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Substrate transfer apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B25J-015/06
출원번호 US-0837520 (1997-04-22)
우선권정보 JP-0268054 (1994-10-07)
발명자 / 주소
  • Ueda Issei,JPX
  • Akimoto Masami,JPX
  • Kudou Hiroyuki,JPX
출원인 / 주소
  • Tokyo Electron Kyushu Limited, JPX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 63  인용 특허 : 3

초록

A substrate transfer apparatus for receiving and delivering a substrate among a plurality of process locations and transferring the substrate among the process locations comprises an apparatus body, a transfer member, movably provided on the apparatus body, for supporting and transferring the substr

대표청구항

[ What is claimed is:] [1.] A substrate transfer apparatus for receiving and delivering a substrate among a plurality of process locations and transferring the substrate among the process locations, said apparatus comprising:an apparatus body;a transfer arm member for supporting and transferring the

이 특허에 인용된 특허 (3)

  1. Prentakis Antonios E. (Cambridge MA), Apparatus and method for loading and unloading wafers.
  2. Genov Genco (Sunnyvale CA) Cameron James (Mountain View CA), Dual end effector robotic arm.
  3. Ishii Katsumi (Fujino JPX) Mochizuki Yoshinori (Hachioji JPX), Horizontal/vertical conversion handling apparatus.

이 특허를 인용한 특허 (63)

