초록 ▼

A structure and a process for forming an improved bonding pad which allows better bonding between a bond wire and a metal bonding pad. Stripes are formed on a substrate. A conformal dielectric layer, a conformal barrier layer and a metal layer are formed over the stripes. A passivation layer with a

A structure and a process for forming an improved bonding pad which allows better bonding between a bond wire and a metal bonding pad. Stripes are formed on a substrate. A conformal dielectric layer, a conformal barrier layer and a metal layer are formed over the stripes. A passivation layer with a window is formed defining a bonding pad area. The stripes promote an irregular surface in the barrier and metal layers which reduce stress between the dielectric layer, the barrier layer and the metal layer. Also, the irregular surfaces increase the barrier metal adhesion to the dielectric layer, reduce bond pad peel off, and increase bonding yields.

대표청구항 ▼

An improved bonding pad on a bonding pad area on a substrate comprising: spaced stripes on the substrate in a least the bonding pad area, the stripes arranged in a pattern of broken parallel spaced lines: a conformal dielectric layer over at least the stripes presenting an irregular top surface conf

An improved bonding pad on a bonding pad area on a substrate comprising: spaced stripes on the substrate in a least the bonding pad area, the stripes arranged in a pattern of broken parallel spaced lines: a conformal dielectric layer over at least the stripes presenting an irregular top surface configuration including grooves, said grooves having a depth; a conformal barrier layer over the dielectric layer, said conformal barrier layer having an irregular top surface configuration including grooves; a conformal metal layer over said barrier layer; and a passivation layer over said metal layer having a window over the bonding pad area.