보기
2. Kolics, Artur; Petrov, Nicolai; Ting, Chiu; Ivanov, Igor, Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper.

   상세보기
3. Paik,Young J., Adjusting manufacturing process control parameter using updated process threshold derived from uncontrollable error.

   상세보기
4. Nemani, Srinivas D.; Koshizawa, Takehito, Air gap process.

   상세보기
5. Purayath, Vinod R.; Ingle, Nitin K., Air gaps between copper lines.

   상세보기
6. Kang, Sean; Ko, Jungmin; Luere, Oliver, Airgap formation with damage-free copper.

   상세보기
7. Bera, Holger; Brunner, Heiko, Alkaline plating bath for electroless deposition of cobalt alloys.

   상세보기
8. Lee, Wei Ti; Hassan, Mohd Fadzli Anwar; Guo, Ted; Yu, Sang-Ho, Aluminum contact integration on cobalt silicide junction.

   상세보기
9. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum oxide selective etch.

   상세보기
10. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum selective etch.

    상세보기
11. Xue, Jun; Hsu, Ching-Mei; Li, Zihui; Godet, Ludovic; Wang, Anchuan; Ingle, Nitin K., Anisotropic gap etch.

    상세보기
12. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.

    상세보기
13. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.

    상세보기
14. Dubin, Valery M.; Caillouette, Vincent R.; Thomas, Christopher D.; Cheng, Chin-Chang, Apparatus and method for electroless spray deposition.

    상세보기
15. Chen, LinLin, Apparatus and method for electrolytically depositing a metal on a workpiece.

    상세보기
16. Chen, Linlin, Apparatus and method for electrolytically depositing copper on a semiconductor workpiece.

    상세보기
17. Chen, Linlin; Taylor, Thomas, Apparatus and method for electrolytically depositing copper on a semiconductor workpiece.

    상세보기
18. Chen, Linlin; Taylor, Thomas, Apparatus and method for electrolytically depositing copper on a semiconductor workpiece.

    상세보기
19. Chen, LinLin, Apparatus and method for electrolytically depositing copper on a workpiece.

    상세보기
20. Chen, Yung Ming; Tang, Fuh Wei, Apparatus and method for electrostatic coating of an abluminal stent surface.

    상세보기
21. Lopatin Sergey D. ; Cheung Robin W., Apparatus and method of encapsulated copper (Cu) Interconnect formation.

    상세보기
22. Dubin, Valery M.; Moon, Peter K., Apparatus for an improved air gap interconnect structure.

    상세보기
23. Lubomirsky,Dmitry; Shanmugasundram,Arulkumar; Pancham,Ian A.; Lopatin,Sergey, Apparatus for electroless deposition.

    상세보기
24. Lubomirsky, Dmitry; Shanmugasundram, Arulkumar; Ellwanger, Russell; Pancham, Ian A.; Cheboli, Ramakrishna; Weidman, Timothy W., Apparatus for electroless deposition of metals onto semiconductor substrates.

    상세보기
25. Lubomirsky, Dmitry; Shanmugasundram, Arulkumar; Pancham, Ian A., Apparatus for electroless deposition of metals onto semiconductor substrates.

    상세보기
26. Schwarm,Alexander T., Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools.

    상세보기
27. Ivanov, Igor C., Barrier layer configurations and methods for processing microelectronic topographies having barrier layers.

    상세보기
28. Ivanov, Igor C., Barrier layer configurations and methods for processing microelectronic topographies having barrier layers.

    상세보기
29. Ivanov, Igor C., Barrier layer configurations and methods for processing microelectronic topographies having barrier layers.

    상세보기
30. Datta, Amit, Barrier layer for electrical connectors and methods of applying the layer.

    상세보기
31. Yang, Chih-Chao; Nitta, Satya V., Bilayer metal capping layer for interconnect applications.

    상세보기
32. Yang, Chih-Chao; Nitta, Satya V., Bilayer metal capping layer for interconnect applications.

    상세보기
33. Benjaminson, David; Lubomirsky, Dmitry; Math, Ananda Seelavanth; Natarajan, Saravanakumar; Chourey, Shubham, Bolted wafer chuck thermal management systems and methods for wafer processing systems.

    상세보기
34. Benjaminson, David; Lubomirsky, Dmitry; Math, Ananda Seelavanth; Natarajan, Saravanakumar; Chourey, Shubham, Bolted wafer chuck thermal management systems and methods for wafer processing systems.

    상세보기
35. He, Hong; Li, Juntao; Wang, Junli; Yang, Chih-Chao, Bottom-up metal gate formation on replacement metal gate finFET devices.

    상세보기
36. Adkisson, James W.; Gambino, Jeffrey P.; Jaffe, Mark D.; Leidy, Robert K.; Rassel, Richard J.; Stamper, Anthony K., CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom.

    상세보기
37. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.

    상세보기
38. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.

    상세보기
39. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.

    상세보기
40. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.

    상세보기
41. Yakobson,Eric; Hurtubise,Richard; Witt,Christian; Chen,Qingyun, Capping of metal interconnects in integrated circuit electronic devices.

    상세보기
42. Yakobson,Eric; Hurtubise,Richard; Witt,Christian; Chen,Qingyun, Capping of metal interconnects in integrated circuit electronic devices.

    상세보기
43. Lubomirsky, Dmitry, Chamber with flow-through source.

    상세보기
44. Lubomirsky, Dmitry, Chamber with flow-through source.

    상세보기
45. Liang, Qiwei; Chen, Xinglong; Chuc, Kien; Lubomirsky, Dmitry; Park, Soonam; Yang, Jang-Gyoo; Venkataraman, Shankar; Tran, Toan; Hinckley, Kimberly; Garg, Saurabh, Chemical control features in wafer process equipment.

    상세보기
46. Liang, Qiwei; Chen, Xinglong; Chuc, Kien; Lubomirsky, Dmitry; Park, Soonam; Yang, Jang-Gyoo; Venkataraman, Shankar; Tran, Toan; Hinckley, Kimberly; Garg, Saurabh, Chemical control features in wafer process equipment.

    상세보기
47. Sambucetti, Carlos Juan; Chen, Xiaomeng; Seo, Soon-Cheon; Agarwala, Birenda Nath; Hu, Chao-Kun; Lustig, Naftali Eliahu; Greco, Stephen Edward, Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect.

    상세보기
48. Wang, Xikun; Pandit, Mandar; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K.; Liu, Jie, Chlorine-based hardmask removal.

    상세보기
49. Valverde,Charles; Petrov,Nicolai; Yakobson,Eric; Chen,Qingyun; Paneccasio, Jr.,Vincent; Hurtubise,Richard; Witt,Christian, Cobalt and nickel electroless plating in microelectronic devices.

    상세보기
50. Nogami,Takeshi, Cobalt tungsten phosphate used to fill voids arising in a copper metallization process.

    상세보기
51. Shacham-Diamand, Yosi; Sverdlov, Yelena, Cobalt tungsten phosphorus electroless deposition process and materials.

    상세보기
52. Wang, Xikun; Cui, Zhenjiang; Park, Soonam; Ingle, Nitin K., Cobalt-containing material removal.

    상세보기
53. Man, Hau-chung; Ng, Wing-yan; Yeung, Chi-hung; Lee, Chi-yung; Siu, Cho-lung; Tsui, Rick Y. C.; Yeung, Kinny L. K., Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles.

    상세보기
54. Bu, Xiaomei; See, Alex; Zhang, Fan; Hui, Jane; Lee, Tae Jong; Hsia, Liang Choo, Combined copper plating method to improve gap fill.

    상세보기
55. Wirth, Alexandra, Compositions for the currentless deposition of ternary materials for use in the semiconductor industry.

    상세보기
56. Wirth, Alexandra, Compositions for the currentless deposition of ternary materials for use in the semiconductor industry.

    상세보기
57. Arackaparambil,John F.; Chi,Tom; Chow,Billy; D'Souza,Patrick M.; Hawkins,Parris; Huang,Charles; Jensen,Jett; Krishnamurthy,Badri N.; Kulkarni,Pradeep M.; Kulkarni,Prakash M.; Lin,Wen Fong; Mohan,Shan, Computer integrated manufacturing techniques.

    상세보기
58. Arackaparambil,John F.; Chi,Tom; Chow,Billy; D'Souza,Patrick M.; Hawkins,Parris; Huang,Charles; Jensen,Jett; Krishnamurthy,Badri N.; Kulkarni,Pradeep M.; Kulkarni,Prakash M.; Lin,Wen Fong; Mohan,Shan, Computer integrated manufacturing techniques.

    상세보기
59. Lubomirsky, Dmitry; Kim, Sung Je, Conditioned semiconductor system parts.

    상세보기
60. Geusic, Joseph E.; Reinberg, Alan R., Conductive material patterning methods.

    상세보기
61. Geusic, Joseph E.; Reinberg, Alan R., Conductive material patterning methods.

    상세보기
62. Geusic,Joseph E.; Reinberg,Alan R., Conductive material patterning methods.

    상세보기
63. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Conformal oxide dry etch.

    상세보기
64. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Conformal oxide dry etch.