  1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.
  2. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
  3. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
  4. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  5. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  6. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  7. Boris Govzman ; Konstantin Volodarsky ; Leon Volfovski, Apparatus and methods for handling a substrate.
  8. Harris,Randy; Woodruff,Daniel J., Apparatus for manually and automatically processing microelectronic workpieces.
  9. Minnick Andrew ; Wilson James ; Mayur Abhilash J., Assembly for wafer handling system.
  10. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  11. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  12. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  13. Anil Mankame ; Anthony Florindi ; Fredrick Arnold Goodman, Edge gripping end effector wafer handling apparatus.
  14. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  15. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  16. Jamieson, Jon; Eng, Franco; Sundararajan, Srinivasan; Kreger, Troy; Belenky, Sasha; Kojangian, Janry, End effector.
  17. Begin Robert George, End effector assembly for inclusion in a system for producing uniform deposits on a wafer.
  18. Begin Robert George, End effector assembly for inclusion in a system for producing uniform deposits on a wafer.
  19. Begin Robert George, End effector assembly for inclusion in a system for producing uniform deposits on a wafer.
  20. Jeff Brodine ; Dan Marohl, End effector for wafer handler in processing system.
  21. Woodruff, Daniel J.; Erickson, James J., End-effectors and transfer devices for handling microelectronic workpieces.
  22. Woodruff,Daniel J.; Harris,Randy A.; Erickson,James J.; Carr,Douglas W., End-effectors for handling microelectronic wafers.
  23. Woodruff,Daniel J.; Oberlitner,Thomas H.; Harris,Randy A.; Erickson,James J.; Carr,Douglas W., End-effectors for handling microelectronic workpieces.
  24. Shendon, Norman; Hearne, John; Von Lossberg, Bryan, Hydraulically actuated wafer clamp.
  25. Woodruff, Daniel J.; Harris, Randy, Integrated tools with transfer devices for handling microelectronic workpieces.
  26. Ottens, Joost Jeroen; Gilissen, Noud Jan; Leenders, Martinus Hendrikus Antonius, Lithographic apparatus and device manufacturing method.
  27. Ottens, Joost Jeroen; Gilissen, Noud Jan; Leenders, Martinus Hendrikus Antonius; Zaal, Koen Jacobus Johannes Maria, Lithographic apparatus and device manufacturing method.
  28. Ottens, Joost Jeroen; Gilissen, Noud Jan; Leenders, Martinus Hendrikus Antonius; Zaal, Koen Jacobus Johannes Maria, Lithographic apparatus and device manufacturing method.
  29. Ottens,Joost Jeroen; Gilissen,Noud Jan; Leenders,Martinus Hendrikus Antonius; Zaal,Koen Jacobus Johannes Maria, Lithographic apparatus and device manufacturing method.
  30. Nulman, Jaim, Loader conveyor for substrate processing system.
  31. Sundar, Satish, Mechanical gripper for wafer handling robots.
  32. Fukumoto, Yoshihiko, Method for fabricating semiconductor device.
  33. Woodruff, Daniel J.; Harris, Randy, Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces.
  34. Vanderpot John W. ; Pollock John D., Microfeature wafer handling apparatus and methods.
  35. Fairbairn Kevin ; Sinha Ashok, Multideck wafer processing system.
  36. Miyashita Masahiro,JPX, Positioning apparatus for substrates to be processed.
  37. Miyashita Masahiro,JPX, Positioning apparatus for substrates to be processed.
  38. Miyashita Masahiro,JPX, Positioning apparatus for substrates to be processed.
  39. Genov ; deceased Genco, Prealigner and planarity teaching station.
  40. Hanson, Kyle M.; Eudy, Steve L.; Ritzdorf, Thomas L.; Wilson, Gregory J.; Woodruff, Daniel J.; Harris, Randy; Weber, Curtis A.; McGlenn, Tim; Anderson, Timothy A.; Bexten, Daniel P., Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces.
  41. Coomer, Stephen D.; Kopacz, Stanislaw; Reynolds, Glyn; Lombardi, Michael James; Visconti, Todd Michael, Reduced edge contact wafer handling system and method of retrofitting and using same.
  42. Beckhart, Gordon Haggott; Conarro, Patrick Rooney; Harrell, Kevin James; Krause, Michael Charles; Farivar-Sadri, Kamran Michael, Robot alignment system and method.
  43. Hofmeister Christopher A., Robot arm relocation system.
  44. Freerks, Frederik W.; Ishikawa, Tetsuya; Wang, Timothy Y.; Hudgens, Jeffrey C.; Ciulik, James R.; Salek, Mohsen; Leong, Tim; DiFrancesco, Al, Robot blade for semiconductor processing equipment.
  45. Tepman, Avi, Robot blade with dual offset wafer supports.
  46. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  47. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  48. Carducci Jim, Single drive, dual plane robot.
  49. Takebayashi Yuji,JPX ; Akao Tokunobu,JPX ; Konno Yoshikazu,JPX, Substrate carrying apparatus.
  50. Suzuki, Hiroo; Ito, Kenya; Sakurai, Kunihiko; Wakabayashi, Satoshi; Togawa, Tetsuji, Substrate holder and substrate transfer apparatus using the same.
  51. Ueda Issei,JPX ; Yamaguchi Tadayuki,JPX, Substrate transfer apparatus and substrate processing apparatus.
  52. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
  53. Woodruff, Daniel J.; Harris, Randy, TRANSFER DEVICES FOR HANDLING MICROELECTRONIC WORKPIECES WITHIN AN ENVIRONMENT OF A PROCESSING MACHINE AND METHODS OF MANUFACTURING AND USING SUCH DEVICES IN THE PROCESSING OF MICROELECTRONIC WORKPIE.
  54. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  55. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  56. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  57. Yaegashi Hidetami,JPX ; Toshima Takayuki,JPX ; Akimoto Masami,JPX ; Yamaguchi Eiji,JPX ; Kitano Junichi,JPX ; Katano Takayuki,JPX ; Shinya Hiroshi,JPX ; Iida Naruaki,JPX, Vertical processing apparatus.
  58. Asari, Satoshi; Takahashi, Kiichi; Abe, Toshihiro, Vertical thermal processing apparatus.
  59. Otwell Robert ; Nering Eric A. ; Lossberg Bryan Von, Wafer aligner in center of front end frame of vacuum system.
  60. Hino Kazunori,JPX, Wafer carrying fork.
  61. Gilmore, Brian Lawrence, Wafer support ring.
  62. Okada Keiji,JPX ; Taniguchi Katsuhiro,JPX, Wafer transport apparatus that can transfer multiple wafers in a short period of time.
  63. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.
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