초록 ▼

A leadframe ball grid array package for packaging an integrated-circuit die includes a metallic substrate having a central portion and a leadflame having a plurality of inwardly-extending bonding fingers and a centrally-located open portion. The leadframe is directly attached to the metallic substra

A leadframe ball grid array package for packaging an integrated-circuit die includes a metallic substrate having a central portion and a leadflame having a plurality of inwardly-extending bonding fingers and a centrally-located open portion. The leadframe is directly attached to the metallic substrate by a non-conductive adhesive so that the open portion thereof overlies the central recessed portion of the metallic substrate. An integrated-circuit die is mounted in the central portion of the metallic substrate. The bonding fingers are disposed peripherally surrounding the integrated-circuit die. Bonding wires are interconnected between bonding pads formed on the integrated-circuit die and the plurality of bonding fingers. A solder mask is disposed over the top surface of the leadframe so as to form selective solderable areas. Solder balls are attached to the selective solderable areas. A plastic material or a lid is applied over the top surface of the die, bonding fingers and bonding wires.

대표청구항 ▼

[ What is claimed is:] [1.] A leadframe ball grid array package configuration for packaging an integrated-circuit die comprising:a metallic substrate having a central recessed portion;a leadframe having a plurality of inwardly-extending bonding fingers and a centrally-located open portion;said leadf

[ What is claimed is:] [1.] A leadframe ball grid array package configuration for packaging an integrated-circuit die comprising:a metallic substrate having a central recessed portion;a leadframe having a plurality of inwardly-extending bonding fingers and a centrally-located open portion;said leadframe being directly attached onto said metallic substrate by a non-conductive adhesive so that the open portion thereof overlies the central recessed portion of said metallic substrate;an integrated-circuit die being mounted in the central recessed portion of said metallic substrate, said plurality of bonding fingers being disposed peripherally surrounding said integrated-circuit die;bonding wires interconnected between bonding pads formed on said integrated-circuit die and said plurality of bonding fingers;a solder mask being disposed over the top surface of said leadframe so as to form selective solderable areas; andsolder balls being attached to said selective solderable area.