    상세보기
65. Weidman, Timothy W.; Wijekoon, Kapila P.; Zhu, Zhize; Gelatos, Avgerinos V. (Jerry); Khandelwal, Amit; Shanmugasundram, Arulkumar; Yang, Michael X.; Mei, Fang; Moghadam, Farhad K., Contact metallization scheme using a barrier layer over a silicide layer.

    상세보기
66. Hussein,Makarem A., Continuous metal interconnects.

    상세보기
67. Paik, Young Joseph, Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life.

    상세보기
68. Paik,Young Joseph, Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life.

    상세보기
69. Hues, Steven M.; Lovejoy, Michael L.; Mathew, Varughese, Controlled electroless plating.

    상세보기
70. Hsiung Chiung-Sheng,TWX ; Hsieh Wen-Yi,TWX ; Lur Water,TWX, Copper damascene technology for ultra large scale integration circuits.

    상세보기
71. Liu, Yu Wei; Tsai, Wen Ching; Huang, Kuo Yu; Lin, Hui Fen, Copper gate electrode of liquid crystal display device and method of fabricating the same.

    상세보기
72. Liu, Yu-Wei; Tsai, Wen-Ching; Huang, Kuo-Yu; Lin, Hui-Fen, Copper gate electrode of liquid crystal display device and method of fabricating the same.

    상세보기
73. Farrar Paul A., Copper metallurgy in integrated circuits.

    상세보기
74. Farrar, Paul A., Copper metallurgy in integrated circuits.

    상세보기
75. Shacham Diamand,Yossi; Sverdlov,Yelena, Copper molybdenum electroless deposition process and materials.

    상세보기
76. Hoinkis, Mark; Yan, Chun; Miyazoe, Hiroyuki; Joseph, Eric, Copper residue chamber clean.

    상세보기
77. Nagai, Mizuki; Okuyama, Shuichi; Kimizuka, Ryoichi; Kobayashi, Takeshi, Copper-plating liquid, plating method and plating apparatus.

    상세보기
78. Leng, Yaojian; Chen, Linlin, Corrosion resistance for copper interconnects.

    상세보기
79. Chen, Hsueh-Chung H.; He, Hong; Li, Juntao; Yang, Chih-Chao; Yin, Yunpeng, Critical dimension shrink through selective metal growth on metal hardmask sidewalls.

    상세보기
80. Chen, Qingyun; Valverde, Charles; Paneccasio, Vincent; Petrov, Nicolai; Stritch, Daniel; Witt, Christian; Hurtubise, Richard, Defectivity and process control of electroless deposition in microelectronics applications.

    상세보기
81. Chen, Qingyun; Valverde, Charles; Paneccasio, Vincent; Petrov, Nicolai; Stritch, Daniel; Witt, Christian; Hurtubise, Richard, Defectivity and process control of electroless deposition in microelectronics applications.

    상세보기
82. Chen, Qingyun; Valverde, Charles; Paneccasio, Vincent; Petrov, Nicolai; Stritch, Daniel; Witt, Christian; Hurtubise, Richard, Defectivity and process control of electroless deposition in microelectronics applications.

    상세보기
83. Chen,Qingyun; Valverde,Charles; Paneccasio,Vincent; Petrov,Nicolai; Stritch,Daniel; Witt,Christian; Hurtubise,Richard, Defectivity and process control of electroless deposition in microelectronics applications.

    상세보기
84. Zhu, Lina; Kang, Sean S.; Nemani, Srinivas D.; Kao, Chia-Ling, Delicate dry clean.

    상세보기
85. Li, Dong, Deposition of ruthenium or ruthenium dioxide.

    상세보기
86. Edelstein, Daniel C.; Colburn, Matthew E.; Cooney, III, Edward C.; Dalton, Timothy J.; Fitzsimmons, John A.; Gambino, Jeffrey P.; Huang, Elbert E.; Lane, Michael W.; McGahay, Vincent J.; Nicholson, Lee M.; Nitta, Satyanarayana V.; Purushothaman, Sampath; Sankaran, Sujatha; Shaw, Thomas M.; Simon, Andrew H.; Stamper, Anthony K., Device and methodology for reducing effective dielectric constant in semiconductor devices.

    상세보기
87. Edelstein, Daniel C.; Colburn, Matthew E.; Cooney, III, Edward C.; Dalton, Timothy J.; Fitzsimmons, John A.; Gambino, Jeffrey P.; Huang, Elbert E.; Lane, Michael W.; McGahay, Vincent J.; Nicholson, Lee M.; Nitta, Satyanarayana V.; Purushothaman, Sampath; Sankaran, Sujatha; Shaw, Thomas M.; Simon, Andrew H.; Stamper, Anthony K., Device and methodology for reducing effective dielectric constant in semiconductor devices.

    상세보기
88. Ren, He; Naik, Mehul B.; Cao, Yong; Shek, Mei-yee, Dielectric/metal barrier integration to prevent copper diffusion.

    상세보기
89. Ren, He; Naik, Mehul B.; Cao, Yong; Shek, Mei-yee; Cheng, Yana; Kesapragada, Sree Rangasai V., Dielectric/metal barrier integration to prevent copper diffusion.

    상세보기
90. Park, Seung H.; Wang, Yunyu; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Differential silicon oxide etch.

    상세보기
91. Park, Seung H.; Wang, Yunyu; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Differential silicon oxide etch.

    상세보기
92. Yang, Chih-Chao; Gignac, Lynne M.; Hu, Chao-Kun; Mittal, Surbhi, Discontinuous/non-uniform metal cap structure and process for interconnect integration.

    상세보기
93. Yang, Chih-Chao; Gignac, Lynne M.; Hu, Chao-Kun; Mittal, Surbhi, Discontinuous/non-uniform metal cap structure and process for interconnect integration.

    상세보기
94. Purayath, Vinod R.; Wang, Anchuan; Ingle, Nitin K., Dopant etch selectivity control.

    상세보기
95. Pore, Viljami J.; Haukka, Suvi P.; Blomberg, Tom E.; Tois, Eva E., Doped metal germanide and methods for making the same.

    상세보기
96. Zhang, Jingchun; Ingle, Nitin K.; Wang, Anchuan, Dry etch process.

    상세보기
97. Kim, Sang Hyuk; Yang, Dongqing; Lee, Young S.; Jung, Weon Young; Kim, Sang-jin; Hsu, Ching-Mei; Wang, Anchuan; Ingle, Nitin K., Dry-etch for selective oxidation removal.

    상세보기
98. Wang, Xikun; Hsu, Ching-Mei; Ingle, Nitin K.; Li, Zihui; Wang, Anchuan, Dry-etch for selective tungsten removal.

    상세보기
99. Wang, Xikun; Hsu, Ching-Mei; Ingle, Nitin K.; Li, Zihui; Wang, Anchuan, Dry-etch for selective tungsten removal.

    상세보기
100. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Wang, Yunyu; Lee, Young, Dry-etch for silicon-and-carbon-containing films.

     상세보기
101. Ren, He; Yang, Jang-Gyoo; Baek, Jonghoon; Wang, Anchuan; Park, Soonam; Garg, Saurabh; Chen, Xinglong; Ingle, Nitin K., Dry-etch selectivity.

     상세보기
102. Ren, He; Yang, Jang-Gyoo; Baek, Jonghoon; Wang, Anchuan; Park, Soonam; Garg, Saurabh; Chen, Xinglong; Ingle, Nitin K., Dry-etch selectivity.

     상세보기
103. Zhao Bin ; Vasudev Prahalad K. ; Horwath Ronald S. ; Seidel Thomas E. ; Zeitzoff Peter M., Dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer.

     상세보기
104. Li, Baozhen; Yang, Chih-Chao, Dual damascene structure with liner.

     상세보기
105. Li, Baozhen; Yang, Chih-Chao, Dual damascene structure with liner.

     상세보기
106. Cho, Tae Seung; Sen, Yi-Heng; Park, Soonam; Lubomirsky, Dmitry, Dual discharge modes operation for remote plasma.

     상세보기
107. Yang, Chih-Chao; Yang, Haining; Wong, Keith Kwong Hon, Dual liner capping layer interconnect structure.

     상세보기
108. Yang, Chih-Chao; Yang, Haining; Wong, Keith Kwong Hon, Dual liner capping layer interconnect structure.

     상세보기
109. Yang, Chih Chao; Yang, Haining; Wong, Keith Kwong Hon, Dual liner capping layer interconnect structure and method.

     상세보기
110. Ward, Nicholas A.; Danielson, Richard; Corey, David B., Dynamic control of wafer processing paths in semiconductor manufacturing processes.

     상세보기
111. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.

     상세보기
112. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.

     상세보기
113. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.

     상세보기
114. Paik, Young Jeen, Dynamic offset and feedback threshold.

     상세보기
115. Chi, Yueh-Shian; Hawkins, Parris C M; Huang, Charles Q., Dynamic subject information generation in message services of distributed object systems.

     상세보기
116. Chi,Yueh shian T.; Hawkins,Parris C. M.; Huang,Charles Q., Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility.

     상세보기
117. Stevens,Joseph J.; Lubomirsky,Dmitry; Pancham,Ian; Olgado,Donald J. K.; Grunes,Howard E.; Mok,Yeuk Fai Edwin, Electroless deposition apparatus.

