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Method of wire bonding an integrated circuit to an ultraflexible substrate

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G08B-013/187
  • H05K-003/30
출원번호 US-0681195 (1996-07-22)
발명자 / 주소
  • Isaacson Mark R.
  • Piccoli Anthony F.
  • Holloway Michael
출원인 / 주소
  • Checkpoint Systems, Inc.
대리인 / 주소
    Panitch Schwarze Jacobs & Nadel, P.C.
인용정보 피인용 횟수 : 118  인용 특허 : 0

초록

A method of electrically connecting an integrated circuit (IC) to at least one electrical conductor on a flexible substrate. A flexible dielectric substrate has an IC attachment area and at least one resonant circuit formed thereon. The resonant circuit is formed with a first conductive pattern disp

대표청구항

[ We claim:] [1.] A method of electrically connecting an integrated circuit (IC) to at least one electrical conductor on a flexible substrate comprising the steps of:(a) providing a flexible dielectric substrate having an IC attachment area located on one of a first principal surface and a second, o

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