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Wafer processing apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/68
출원번호 US-0420610 (1995-04-11)
우선권정보 JP-0212276 (1992-07-17); JP-0227840 (1992-08-05); JP-0227841 (1992-08-05)
발명자 / 주소
  • Iwabuchi Katsuhiko (Sagamihara JPX) Takanabe Eiichirou (Kanagawa-Ken JPX)
출원인 / 주소
  • Tokyo Electron Kabushiki Kaisha (Tokyo-to JPX 03) Tokyo Electron Tohoku Kabushiki Kaisha (Iwate-ken JPX 03)
인용정보 피인용 횟수 : 67  인용 특허 : 10

초록

The present invention refers to a wafer transfer robot for a wafer boat of a wafer processing apparatus wherein a turntable within a chamber of a turntable apparatus is provided with a prescribed number of stations formed thereon. Each of the stations is provided with protrusions that hold a wafer c

대표청구항

A wafer processing apparatus for transferring wafers from a wafer cassette to a wafer boat, said apparatus comprising: means defining a wafer loading/unloading chamber adapted to receive a wafer boat, a heat-treatment furnace, a first elevator means for moving and supporting a wafer boat within said

이 특허에 인용된 특허 (10)

  1. Iwasawa Yoshiyuki (Tokyo JPX) Ishida Tsutomu (Tokyo JPX) Harada Hiroshi (Tokyo JPX) Okamoto Kenji (Tokyo JPX) Kobayashi Shintaro (Tokyo JPX) Matsumoto Takashi (Ise JPX) Shinya Tsutomu (Ise JPX) Tanak, Dusttight storage cabinet apparatus for use in clean rooms.
  2. Shiraiwa Hirotsugu (Hino JPX), Heat treatment apparatus.
  3. Harada Hiroshi (Tokyo JPX) Iwasawa Yoshiyuki (Tokyo JPX) Ishida Tsutomu (Tokyo JPX) Kobayashi Shintaro (Tokyo JPX), Semiconductor processing system.
  4. Kakehi Yutaka (Hikari JPX), Semiconductor substrate transport system.
  5. Stonestreet Paul (Cowfold GB2) Allum Clive (Crawley GB2) Webber Bert (Crawley GB2) Cooke Richard (West Worthing GB2) Robinson Frederick J. L. (Crawley GB2) Wauk ; II Michael T. (Haywards Heath GB2), Systems and methods for wafer handling in semiconductor process equipment.
  6. Wagner Rudolf (Fontnas CHX) Martin Bader (Balzers LIX) Eberhard Moll (Schellenberg LIX) Zanardo Renzo (Balzers LIX) Van Agtmaal J. G. (Hilversum NLX), Vacuum apparatus.
  7. Toshima Masato (Campbell CA), Vacuum chamber slit valve.
  8. Wada Atsushi (Chofu JPX) Kitayama Hirofumi (Aikawa JPX), Vertical heat treatment apparatus having wafer transfer mechanism and method for transferring wafers.
  9. Harima Yoshiyuki (Zushi JPX), Vertical heat-treatment apparatus having boat transfer mechanism.
  10. Takanabe Eiichiro (Kanagawa JPX), Wafers transferring method in vertical type heat treatment apparatus and the vertical type heat treatment apparatus prov.

이 특허를 인용한 특허 (67)