     상세보기
118. Padhi, Deenesh; Yahalom, Joseph; Ramanathan, Sivakami; McGuirk, Chris R.; Gandikota, Srinivas; Dixit, Girish, Electroless deposition method.

     상세보기
119. Padhi, Deenesh; Yahalom, Joseph; Ramanathan, Sivakami; McGuirk, Chris R.; Gandikota, Srinivas; Dixit, Girish, Electroless deposition method.

     상세보기
120. Gandikota, Srinivas; McGuirk, Chris R.; Padhi, Deenesh; Malik, Muhammad Atif; Ramanathan, Sivakami; Dixit, Girish A.; Cheung, Robin, Electroless deposition method over sub-micron apertures.

     상세보기
121. Stewart, Michael P.; Weidman, Timothy W.; Shanmugasundram, Arulkumar; Eaglesham, David J., Electroless deposition process on a silicon contact.

     상세보기
122. Chebiam, Ramanan V.; Dubin, Valery M., Electroless plating bath composition and method of using.

     상세보기
123. Chebiam, Ramanan V.; Dubin, Valery M., Electroless plating bath composition and method of using.

     상세보기
124. Inoue, Hiroaki; Nakamura, Kenji; Matsumoto, Moriji, Electroless plating liquid and semiconductor device.

     상세보기
125. Inoue, Hiroaki; Nakamura, Kenji; Matsumoto, Moriji, Electroless plating liquid and semiconductor device.

     상세보기
126. Kong, Bob; Li, Nanhai, Electroless plating solution and process.

     상세보기
127. Chebiam,Ramanan V.; Dubin,Valery M., Electroless plating structure.

     상세보기
128. Farrar,Paul A., Electronic apparatus having a core conductive structure within an insulating layer.

     상세보기
129. Michael F. Stumborg ; Francisco Santiago ; Tak Kin Chu ; Kevin A. Boulais, Electronic devices with a barrier film and process for making same.

     상세보기
130. Stumborg, Michael F.; Santiago, Francisco; Chu, Tak Kin; Boulais, Kevin A., Electronic devices with barium barrier film and process for making same.

     상세보기
131. Stumborg, Michael F.; Santiago, Francisco; Chu, Tak Kin; Boulais, Kevin A., Electronic devices with cesium barrier film and process for making same.

     상세보기
132. Stumborg Michael F. ; Santiago Francisco ; Chu Tak Kin ; Boulais Kevin A., Electronic devices with composite atomic barrier film and process for making same.

     상세보기
133. Stumborg, Michael F.; Santiago, Francisco; Chu, Tak Kin; Boulais, Kevin A., Electronic devices with composite atomic barrier film and process for making same.

     상세보기
134. Tak Kin Chu ; Francisco Santiago ; Kevin A. Boulais, Electronic devices with diffusion barrier and process for making same.

     상세보기
135. Stumborg Michael F. ; Santiago Francisco ; Chu Tak Kin ; Boulais Kevin A., Electronic devices with rubidium barrier film and process for making same.

     상세보기
136. Stumborg Michael F. ; Santiago Francisco ; Chu Tak Kin ; Boulais Kevin A., Electronic devices with strontium barrier film and process for making same.

     상세보기
137. Stumborg Michael F. ; Santiago Francisco ; Chu Tak Kin ; Boulais Kevin A., Electronic devices with strontium barrier film and process for making same.

     상세보기
138. Cabral, Jr.,Cyril; Chiras,Stefanie R.; Cooper,Emanuel I.; Deligianni,Hariklia; Kellock,Andrew J.; Rubino,Judith M.; Tsai,Roger Y., Electroplated CoWP composite structures as copper barrier layers.

     상세보기
139. Cabral, Jr.,Cyril; Chiras,Stefanie R.; Cooper,Emanuel; Deligianni,Hariklia; Kellock,Andrew J.; Rubino,Judith M.; Tsai,Roger Y., Electroplated CoWP composite structures as copper barrier layers.

     상세보기
140. Haukka, Suvi P.; Tuominen, Marko J.; Rahtu, Antti, Enhanced deposition of noble metals.

     상세보기
141. Haukka, Suvi P.; Tuominen, Marko J.; Rahtu, Antti, Enhanced deposition of noble metals.

     상세보기
142. Haukka, Suvi P.; Tuominen, Marko J.; Rahtu, Antti, Enhanced deposition of noble metals.

     상세보기
143. Ingle, Nitin K.; Lubomirsky, Dmitry; Chen, Xinglong; Venkataraman, Shankar, Enhanced etching processes using remote plasma sources.

     상세보기
144. Korolik, Mikhail; Ingle, Nitin K.; Zhang, Jingchun; Wang, Anchuan; Liu, Jie, Etch suppression with germanium.

     상세보기
145. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Even tungsten etch for high aspect ratio trenches.

     상세보기
146. Krishnamurthy,Badri N.; Hawkins,Parris C. M., Experiment management system, method and medium.

     상세보기
147. Cheung Robin ; Lopatin Sergey, Fabrication of a via plug having high aspect ratio with a diffusion barrier layer effectively surrounding the via plug.

     상세보기
148. Koos, Daniel A.; Mayer, Steven T.; Park, Heung L.; Cleary, Timothy Patrick; Mountsier, Thomas, Fabrication of semiconductor interconnect structure.

     상세보기
149. Mayer, Steven T.; Koos, Daniel A.; Webb, Eric, Fabrication of semiconductor interconnect structure.

     상세보기
150. Mayer, Steven T.; Koos, Daniel A.; Webb, Eric, Fabrication of semiconductor interconnect structure.

     상세보기
151. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.; Prabhu, Gopalakrishna B., Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles.

     상세보기
152. Shanmugasundram,Arulkumar P.; Schwarm,Alexander T.; Prabhu,Gopalakrishna B., Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles.

     상세보기
153. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.; Iliopoulos, Ilias; Parkhomovsky, Alexander; Seamons, Martin J., Feedback control of plasma-enhanced chemical vapor deposition processes.

     상세보기
154. Paik,Young Joseph, Feedforward and feedback control for conditioning of chemical mechanical polishing pad.

     상세보기
155. Purayath, Vinod R.; Ingle, Nitin K., Flash gate air gap.

     상세보기
156. Pandit, Mandar; Wang, Xikun; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Fluorine-based hardmask removal.

     상세보기
157. Farrar Paul A., Forming submicron integrated-circuit wiring from gold, silver, copper and other metals.

     상세보기
158. Farrar Paul A., Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals.

     상세보기
159. Farrar, Paul A., Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals.

     상세보기
160. Park, Seung; Wang, Xikun; Liu, Jie; Wang, Anchuan; Kim, Sang-jin, Gas-phase tungsten etch.

     상세보기
161. Kim, Sung Je; Kalita, Laksheswar; Pareek, Yogita; Kadam, Ankur; Goradia, Prerna Sonthalia; Thakur, Bipin; Lubomirsky, Dmitry, Generation of compact alumina passivation layers on aluminum plasma equipment components.

     상세보기
162. Korolik, Mikhail; Ingle, Nitin; Kioussis, Dimitri, Germanium etching systems and methods.

     상세보기
163. Bonilla, Griselda; Dimitrakopoulos, Christos D.; Grill, Alfred; Hannon, James B.; Lin, Qinghuang; Neumayer, Deborah A.; Oida, Satoshi; Ott, John A.; Pfeiffer, Dirk, Graphene cap for copper interconnect structures.

     상세보기
164. Cho, Tae; Kang, Sang Won; Yang, Dongqing; Lu, Raymond W.; Hillman, Peter; Celeste, Nicholas; Tan, Tien Fak; Park, Soonam; Lubomirsky, Dmitry, Grooved insulator to reduce leakage current.

     상세보기
165. Tran, Toan Q.; Malik, Sultan; Lubomirsky, Dmitry; Roy, Shambhu N.; Kobayashi, Satoru; Cho, Tae Seung; Park, Soonam; Venkataraman, Shankar, High temperature chuck for plasma processing systems.

     상세보기
166. Chen, Zhijun; Li, Zihui; Ingle, Nitin K.; Wang, Anchuan; Venkataraman, Shankar, Highly selective doped oxide removal method.

     상세보기
167. Farrar,Paul A., Hplasma treatment.

     상세보기
168. Chen, Xinglong; Lubomirsky, Dmitry; Venkataraman, Shankar, Insulated semiconductor faceplate designs.

     상세보기
169. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.

     상세보기
170. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.

     상세보기
171. Farrar, Paul A., Integrated circuit and seed layers.

     상세보기
172. Farrar,Paul A., Integrated circuit and seed layers.

     상세보기
173. Farrar,Paul A., Integrated circuit and seed layers.

     상세보기
174. Yang, Chih-Chao; Horak, David V.; Koburger, Charles W.; Ponoth, Shom, Integrated circuit structure having selectively formed metal cap.

     상세보기
175. Yang, Chih-Chao; Horak, David V.; Koburger, III, Charles W.; Ponoth, Shom, Integrated circuit structure having selectively formed metal cap.

     상세보기
176. Dubin,Valery M., Integrated circuit with metal layer having carbon nanotubes and methods of making same.

