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An injection molding apparatus includes a nozzle which is directly connected to a mold for injecting a molding material into the mold. The mold defines at least one cavity in the shape of a element to be molded and at least one gate passage, each gate passage interconnecting a separate cavity with t

An injection molding apparatus includes a nozzle which is directly connected to a mold for injecting a molding material into the mold. The mold defines at least one cavity in the shape of a element to be molded and at least one gate passage, each gate passage interconnecting a separate cavity with the nozzle. The shape of the gate passage permits a rapid curing of any residual molding material, and permits separation of the mold and the nozzle before the molding material in each cavity is cured. The nozzle is then used for a subsequent procedure or molding process while the molding material in the cavity cures. The nozzle defines a first bore and a second bore arranged longitudinally in sequence, and a side hole for introducing the molding material into the first bore. The nozzle includes a first plunger which is selectively reciprocally movable in the first bore, and a second plunger which is selectively reciprocally movable in the second bore and in a central bore defined in the first plunger. To charge a mold, the first plunger is moved to expose the side hole and control the flow of molding material into the second bore while the second plunger is extended into the second bore. The second plunger is raised to permit the first plunger to inject the molding material into each cavity via the second bore and each gate passage. The second plunger is then extended to purge any residue molding material from the nozzle.

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Apparatus for injection molding of semiconductor elements, the apparatus comprising: an injection nozzle defining (a) a first bore, (b) a second bore extending longitudinally from the first bore where the second bore is of a diameter smaller than that of the first bore, and (c) a side hole connectin

Apparatus for injection molding of semiconductor elements, the apparatus comprising: an injection nozzle defining (a) a first bore, (b) a second bore extending longitudinally from the first bore where the second bore is of a diameter smaller than that of the first bore, and (c) a side hole connecting the first bore with a source of a molding compound adjacent the connection of the first bore with the second bore; a mini-plunger comprising: an outer plunger which is selectively movable in the first bore and in its extended position contacts and seals the side hole, and when retracted the side hole is exposed to the first bore for permitting the molding compound to enter the first bore, and when returned to its starting position charges the molding compound down through the second bore; and an inner plunger which is reciprocally and selectively movable within both a central aperture defined in the outer plunger and the second bore of the nozzle; and a mold that is placed in contact with the nozzle at an end of the second bore and defines at least one cavity in the shape of the element to be molded which is in communication with the nozzle via a separate gate passage, and is charged with the molding compound when the outer plunger is returned to its starting position and the inner plunger is then extended through the full length of the second bore to substantially purge the nozzle of any molding material, wherin he gate passage is a narrow capillary aperture which permits molding compound charged into the at least one cavity of the mold via the seperate gate passage to cure within the gate passage before the molding compound in the a least one cavity of the mold cures and permit removal of the nozzle from the mold before the molding compound in the at least one cavity cures.