  1. Arne W. Ballantine ; Peter A. Emmi ; Walter J. Frey ; Michael J. Gambero ; Neena Garg ; Byeongju Park ; Donald L. Wilson, Apparatus and method for controlling wafer environment between thermal clean and thermal processing.
  2. Cho Jun-Geol,KRX, Apparatus for baking resists on semiconductor wafers.
  3. Lee, Young Jong; Choi, Jun Young; Jo, Saeng Hyun; Yoon, Byung-Oh; Kim, Gyeong-Hoon; Jeong, Hong-Gi, Apparatus for manufacturing flat-panel display.
  4. Siniaguine Oleg ; Tokmouline Iskander, Apparatus for plasma jet treatment of substrates.
  5. Kroeker Tony R. ; Cook Larry, Atmospheric wafer transfer module with nest for wafer transport robot.
  6. Davis,Jeffrey A.; Curtis,Gary L., Automated semiconductor processing systems.
  7. Lee,Jae Chull; Berkstresser,David, Curved slit valve door with flexible coupling.
  8. Lee, Jae-Chull; Kurita, Shinichi; White, John M.; Anwar, Suhail, Decoupled chamber body.
  9. Kurita, Shinichi; Blonigan, Wendell T., Double dual slot load lock chamber.
  10. Kroeker Tony R. ; Mooring Benjamin W. ; Bright Nicolas J., Dual sided slot valve and method for implementing the same.
  11. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  12. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  13. Nam Ki-huem,KRX ; Han Hyun,KRX ; Kawk Sun-woo,KRX, Elevator system for transferring a wafer boat with automatic horizontal attitude control.
  14. Sakata Kazunari,JPX ; Tanifuji Tamotsu,JPX ; Tsukada Akihiko,JPX, Heat treatment apparatus.
  15. Seiichi Yoshida JP; Takashi Tanahashi JP; Akira Onodera JP; Motoki Akimoto JP, Heat treatment method and heat treatment apparatus.
  16. Yoshida, Seiichi; Tanahashi, Takashi; Onodera, Akira; Akimoto, Motoki, Heat treatment method that includes a low negative pressure.
  17. Mochizuki,Shinya; Akimoto,Motoki, Heat treatment system and a method for cooling a loading chamber.
  18. Sakata, Kazunari; Mochizuki, Shinya; Akimoto, Motoki; Motono, Hiroshi, Heat treatment system and method therefore.
  19. Miao-Cheng Liao TW; Hsiang-Sheng Cheng TW, Heater lift lead screw for vertical furnaces.
  20. Kurita, Shinichi; Blonigan, Wendell T.; Tanase, Yoshiaki, Large area substrate transferring method for aligning with horizontal actuation of lever arm.
  21. Kurita,Shinichi; Blonigan,Wendell T.; Tanase,Yoshiaki, Load lock chamber for large area substrate processing system.
  22. Kurita,Shinichi; Blonigan,Wendell T., Load lock chamber having two dual slot regions.
  23. Lee, Jae-Chull; Anwar, Suhail; Kurita, Shinichi, Load lock chamber with decoupled slit valve door seal compartment.
  24. Sung, Edward, Magnetic wafer gripper.
  25. Cheng David, Method and apparatus for loading and unloading wafers from a wafer carrier.
  26. Fosnight, William; Waite, Stephanie, Method and apparatus for storing and transporting semiconductor wafers in a vacuum pod.
  27. Kurita,Shinichi; Blonigan,Wendell T., Method for transferring substrates in a load lock chamber.
  28. Mochizuki, Shinya; Akimoto, Motoki, Method of object transfer for a heat treatment system.
  29. Ku, Shao-Yen; Chen, Ming-Jung; Chung, Tzu Yang; Tseng, Chi-Yun; Chuang, Rui-Ping, Methods for transporting wafers between wafer holders and chambers.
  30. Kroeker, Tony R.; Tomasch, Gregory A., Methods of implementing a single shaft, dual cradle vacuum slot valve.
  31. Pfeiffer Ken ; Verdict Greg, Modular substrate cassette.
  32. Bacchi Paul ; Filipski Paul S., Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput.
  33. Roger V. Heyder ; Thomas B. Brezocsky ; Robert E. Davenport, Multiple loadlock system.
  34. Kurita, Shinichi; Anwar, Suhail; Lee, Jae-Chull, Multiple slot load lock chamber and method of operation.