     상세보기
177. Farrar Paul A., Integrated circuit with oxidation-resistant polymeric layer.

     상세보기
178. Purayath, Vinod R.; Thakur, Randhir; Ingle, Nitin K., Integrated oxide and nitride recess for better channel contact in 3D architectures.

     상세보기
179. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated oxide recess and floating gate fin trimming.

     상세보기
180. Shanmugasundram,Arulkumar P.; Schwarm,Alexander T., Integrating tool, module, and fab level control.

     상세보기
181. Reiss,Terry P.; Shanmugasundram,Arulkumar P.; Schwarm,Alexander T., Integration of fault detection with run-to-run control.

     상세보기
182. Yang, Chih Chao; Clevenger, Lawrence A.; Cowley, Andrew P.; Dalton, Timothy J.; Yoon, Meeyoung H., Interconnect structure.

     상세보기
183. Yang, Chih Chao; Clevenger, Lawrence A.; Cowley, Andrew P.; Dalton, Timothy J.; Yoon, Meeyoung H., Interconnect structure and method of fabrication of same.

     상세보기
184. Yang,Chih Chao; Clevenger,Lawrence A.; Cowley,Andrew P.; Dalton,Timothy J.; Yoon,Meeyoung H., Interconnect structure and method of fabrication of same.

     상세보기
185. Ou, Ya; Ponoth, Shom; Spooner, Terry A., Interconnect structure and method of making same.

     상세보기
186. Ou, Ya; Ponoth, Shom; Spooner, Terry A., Interconnect structure and method of making same.

     상세보기
187. Ou, Ya; Ponoth, Shom; Spooner, Terry A., Interconnect structure and method of making same.

     상세보기
188. Hsu, Louis L.; Tonti, William R.; Yang, Chih-Chao, Interconnect structure containing various capping materials for electrical fuse and other related applications.

     상세보기
189. Hsu, Louis L.; Tonti, William R.; Yang, Chih-Chao, Interconnect structure containing various capping materials for programmable electrical fuses.

     상세보기
190. Darnon, Maxime; Gambino, Jeffrey P.; Huang, Elbert E.; Lin, Qinghuang, Interconnect structure fabricated without dry plasma etch processing.

     상세보기
191. Horak, David V.; Ponoth, Shom; Yang, Chih-Chao, Interconnect structure for electromigration enhancement.

     상세보기
192. Lopatin, Sergey; Wang, Fei; Schonauer, Diana; Avanzino, Steven C., Interconnect structure formed in porous dielectric material with minimized degradation and electromigration.

     상세보기
193. Yang, Chih Chao; Wang, Ping Chuan; Wang, Yun Yu, Interconnect structure having enhanced electromigration reliability and a method of fabricating same.

     상세보기
194. Yang, Chih-Chao; Wang, Ping-Chuan; Wang, Yun-Yu, Interconnect structure having enhanced electromigration reliability and a method of fabricating same.

     상세보기
195. Dubin, Valery M.; Thomas, Christopher D.; McGregor, Paul; Datta, Madhav, Interconnect structures and a method of electroless introduction of interconnect structures.

     상세보기
196. Dubin, Valery M.; Cheng, Chin-Chang; Hussein, Makarem; Nguyen, Phi L.; Brain, Ruth A., Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs.

     상세보기
197. Yang, Chih-Chao; Cohen, Stephan A., Interconnect structures containing nitrided metallic residues.

     상세보기
198. Yang, Chih-Chao; Cohen, Stephan A., Interconnect structures containing nitrided metallic residues.

     상세보기
199. Wong,Kwong Hon; Hsu,Louis C.; Dalton,Timothy J.; Radens,Carol; Yang,Chih Chao; Clevenger,Lawrence A.; Standaert,Theodorus E., Interconnect structures with encasing cap and methods of making thereof.

     상세보기
200. Yang, Chih-Chao; Chanda, Kaushik; Edelstein, Daniel C., Interconnect structures, design structure and method of manufacture.

     상세보기
201. Wang,Xinming; Takagi,Daisuke; Tashiro,Akihiko; Fukunaga,Yukio; Fukunaga,Akira, Interconnects forming method and interconnects forming apparatus.

     상세보기
202. Wang,Xinming; Takagi,Daisuke; Tashiro,Akihiko; Fukunaga,Yukio; Fukunaga,Akira, Interconnects forming method and interconnects forming apparatus.

     상세보기
203. Sapre, Kedar; Ingle, Nitin; Tang, Jing, Intrench profile.

     상세보기
204. Sapre, Kedar; Ingle, Nitin; Tang, Jing, Intrench profile.

     상세보기
205. Nguyen, Son T.; Lubomirsky, Dmitry, Layered thin film heater and method of fabrication.

     상세보기
206. Wu, Hui-Jung; Knisley, Thomas Joseph; Shankar, Nagraj; Shen, Meihua; Hoang, John; Sharma, Prithu, Liner and barrier applications for subtractive metal integration.

     상세보기
207. Wu, Hui-Jung; Knisley, Thomas Joseph; Shankar, Nagraj; Shen, Meihua; Hoang, John; Sharma, Prithu, Liner and barrier applications for subtractive metal integration.

     상세보기
208. Brigante,Jeffrey Alan; He,Zhong Xiang; Waterhouse,Barbara Ann; White,Eric Jeffrey, Low cost bonding pad and method of fabricating same.

     상세보기
209. Gambino, Jeffrey P.; Gill, Jason P.; Smith, Sean; Wynne, Jean E., Low leakage metal-containing cap process using oxidation.

     상세보기
210. Gambino, Jeffrey P.; Gill, Jason P.; Smith, Sean; Wynne, Jean E., Low leakage metal-containing cap process using oxidation.

     상세보기
211. Lopatin Sergey D., Low resistivity semiconductor barrier layer manufacturing method.

     상세보기
212. Lopatin Sergey D., Low resistivity semiconductor barrier layers and manufacturing method therefor.

     상세보기
213. Hsu, Ching-Mei; Ingle, Nitin K.; Hamana, Hiroshi; Wang, Anchuan, Low temperature gas-phase carbon removal.

     상세보기
214. Nuetzel,Joachim; Ning,Xian Jay; Wille,William C., Magnetic random access memory and method of fabricating thereof.

     상세보기
215. Restaino,Darryl D.; Canaperi,Donald F.; Rubino,Judith M.; Smith,Sean P. E.; Henry,Richard O.; Fluegel,James E.; Krishnan,Mahadevaiyer, Manufacturable CoWP metal cap process for copper interconnects.

     상세보기
216. Restaino,Darryl D.; Canaperi,Donald F.; Rubino,Judith M.; Smith,Sean P. E.; Henry,Richard O.; Fluegel,James E.; Krishnan,Mahadevaiyer, Manufacturable CoWP metal cap process for copper interconnects.

     상세보기
217. Farrar, Paul A., Mask on a polymer having an opening width less than that of the opening in the polymer.

     상세보기
218. Purayath, Vinod R.; Thakur, Randhir; Ingle, Nitin K., Metal air gap.

     상세보기
219. Yang, Chih-Chao; Bergendahl, Marc A.; Holmes, Steven J.; Horak, David V.; Koburger, III, Charles W.; Ponoth, Shom, Metal alloy cap integration.

     상세보기
220. Yang, Chih-Chao; Chanda, Kaushik; Edelstein, Daniel C., Metal cap for back end of line (BEOL) interconnects, design structure and method of manufacture.

     상세보기
221. Yang, Chih-Chao; Wang, Ping-Chuan; Wang, Yun-Yu, Metal cap for interconnect structures.

     상세보기
222. Yang, Chih-Chao; Edelstein, Daniel C., Metal cap with ultra-low k dielectric material for circuit interconnect applications.

     상세보기
223. Yang, Chih-Chao; Edelstein, Daniel C., Metal cap with ultra-low κ dielectric material for circuit interconnect applications.

     상세보기
224. Pore, Viljami J.; Haukka, Suvi P.; Blomberg, Tom E.; Tois, Eva E., Metal silicide, metal germanide, methods for making the same.

     상세보기
225. Pore, Viljami J.; Haukka, Suvi P.; Blomberg, Tom E.; Tois, Eva E., Metal silicide, metal germanide, methods for making the same.

     상세보기
226. Dubin,Valery M.; Moon,Peter K., Method and apparatus for an improved air gap interconnect structure.

     상세보기
227. Wang,Xinming; Takagi,Daisuke; Tashiro,Akihiko; Fukunaga,Yukio; Fukunaga,Akira; Owatari,Akira, Method and apparatus for forming metal film.

     상세보기
228. Adams John A. ; Krulik Gerald A. ; Smith Everett D., Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly.

     상세보기
229. Adams John A. ; Krulik Gerald A. ; Smith Everett D., Method and apparatus for planarization of metallized semiconductor wafers using a bipolar electrode assembly.

     상세보기
230. Dubin, Valery M.; Moon, Peter K., Method for an improved air gap interconnect structure.

     상세보기
231. Chen, Linlin; Wilson, Gregory J.; McHugh, Paul R.; Weaver, Robert A.; Ritzdorf, Thomas L., Method for electrochemically depositing metal on a semiconductor workpiece.

