이 특허를 인용한 특허 (38)

1. Kim, Jaeyeon, Aluminum-comprising target/backing plate structures.

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2. Stowe, Timothy D.; Liu, Chu-heng; Lu, Jeng Ping; Chow, Eugene; Anderson, Gregory B.; Völkel, Armin; Peeters, Eric, Anisotropically conductive backside addressable imaging belt for use with contact electrography.

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3. Dean, Nancy F.; Emigh, Roger A.; Pinter, Michael R.; Smith, Charles; Knowles, Timothy R.; Ahmadi, Mani; Ellman, Brett M.; Seaman, Christopher L., Compliant fibrous thermal interface.

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4. Street, Kenneth; Voronov, Oleg A; Kear, Bernard H, Diamond-dispersed fiber-reinforced composite for superior friction and wear properties in extreme environments and method for fabricating the same.

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5. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Diamondoid-containing capacitors.

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6. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Diamondoid-containing field emission devices.

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7. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Diamondoid-containing low dielectric constant materials.

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8. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Diamondoid-containing materials for passivating layers in integrated circuit devices.

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9. Dahl, Jeremy E.; Carlson, Robert M.; Liu, Shenggao, Diamondoid-containing materials in microelectronics.

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10. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Diamondoid-containing thermally conductive materials.

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11. Smith, Charles; Chau, Michael M.; Emigh, Roger A.; Dean, Nancy F., Electronic device having fibrous interface.

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12. Smith, Charles; Chau, Michael M.; Emigh, Roger A.; Dean, Nancy F., Electronic device having fibrous interface.

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13. Ali M. Akbar ; Peterson Carl W. ; McNab Kevin M., Electronic structure having an embedded pyrolytic graphite heat sink material.

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14. Richey ; III Joseph B., Flexible heat transfer device and method.

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15. Liu, Shenggao; Carlson, Robert M.; Dahl, Jeremy E.; Qureshi, Waqar R., Functionalized higher diamondoids.

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16. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Heterodiamondoid-containing field emission devices.

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17. Webb, Brent J., High thermal conductivity heat transfer pad.

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18. Nguyen,My N., Interface materials and methods of production and use thereof.

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19. Kono, Akira; Yamada, Takeshi, Metal matrix composite.

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20. Ploessl, Andreas; Kaiser, Stephan; Härle, Volker; Hahn, Berthold, Method for producing semiconductor chips using thin film technology.

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21. Ploessl, Andreas; Kaiser, Stephan; Härle, Volker; Hahn, Berthold, Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology.

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22. Baker, Steven E.; Antle, Jeffrey L.; Holman, Donald R., Method of forming a reinforced article.

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23. Kim, Jaeyeon, Methods of bonding two aluminum-comprising masses to one another.

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24. Ali, Mir Akbar; Peterson, Carl W., Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly.

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25. Gilliland, Don A., Multilayer printed circuit board having via arrangements for reducing crosstalk among vias.

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26. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Nucleation of diamond films using higher diamondoids.

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27. Dahl, Jeremy E.; Carlson, Robert M.; Liu, Shenggao, Polymerizable higher diamondoid derivatives.

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28. Dahl, Jeremy E.; Carlson, Robert M.; Liu, Shenggao, Polymerizable higher diamondoid derivatives.

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29. Liu, Shenggao; Carlson, Robert M.; Dahl, Jeremy E., Polymerizable higher diamondoid derivatives.

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30. Terada, Yoshio; Asai, Fumiteru; Hashimoto, Hirokuni, Pressure-sensitive adhesive sheet and process for producing semiconductor device having same.

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31. Obermeyer, Henry K.; Gilbert, Eric N.; Baker, Grant Quinn, Process of manufacturing fiber reinforced composite via selective infusion of resin and resin blocking substance.

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32. Hada, Sayuri; Sueoka, Kuniaki; Taira, Yoichi, Sheet having high thermal conductivity and flexibility.

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33. Baker,Steven E.; Antle,Jeffrey L.; Holman,Donald R., Sizing composition for sheet molding compound roving.

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34. Grip, Robert E.; Rawdon, Blaine K.; Jalewalia, Gurpreet S., Structurally isolated thermal interface.

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35. Chu Kwang H. ; Cosman Armond D. ; Miklos Richard L.,SGX, Susceptor composite material patterned in neat polymer.

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36. Jiang, Tongbi, Thermally conductive adhesive tape for semiconductor devices and method for using the same.

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37. Michael R. Pinter ; Nancy F. Dean ; William B. Willett ; Amy Gettings ; Charles Smith, Transferrable compliant fibrous thermal interface.

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38. Pinter, Michael R.; Dean, Nancy F.; Willett, William B.; Gettings, Amy; Smith, Charles, Transferrable compliant fibrous thermal interface.

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