  35. Koike Atsuyoshi,JPX, Process for fabricating two different types of wafers in a semiconductor wafer production line.
  36. Kikuchi Hisashi,JPX ; Ishii Katsumi,JPX, Processing method and processing unit for substrate.
  37. Ishii Katsumi,JPX, Processing method for substrate.
  38. Eristoff, D. Guy; Barnes, Michael S.; Wall, Arthur C.; Bluck, Terry, Processing tool with combined sputter and evaporation deposition sources.
  39. Katsumi Ishii JP, Processing unit for a substrate.
  40. Theriault Victor J., Robot mounting de-coupling technique.
  41. Wood, Eric R.; Crabb, Richard; Alexander, James A., Semiconductor handling robot with improved paddle-type end effector.
  42. Wood,Eric R.; Crabb,Richard; Alexander,James A., Semiconductor handling robot with improved paddle-type end effector.
  43. Kawamura Yoshio,JPX ; Kashima Hideo,JPX ; Moriyama Shigeo,JPX, Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing.
  44. Kawamura Yoshio,JPX ; Kashima Hideo,JPX ; Moriyama Shigeo,JPX, Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device.
  45. Mooring Benjamin W. ; Bright Nicolas J., Semiconductor processing platform architecture having processing module isolation capabilities.
  46. Thompson, Raymon F.; Berner, Robert W.; Curtis, Gary L.; Culliton, Stephen P.; Wright, Blaine G.; Byle, Darryl S., Semiconductor processing system with wafer container docking and loading station.
  47. Thompson, Raymond F.; Berner, Robert W.; Curtis, Gary L.; Culliton, Stephen P.; Wright, Blaine G., Semiconductor processing system with wafer container docking and loading station.
  48. Tony R. Kroeker ; Gregory A. Tomasch, Single shaft dual cradle vacuum slot valve.
  49. Kroeker, Tony R.; Tomasch, Gregory A., Single shaft, dual cradle vacuum slot valve.
  50. Shimahara Takashi,JPX ; Nakamura Naoto,JPX ; Sakamoto Ichiro,JPX ; Maeda Kiyohiko,JPX, Substrate processing apparatus and method.
  51. Shimahara, Takashi; Nakamura, Naoto; Sakamoto, Ichiro; Maeda, Kiyohiko, Substrate processing apparatus and method.
  52. Hayashi, Akinari, Substrate processing apparatus and substrate processing method.
  53. Hirano Mitsuhiro,JPX, Substrate processing apparatus with local exhaust for removing contaminants.
  54. Okayama, Satohiro; Kanazawa, Motoichi; Ishida, Takeshige; Takeda, Tomohiko; Akita, Yukio; Ichimura, Satoru; Suzuki, Kazunori; Yoshino, Teruo; Akao, Tokunobu; Nakayama, Yasunobu, Substrate processing device, substrate conveying device, and substrate processing method.
  55. Scollay, Stuart; Bluck, Terry; Chen, Xiang, System and method for substrate transport.
  56. Nam Ki-hum,KRX ; Lee Byung-kwan,KRX ; Kim Dong-ho,KRX ; An Woung-kwan,KRX, Thermal processing apparatus for semiconductor wafer.
  57. Williams Victor J. ; Weaver Robert A. ; Grove Coby S., Thermal processor.
  58. Kroeker Tony R., Three chamber load lock apparatus.
  59. Kroeker Tony R., Three chamber load lock apparatus.
  60. Tony R. Kroeker, Three chamber load lock apparatus.
  61. Larson Dean Jay ; Sutton Thomas R., Tolerance resistant and vacuum compliant door hinge with open-assist feature.
  62. Murata, Masanao; Kumehashi, Tatsuya, Transport system and set-up method.
  63. Tomasch, Gregory A., Unitary slot valve actuator with dual valves.
  64. Tomasch,Gregory A., Unitary slot valve actuator with dual valves.
  65. Tomasch,Gregory A., Unitary slot valve actuator with dual valves.
  66. Kim, Sam Hyungsam; Lee, Jae-Chull; Sterling, William N.; Brown, Paul, Valve door with ball coupling.
  67. Hillman Gary, Wafer handling method and apparatus.
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