     상세보기
232. Kolics, Artur; Petrov, Nicolai; Ting, Chiu; Ivanov, Igor C., Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation.

     상세보기
233. Daubenspeck, Timothy H.; Landers, William F.; Zupanski-Nielsen, Donna S., Method for fabricating last level copper-to-C4 connection with interfacial cap structure.

     상세보기
234. Lee, Dok Won; Kim, Dong Joon, Method for fabricating magnetic field sensor.

     상세보기
235. Koos,Daniel A.; Mayer,Steven T.; Park,Heung L.; Cleary,Timothy Patrick; Mountsier,Thomas, Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage.

     상세보기
236. Sambucetti Carlos Juan ; Rubino Judith Marie ; Edelstein Daniel Charles ; Cabral ; Jr. Cyryl ; Walker George Frederick ; Gaudiello John G ; Wildman Horatio Seymour, Method for forming Co-W-P-Au films.

     상세보기
237. Sambucetti, Carlos Juan; Rubino, Judith Marie; Edelstein, Daniel Charles; Cabral, Jr., Cyryl; Walker, George Frederick; Gaudiello, John G; Wildman, Horatio Seymour, Method for forming Co-W-P-Au films.

     상세보기
238. Lopatin,Sergey; Shanmugasundram,Arulkumar; Lubomirsky,Dmitry; Pancham,Ian A., Method for forming CoWRe alloys by electroless deposition.

     상세보기
239. Shinriki, Hiroshi; Jeong, Daekyun, Method for forming Ta-Ru liner layer for Cu wiring.

     상세보기
240. Goldberg, Cindy K.; Filipiak, Stanley Michael; Flake, John C.; Lii, Yeong-Jyh T.; Smith, Bradley P.; Solomentsev, Yuri E.; Sparks, Terry G.; Strozewski, Kirk J.; Yu, Kathleen C., Method for forming a passivation layer for air gap formation.

     상세보기
241. Andricacos, Panayotis Constantinou; Cabral, Jr., Cyril; Parks, Christopher Carr; Rodbell, Kenneth Parker; Tsai, Roger Yen-Luen, Method for forming electromigration-resistant structures by doping.

     상세보기
242. Shinriki, Hiroshi; Namba, Kunitoshi; Jeong, Daekyun, Method for forming metal film by ALD using beta-diketone metal complex.

     상세보기
243. McFeely, Fenton R.; Yang, Chih-Chao, Method for improving the selectivity of a CVD process.

     상세보기
244. Cunningham, James A., Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby.

     상세보기
245. Ahn,Kie Y.; Forbes,Leonard, Method for making integrated circuits.

     상세보기
246. Dubin, Valery, Method for making interconnects and diffusion barriers in integrated circuits.

     상세보기
247. Kao, Chien-Teh; Chou, Jing-Pei (Connie); Lai, Chiukin (Steven); Umotoy, Sal; Huston, Joel M.; Trinh, Son; Chang, Mei; Yuan, Xiaoxiong (John); Chang, Yu; Lu, Xinliang; Wang, Wei W.; Phan, See-Eng, Method for removing oxides.

     상세보기
248. Fox, Jason; Harold, Nathan; Templin, Barry; Tochterman, Andrew, Method for selectively coating surfaces of a stent.

     상세보기
249. Adams John A. ; Krulik Gerald A. ; Smith Everett D., Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly.

     상세보기
250. Ivanov, Igor C.; Zhang, Weiguo; Kolics, Artur, Method for strengthening adhesion between dielectric layers formed adjacent to metal layers.

     상세보기
251. Andreas,Michael T., Method of cleaning a surface of a cobalt-containing material, method of forming an opening to a cobalt-containing material, semiconductor processing method of forming an integrated circuit comprising a copper-containing conductive line, and a cobalt-containing film cleaning solution.

     상세보기
252. Yu Allen S. ; Steffan Paul J. ; Scholer Thomas C., Method of defining copper seed layer for selective electroless plating processing.

     상세보기
253. Dubin, Valery M.; Thomas, Christopher D.; McGregor, Paul; Datta, Madhav, Method of electroless introduction of interconnect structures.

     상세보기
254. Segawa, Yuji; Yoshio, Akira; Suzuki, Masatoshi; Watanabe, Katsumi; Sato, Shuzo, Method of electroless plating and electroless plating apparatus.

     상세보기
255. Sergey D. Lopatin ; Robin W. Cheung, Method of encapsulated copper (Cu) interconnect formation.

     상세보기
256. Yang, Chih Chao; Clevenger, Lawrence A.; Cowley, Andrew P.; Dalton, Timothy J.; Yoon, Meeyoung H., Method of fabrication of interconnect structures.

     상세보기
257. Schwarm,Alexander T.; Shanmugasundram,Arulkumar P.; Pan,Rong; Hernandez,Manuel; Mohammad,Amna, Method of feedback control of sub-atmospheric chemical vapor deposition processes.

     상세보기
258. Ko, Jungmin, Method of fin patterning.

     상세보기
259. Bonilla, Griselda; Dimitrakopoulos, Christos D.; Grill, Alfred; Hannon, James B.; Lin, Qinghuang; Neumayer, Deborah A.; Oida, Satoshi; Ott, John A.; Pfeiffer, Dirk, Method of forming a graphene cap for copper interconnect structures.

     상세보기
260. Bonilla, Griselda; Dimitrakopoulos, Christos D.; Grill, Alfred; Hannon, James B.; Lin, Qinghuang; Neumayer, Deborah A.; Oida, Satoshi; Ott, John A.; Pfeiffer, Dirk, Method of forming a graphene cap for copper interconnect structures.

     상세보기
261. Yang, Chih Chao; Chanda, Kaushik; Clevenger, Lawrence A.; Wang, Yun Yu; Yang, Daewon, Method of forming an interconnect including a dielectric cap having a tensile stress.

     상세보기
262. Kostamo, Juhana; Soininen, Pekka J.; Elers, Kai-Erik; Haukka, Suvi, Method of growing electrical conductors.

     상세보기
263. Liu Chung-Shi,TWX ; Yu Chen-Hua,TWX, Method of increasing the stability of a copper to copper interconnection process and structure manufactured thereby.

     상세보기
264. Zhao Bin ; Vasudev Prahalad K. ; Horwath Ronald S. ; Seidel Thomas E. ; Zeitzoff Peter M., Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer.

     상세보기
265. Ning, Xian J., Method of manufacturing a metal cap layer for preventing damascene conductive lines from oxidation.

     상세보기
266. Yang, Chih-Chao; Chanda, Kaushik; Edelstein, Daniel C., Method of manufacturing an interconnect structure and design structure thereof.

     상세보기
267. Gambino,Jeffrey P.; Motsiff,William T.; Walton,Erick G., Method of manufacturing high performance copper inductors with bond pads.

     상세보기
268. Tsuchiya, Yasuaki; Kubo, Akira, Method of manufacturing semiconductor device.

     상세보기
269. Liu Chung-Shi,TWX ; Yu Chen-Hua,TWX, Method of preparing passivated copper line and device manufactured thereby.

     상세보기
270. Yan,John Y.; Chan,Randy, Method of reducing or eliminating thrombus formation.

     상세보기
271. Chen,LinLin; Graham,Lyndon W.; Ritzdorf,Thomas L.; Fulton,Dakin; Batz, Jr.,Robert W., Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density.

     상세보기
272. Cheung, Robin; Dordi, Yezdi; Tseng, Jennifer, Method of treating a substrate.

     상세보기
273. Liu Chung-Shi,TWX ; Yu Chen-Hua,TWX, Method to eliminate dishing of copper interconnects.

     상세보기
274. Chan Lap ; Li Sam Fong Yau,SGX ; Ng Hou Tee,SGX, Method to encapsulate copper plug for interconnect metallization.

     상세보기
275. Gupta, Subhash; Chern, Chyi S.; Zhou, Mei Sheng, Method to form copper interconnects by adding an aluminum layer to the copper diffusion barrier.

     상세보기
276. Kokotov,Yuri; Entin,Efim; Seror,Jacques; Fisher,Yossi; Sarel,Shalomo; Shanmugasundram,Arulkumar P.; Schwarm,Alexander T.; Paik,Young Jeen, Method, system and medium for controlling manufacture process having multivariate input parameters.

     상세보기
277. Al Bayati,Amir; Adibi,Babak; Foad,Majeed; Somekh,Sasson, Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements.

     상세보기
278. Shanmugasundram,Arulkumar P.; Armer,Helen; Schwarm,Alexander T., Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities.

     상세보기
279. Schwarm,Alexander T.; Shanmugasundram,Arulkumar P.; Seror,Jacques; Kokotov,Yuri; Entin,Efim, Method, system, and medium for handling misrepresentative metrology data within an advanced process control system.

     상세보기
280. Ahn, Kie Y.; Forbes, Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.

     상세보기
281. Ahn, Kie Y.; Forbes, Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.

     상세보기
282. Ahn,Kie Y.; Forbes,Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.

     상세보기
283. Kolics, Artur, Methods and materials for anchoring gapfill metals.

     상세보기
284. Kolics, Artur, Methods and materials for anchoring gapfill metals.

     상세보기
285. Ivanov, Igor C.; Zhang, Weiguo, Methods and system for processing a microelectronic topography.

     상세보기
286. Ivanov, Igor C.; Zhang, Weiguo, Methods and systems for processing a microelectronic topography.

     상세보기
287. Ivanov,Igor C.; Zhang,Weiguo, Methods and systems for processing a microelectronic topography.

     상세보기
288. Li, Zihui; Kao, Chia-Ling; Wang, Anchuan; Ingle, Nitin K., Methods for anisotropic control of selective silicon removal.

     상세보기
289. Pore, Viljami J.; Haukka, Suvi P.; Blomberg, Tom E.; Tois, Eva E., Methods for depositing nickel films and for making nickel silicide and nickel germanide.

     상세보기
290. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of SiN films.

     상세보기
291. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of metal and metal-oxide films.

     상세보기
292. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Methods for etch of metal and metal-oxide films.

     상세보기
293. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of sin films.

     상세보기
294. Ahn Kie Y. ; Forbes Leonard, Methods for making copper and other metal interconnections in integrated circuits.

     상세보기
295. Ahn,Kie Y.; Forbes,Leonard, Methods for making copper and other metal interconnections in integrated circuits.

     상세보기
296. Ahn,Kie Y.; Forbes,Leonard, Methods for making integrated-circuit wiring from copper, silver, gold, and other metals.

     상세보기
297. Ahn,Kie Y.; Forbes,Leonard, Methods for making integrated-circuit wiring from copper, silver, gold, and other metals.

     상세보기
298. Ahn,Kie Y.; Forbes,Leonard, Methods for making integrated-circuit wiring from copper, silver, gold, and other metals.

     상세보기
299. Valery Dubin, Methods for making interconnects and diffusion barriers in integrated circuits.

     상세보기
300. Kim, Jong Su; Park, Hyung Sang, Methods of depositing a ruthenium film.

     상세보기
301. Hsu, Louis L.; Tonti, William R.; Yang, Chih-Chao, Methods of fabricating interconnect structures containing various capping materials for electrical fuse and other related applications.

     상세보기
302. Woodruff, Jacob Huffman, Methods of forming metal silicides.

     상세보기
303. Woodruff, Jacob Huffman, Methods of forming metal silicides.

     상세보기
304. Hong, Sukwon; Hamana, Hiroshi; Liang, Jingmei, Methods of reducing substrate dislocation during gapfill processing.

     상세보기
305. Zhong,Ting; Hua,Fay; Dubin,Valery M., Methods to deposit metal alloy barrier layers.

     상세보기
306. Collins,Dale W., Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces.

     상세보기
307. Mayer, Steven T.; Porter, David W., Modulated metal removal using localized wet etching.

     상세보기
308. Ahn,Kie Y.; Forbes,Leonard; Eldridge,Jerome M., Multilevel copper interconnect with double passivation.

     상세보기
309. Ahn, Kie Y.; Geusic, Joseph E., Multilevel copper interconnects for ultra large scale integration.

     상세보기
310. Ahn,Kie Y.; Forbes,Leonard, Multilevel copper interconnects with low-k dielectrics and air gaps.

     상세보기
311. Ahn,Kie Y.; Forbes,Leonard, Multilevel copper interconnects with low-k dielectrics and air gaps.

     상세보기
312. Kevin Petrarca ; Robert A. Groves ; Brian Herbst ; Christopher Jahnes ; Richard Volant, Multiposition micro electromechanical switch.

     상세보기
313. Craig, Charles H.; Papp, John E.; Jayasinghe, Dudley; Hines, Lionel G.; Orosa, Dennis, Nanobead releasing medical devices.

     상세보기
314. Alers, Glenn; Havemann, Robert H., Nanoparticle cap layer.

     상세보기
315. Alers, Glenn; Havemann, Robert H., Nanoparticle cap layer.

     상세보기
316. Yang, Chih-Chao; Cohen, Stephan A.; Liniger, Eric G., Nanoscale interconnect structure.

     상세보기
317. Yang, Chih-Chao; Cohen, Stephan A.; Liniger, Eric G., Nanoscale interconnect structure.

     상세보기
318. Ludwig, Florian N., Nanoshell therapy.

     상세보기
319. Ludwig, Florian Niklas, Nanoshell therapy.

     상세보기
320. Ludwig, Florian N.; Pacetti, Stephen D.; Hossainy, Syed F. A.; Davalian, Dariush, Nanoshells for drug delivery.

     상세보기
321. Ludwig, Florian Niklas; Pacetti, Stephen D.; Hossainy, Syed F. A.; Davalian, Dariush, Nanoshells on polymers.

     상세보기
322. Ludwig, Florian Niklas; Pacetti, Stephen D.; Hossainy, Syed F. A.; Davalian, Dariush, Nanoshells on polymers.

     상세보기
323. Ludwig, Florian Niklas; Pacetti, Stephen D.; Hossainy, Syed F. A.; Davalian, Dariush, Nanoshells on polymers.

     상세보기
324. Park, Heung L., Nitridation of electrolessly deposited cobalt.

     상세보기
325. Yang, Chih-Chao; Hu, Chao-Kun, Nitrogen-containing metal cap for interconnect structures.

     상세보기
326. Yang, Chih-Chao; Edelstein, Daniel C.; McFeely, Fenton R., Noble metal cap for interconnect structures.

     상세보기
327. Yang, Chih-Chao; Edelstein, Daniel C.; McFeely, Fenton R., Noble metal cap for interconnect structures.

     상세보기
328. Chen, Zhijun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Non-local plasma oxide etch.

     상세보기
329. Chen, Zhijun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Non-local plasma oxide etch.

     상세보기
330. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K.; Anthis, Jeffrey W.; Schmiege, Benjamin, Oxide and metal removal.

     상세보기
331. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.

     상세보기
332. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.

     상세보기
333. Xu, Lin; Chen, Zhijun; Wang, Anchuan; Nguyen, Son T., Oxide etch selectivity systems and methods.

     상세보기
334. Lubomirsky, Dmitry, Oxygen compatible plasma source.

     상세보기
335. Chen, Xinglong; Yang, Jang-Gyoo; Tam, Alexander; Tam, Elisha, Pedestal with multi-zone temperature control and multiple purge capabilities.

     상세보기
336. Lubomirsky, Dmitry, Plasma processing system with direct outlet toroidal plasma source.

     상세보기
337. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Plasma-free metal etch.

     상세보기
338. Ning, Xian J., Plate-through hard mask for MRAM devices.

     상세보기
339. Dai, Haixia; Pakbaz, Khashayar; Spaid, Michael; Nikiforov, Theo, Plating bath and surface treatment compositions for thin film deposition.

     상세보기
340. Inoue,Hiroaki; Susaki,Akira, Plating method including pretreatment of a surface of a base metal.

     상세보기
341. Cho, Tae Seung; Sen, Yi-Heng; Park, Soonam; Lubomirsky, Dmitry, Polarity control for remote plasma.

     상세보기
342. Choi, Tom; Ko, Jungmin; Kang, Sean, Poly directional etch by oxidation.

     상세보기
343. Ramanathan, Sivakami; Padhi, Deenesh; Gandikota, Srinivas; Dixit, Girish A., Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application.

     상세보기
344. Choi,Hok Kin; Thirumala,Vani; Dubin,Valery; Cheng,Chin chang; Zhong,Ting, Preparation of electroless deposition solutions.

     상세보기
345. Lopatin,Sergey; Shanmugasundram,Arulkumar; Emami,Ramin; Fang,Hongbin, Pretreatment for electroless deposition.

     상세보기
346. Zhang, Jingchun; Zhang, Hanshen, Procedure for etch rate consistency.

     상세보기
347. Zhang, Jingchun; Zhang, Hanshen, Procedure for etch rate consistency.

     상세보기
348. Paik,Young J., Process control by distinguishing a white noise component of a process variance.

     상세보기
349. Paik,Young Jeen, Process control by distinguishing a white noise component of a process variance.

     상세보기
350. Lubomirsky, Dmitry; Weidman, Timothy W.; Shanmugasundram, Arulkumar; Kovarsky, Nicolay Y.; Wijekoon, Kapila, Process for electroless copper deposition.

     상세보기
351. Stumborg Michael F. ; Santiago Francisco ; Chu Tak Kin ; Boulais Kevin A., Process for making a semiconductor device with barrier film formation using a metal halide and products thereof.

     상세보기
352. Chu, Tak Kin; Santiago, Francisco; Boulais, Kevin A., Process for making electronic devices having a monolayer diffusion barrier.

     상세보기
353. Ponoth, Shom; Yang, Chih-Chao, Process methods for advanced interconnect patterning.

     상세보기
354. Hussein Makarem A., Process to manufacture continuous metal interconnects.

     상세보기
355. Stumborg Michael F. ; Santiago Francisco ; Chu Tak Kin ; Boulais Kevin A., Processes for making electronic devices with rubidum barrier film.

     상세보기
356. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.

     상세보기
357. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.

     상세보기
358. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.

     상세보기
359. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.

     상세보기
360. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.

     상세보기
361. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.

     상세보기
362. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.

     상세보기
363. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.

     상세보기
364. Naik, Mehul; Ma, Paul F.; Nemani, Srinivas D., Protective via cap for improved interconnect performance.

     상세보기
365. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry, Radial waveguide systems and methods for post-match control of microwaves.

     상세보기
366. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.

     상세보기
367. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.

     상세보기
368. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.

     상세보기
369. Chen, Zhijun; Zhang, Jingchun; Hsu, Ching-Mei; Park, Seung; Wang, Anchuan; Ingle, Nitin K., Radical-component oxide etch.

     상세보기
370. Chen, Zhijun; Zhang, Jingchun; Hsu, Ching-Mei; Park, Seung; Wang, Anchuan; Ingle, Nitin K., Radical-component oxide etch.

     상세보기
371. Christenson, Kurt Karl, Reagent activator for electroless plating.

     상세보기
372. Christenson,Kurt Karl, Reagent activator for electroless plating.

     상세보기
373. Hu,Chao Kun; Rosenberg,Robert; Rubino,Judith M.; Sambucetti,Carlos J.; Stamper,Anthony K., Reduced electromigration and stressed induced migration of copper wires by surface coating.

     상세보기
374. Mayer, Steven T.; Porter, David W., Reduced isotropic etchant material consumption and waste generation.

     상세보기
375. Mayer, Steven T.; Porter, David W., Reduced isotropic etchant material consumption and waste generation.

     상세보기
376. DellaGuardia,Ronald A.; Edelstein,Daniel C.; Hichri,Habib; McGahay,Vincent J., Reducing damage to ulk dielectric during cross-linked polymer removal.

     상세보기
377. Edelstein, Daniel C.; Colburn, Matthew E.; Cooney, III, Edward C.; Dalton, Timothy J.; Fitzsimmons, John A.; Gambino, Jeffrey P.; Huang, Elbert E.; Lane, Michael W.; McGahay, Vincent J.; Nicholson, Lee M.; Nitta, Satyanarayana V.; Purushothaman, Sampath; Sankaran, Sujatha; Shaw, Thomas M.; Simon, Andrew H.; Stamper, Anthony K., Reducing effective dielectric constant in semiconductor devices.

     상세보기
378. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Remotely-excited fluorine and water vapor etch.

     상세보기
379. Xu, Lin; Chen, Zhijun; Huang, Jiayin; Wang, Anchuan, Removal methods for high aspect ratio structures.

     상세보기
380. Xu, Lin; Chen, Zhijun; Huang, Jiayin; Wang, Anchuan, Removal methods for high aspect ratio structures.

     상세보기
381. Cowley, Andy; Stetter, Michael; Kaltalioglu, Erdem, Robust via structure and method.

     상세보기
382. Van Sciver, Jason, Rotatable support elements for stents.

     상세보기
383. Van Sciver, Jason, Rotatable support elements for stents.

     상세보기
384. Van Sciver, Jason, Rotatable support elements for stents.

     상세보기
385. Van Sciver, Jason, Rotatable support elements for stents.

     상세보기
386. Van Sciver, Jason, Rotatable support elements for stents.

     상세보기
387. Shinriki, Hiroshi; Inoue, Hiroaki, Ruthenium alloy film for copper interconnects.

     상세보기
388. Yang, Dongqing; Zhu, Lala; Wang, Fei; Ingle, Nitin K., Saving ion-damaged spacers.

     상세보기
389. Lee, Cheng-Shih; Chang, Yi, Schottky structure in GaAs semiconductor device.

     상세보기
390. Dai, Haixia; Pakbaz, Khashayar; Spaid, Michael; Nikiforov, Theo, Seed layers, cap layers, and thin films and methods of making thereof.

     상세보기
391. Chen, Zhijun; Huang, Jiayin; Wang, Anchuan; Ingle, Nitin, Selective SiN lateral recess.

     상세보기
392. Alers, Glenn; Draeger, Nerissa; Carolus, Michael; Carolus, legal representative, Julie, Selective capping of copper.

     상세보기
393. Hossainy,Syed F. A.; Mirzaee,Daryush, Selective coating of medical devices.

     상세보기
394. Wang, Xikun; Lei, Jianxin; Ingle, Nitin; Shaviv, Roey, Selective cobalt removal for bottom up gapfill.

     상세보기
395. Huotari, Hannu; Tuominen, Marko; Leinikka, Miika, Selective deposition of noble metal thin films.

     상세보기
396. Huotari, Hannu; Tuominen, Marko; Leinikka, Miika, Selective deposition of noble metal thin films.

     상세보기
397. Huotari, Hannu; Tuominen, Marko; Leinikka, Miika, Selective deposition of noble metal thin films.

     상세보기
398. Huotari, Hannu; Tuominen, Marko; Leinikka, Miika, Selective deposition of noble metal thin films.

     상세보기
399. Ahn,Kie Y.; Forbes,Leonard, Selective electroless-plated copper metallization.

     상세보기
400. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Selective etch for metal-containing materials.

     상세보기
401. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Selective etch for metal-containing materials.

     상세보기
402. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Selective etch for silicon films.

     상세보기
403. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Selective etch for silicon films.

     상세보기
404. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.

     상세보기
405. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.

     상세보기
406. Chen, Zhijun; Li, Zihui; Wang, Anchuan; Ingle, Nitin K.; Venkataraman, Shankar, Selective etch of silicon nitride.

     상세보기
407. Chen, Zhijun; Li, Zihui; Wang, Anchuan; Ingle, Nitin K.; Venkataraman, Shankar, Selective etch of silicon nitride.

     상세보기
408. Citla, Bhargav; Ying, Chentsau; Nemani, Srinivas; Babayan, Viachslav; Stowell, Michael, Selective etch using material modification and RF pulsing.

     상세보기
409. Kilpelä,Olli V.; Koh,Wonyong; Huotari,Hannu A.; Tuominen,Marko; Leinikka,Miika, Selective formation of metal layers in an integrated circuit.

     상세보기
410. Wang, Xikun; Ingle, Nitin, Selective in situ cobalt residue removal.

     상세보기
411. Padhi,Deenesh; Gandikota,Srinivas; Naik,Mehul; Parikh,Suketu A.; Dixit,Girish A., Selective metal encapsulation schemes.

     상세보기
412. Hoinkis, Mark; Miyazoe, Hiroyuki; Joseph, Eric, Selective sputtering for pattern transfer.

     상세보기
413. Wang, Yunyu; Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective suppression of dry-etch rate of materials containing both silicon and nitrogen.

     상세보기
414. Wang, Yunyu; Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective suppression of dry-etch rate of materials containing both silicon and oxygen.

     상세보기
415. Liu, Jie; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Park, Seung; Chen, Zhijun; Hsu, Ching-Mei, Selective titanium nitride etching.

     상세보기
416. Liu, Jie; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Park, Seung; Chen, Zhijun; Hsu, Ching-Mei, Selective titanium nitride etching.

     상세보기
417. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K.; Lubomirsky, Dmitry, Selective titanium nitride removal.

     상세보기
418. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K.; Lubomirsky, Dmitry, Selective titanium nitride removal.

     상세보기
419. Wang, Xikun; Ingle, Nitin, Selective tungsten removal.

     상세보기
420. Tochterman, Andrew J.; Fox, William J.; Harold, Nathan, Selectively coating luminal surfaces of stents.

     상세보기
421. Ning, Xian J., Self-aligned conductive line for cross-point magnetic memory integrated circuits.

     상세보기
422. Pandit, Mandar B.; Wang, Anchuan; Ingle, Nitin K., Self-aligned process.

     상세보기
423. Yang, Kai; Nogami, Takeshi; Brown, Dirk; Pramanick, Shekhar, Self-aligned semiconductor interconnect barrier and manufacturing method therefor.

     상세보기
424. Arnepalli, Ranga Rao; Goradia, Prerna Sonthalia; Visser, Robert Jan; Ingle, Nitin; Korolik, Mikhail; Biswas, Jayeeta; Lodha, Saurabh, Self-limiting atomic thermal etching systems and methods.

     상세보기
425. Sergey D. Lopatin ; Carl J. Galewski, Semiconductor catalytic layer and atomic layer deposition thereof.

     상세보기
426. Liu, Chung-Shi; Yu, Chen-Hua, Semiconductor contact barrier.

     상세보기
427. Liu, Chung-Shi; Yu, Chen-Hua, Semiconductor contact barrier.

     상세보기
428. Liu, Chung-Shi; Yu, Chen-Hua, Semiconductor contact barrier.

     상세보기
429. Inoue,Hiroaki; Susaki,Akira, Semiconductor device and method for manufacturing the same.

     상세보기
430. Tsumura,Kazumichi; Usui,Takamasa, Semiconductor device and method for manufacturing the same.

     상세보기
431. Ryu, Sang Wook; Park, Jin Ho, Semiconductor device and method of manufacturing the same.

     상세보기
432. Ueno, Kazuyoshi, Semiconductor device and method of manufacturing the same.

     상세보기
433. Nogami, Takeshi; Komai, Naoki; Kito, Hideyuki; Taguchi, Mitsuru, Semiconductor device having a conductive layer with a cobalt tungsten phosphorus coating and a manufacturing method thereof.

     상세보기
434. Boemmels, Juergen; Lehr, Matthias; Richter, Ralf, Semiconductor device having a grain orientation layer.

     상세보기
435. Nakano, Hiroshi; Itabashi, Takeyuki; Akahoshi, Haruo, Semiconductor device having cobalt alloy film with boron.

     상세보기
436. Sun, Sey-Ping; Lee, Tsung-Lin; Lin, Chin-Hsiang; Chang, Chih-Hao; Yeh, Chen-Nan; Jong, Chao-An, Semiconductor device having elevated structure.

     상세보기
437. Ueno, Kazuyoshi, Semiconductor device manufacturing apparatus and semiconductor device manufacturing method.

     상세보기
438. Ueno, Kazuyoshi, Semiconductor device manufacturing apparatus and semiconductor device manufacturing method.

     상세보기
439. Ueno,Kazuyoshi, Semiconductor device manufacturing apparatus and semiconductor device manufacturing method.

     상세보기
440. Murray, Conal E.; Yang, Chih-Chao, Semiconductor device with reduced via resistance.

     상세보기
441. Murray, Conal E.; Yang, Chih-Chao, Semiconductor device with reduced via resistance.

     상세보기
442. Murray, Conal E.; Yang, Chih-Chao, Semiconductor device with reduced via resistance.

     상세보기
443. Lopatin Sergey D. ; Pramanick Shekhar ; Brown Dirk, Semiconductor metalization barrier.

     상세보기
444. Mathew, Varughese; Garcia, Sam S.; Prindle, Christopher M., Semiconductor process and composition for forming a barrier material overlying copper.

     상세보기
445. Lubomirsky, Dmitry; Chen, Xinglong; Venkataraman, Shankar, Semiconductor processing systems having multiple plasma configurations.

     상세보기
446. Yang, Jang-Gyoo; Chen, Xinglong; Park, Soonam; Baek, Jonghoon; Garg, Saurabh; Venkataraman, Shankar, Semiconductor processing with DC assisted RF power for improved control.

     상세보기
447. Yang, Jang-Gyoo; Chen, Xinglong; Park, Soonam; Baek, Jonghoon; Garg, Saurabh; Venkataraman, Shankar, Semiconductor processing with DC assisted RF power for improved control.

     상세보기
448. Nguyen, Andrew; Ramaswamy, Kartik; Nemani, Srinivas; Howard, Bradley; Vishwanath, Yogananda Sarode, Semiconductor system assemblies and methods of operation.

     상세보기
449. Chanda, Kaushik; Filippi, Ronald G.; Wang, Ping-Chuan; Yang, Chih-Chao, Semiconductor wiring structures including dielectric cap within metal cap layer.

     상세보기
450. Ko, Jungmin; Choi, Tom; Ingle, Nitin; Kim, Kwang-Soo; Wou, Theodore, SiN spacer profile patterning.

     상세보기
451. Park, Seung; Wang, Anchuan, Silicon etch process with tunable selectivity to SiO2 and other materials.

     상세보기
452. Korolik, Mikhail; Ingle, Nitin K.; Wang, Anchuan; Xu, Jingjing, Silicon germanium processing.

     상세보기
453. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Silicon oxide selective removal.

     상세보기
454. Huang, Jiayin; Chen, Zhijun; Wang, Anchuan; Ingle, Nitin, Silicon pretreatment for nitride removal.

     상세보기
455. Li, Zihui; Hsu, Ching-Mei; Zhang, Hanshen; Zhang, Jingchun, Silicon selective removal.

     상세보기
456. Chen, Zhijun; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Silicon-carbon-nitride selective etch.

     상세보기
457. Lopatin,Sergey D.; Shanmugasundrum,Arulkumar; Shacham Diamand,Yosef, Silver under-layers for electroless cobalt alloys.

     상세보기
458. Kim, Hun Sang; Choi, Jinhan; Koseki, Shinichi, Simplified litho-etch-litho-etch process.

     상세보기
459. Beck,Michael; Hong,Bee Kim; Tilke,Armin; Wendt,Hermann, Single damascene with disposable stencil and method therefore.

     상세보기
460. Kolics, Artur; Petrov, Nicolai; Ting, Chiu; Ivanov, Igor C., Solution composition and method for electroless deposition of coatings free of alkali metals.

     상세보기
461. Luere, Olivier; Kang, Sean S.; Nemani, Srinivas D., Spacer formation.

     상세보기
462. Fox, Jason; Harold, Nathan; Templin, Barry; Tochterman, Andrew, Stent mandrel fixture and method for selectively coating surfaces of a stent.

     상세보기
463. Fox,Jason; Harold,Nathan; Templin,Barry; Tochterman,Andrew, Stent mandrel fixture and method for selectively coating surfaces of a stent.

     상세보기
464. Pacetti,Stephen D.; Villareal,Plaridel K., Stent mounting assembly and a method of using the same to coat a stent.

     상세보기
465. Chen, Chung-Hsien; Ko, Ting-Chu; Chang, Chih-Hao; Chang, Chih-Sheng; Chang, Shou-Zen; Wann, Clement Hsingjen, Strained structure of a semiconductor device.

     상세보기
466. Hsu, Louis L.; Tonti, William R.; Yang, Chih-Chao, Structure for interconnect structure containing various capping materials for electrical fuse and other related applications.

     상세보기
467. Edelstein, Daniel C.; Nogami, Takeshi; Wang, Ping-Chuan; Wang, Yun-Yu; Yang, Chih-Chao, Structure including via having refractory metal collar at copper wire and dielectric layer liner-less interface and related method.

     상세보기
468. Farrar, Paul A., Structures and methods to enhance copper metallization.

     상세보기
469. Farrar, Paul A., Structures and methods to enhance copper metallization.

     상세보기
470. Farrar, Paul A., Structures and methods to enhance copper metallization.

     상세보기
471. Farrar,Paul A., Structures and methods to enhance copper metallization.

     상세보기
472. Farrar,Paul A., Structures and methods to enhance copper metallization.

     상세보기
473. Yang, Chih-Chao; Hu, Chao-Kun, Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects.

     상세보기
474. Chen, Linlin; Graham, Lyndon W.; Ritzdorf, Thomas L.; Fulton, Dakin; Batz, Jr., Robert W., Submicron metallization using electrochemical deposition.

     상세보기
475. Wang,Xinming; Takagi,Daisuke; Tashiro,Akihiko; Fukunaga,Akira, Substrate processing method.

     상세보기
476. Yang, Chih-Chao; Nitta, Satya V.; Purushothaman, Sampath; Sankarapandian, Muthumanickam, Surface treatment for selective metal cap applications.

     상세보기
477. Chen, Yung Ming; Ho, Henjen, System and method for coating an implantable medical device.

     상세보기
478. Schwarm,Alexander T., System, method, and medium for monitoring performance of an advanced process control system.

     상세보기
479. Ivanov, Igor C., Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes.

     상세보기
480. Ivanov, Igor C., Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes.

     상세보기
481. Surana,Rahul; Zutshi,Ajoy, Technique for process-qualifying a semiconductor manufacturing tool using metrology data.

     상세보기
482. Li, Nanhai; Petrov, Nicolai; Kolics, Artur, Temperature control sequence of electroless plating baths.

     상세보기
483. Benjaminson, David; Lubomirsky, Dmitry, Thermal management systems and methods for wafer processing systems.

     상세보기
484. Alford, Terry; Das, Sayantan, Thin film devices and methods for preparing thin film devices.

     상세보기
485. Dubin, Valery, Through substrate via (TSuV) structures and method of making the same.

     상세보기
486. Wang, Xikun; Pandit, Mandar; Wang, Anchuan; Ingle, Nitin K., Titanium nitride removal.

     상세보기
487. Wang, Xikun; Xu, Lin; Wang, Anchuan; Ingle, Nitin K., Titanium oxide etch.

     상세보기
488. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.

     상세보기
489. Murray, Conal E.; Yang, Chih-Chao, Treating copper interconnects.

     상세보기
490. Liu, Jie; Wang, Xikun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Tungsten oxide processing.

     상세보기
491. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Tungsten separation.

     상세보기
492. Li, Juntao; Yang, Chih-Chao; Yin, Yunpeng, Ultra-thin metal wires formed through selective deposition.

     상세보기
493. Lai Jane-Bai,TWX ; Chen Lih-Juann,TWX ; Liu Chung-Shi,TWX ; Yu Chen-Hua Douglas,TWX, Use of a low resistivity Cu.sub.3 Ge interlayer as an adhesion promoter between copper and tin layers.

     상세보기
494. Dubin,Valery M.; Cheng,Chin Chang; Hussein,Makarem; Nguyen,Phi L.; Brain,Ruth A., Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures.

     상세보기
495. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., V trench dry etch.

     상세보기
496. Liu, Jie; Purayath, Vinod R.; Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Vertical gate separation.

     상세보기
497. Mayer, Steven T.; Webb, Eric G.; Porter, David W., Wet etching methods for copper removal and planarization in semiconductor processing.

     상세보기
498. Mayer, Steven T.; Webb, Eric; Porter, David W., Wet etching methods for copper removal and planarization in semiconductor processing.

     상세보기
499. Mayer, Steven T.; Webb, Eric; Porter, David W., Wet etching methods for copper removal and planarization in semiconductor processing.

     상세보기
더보기