초록 ▼

A cooling device for lowering the temperature of a heat-dissipating device. The cooling device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with the heat-dissipating device. During operation, heat flows fr

A cooling device for lowering the temperature of a heat-dissipating device. The cooling device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with the heat-dissipating device. During operation, heat flows from the heat-dissipating device into the heat-conducting substrate, where it is spread out over a relatively large area. A thermoelectric cooling material (e.g., a Bi.sub.2 Te.sub.3 -based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. Application of electrical power to the thermoelectric material drives the thermoelectric material to pump heat into a second heat-conducting substrate which, in turn, is attached to a heat sink.

대표청구항 ▼

[ What is claimed is:] [1.] A cooling device for cooling a heat-dissipating device, comprising:a diamond or high thermal conductivity substrate in thermal contact with said heat-dissipating device to dissipate heat therefrom;a heat-pumping element in thermal contact with said diamond or high thermal

[ What is claimed is:] [1.] A cooling device for cooling a heat-dissipating device, comprising:a diamond or high thermal conductivity substrate in thermal contact with said heat-dissipating device to dissipate heat therefrom;a heat-pumping element in thermal contact with said diamond or high thermal conductivity substrate, having thermoelectric components; and,a stack structure disposed between said diamond or high thermal conductivity substrate and said heat-pumping element, said stack structure comprising thermally and electrically conductive stack layers for supplying electrical current to said heat-pumping element and conducting heat from said diamond or high thermal conductivity substrate to said heat-pumping element, said stack layers including:a metallization layer attached to a surface of said diamond or high thermal conductivity substrate;an outer diffusion barrier layer attached to said metallization layer;an electrically conducting layer attached to said diffusion barrier layer;an inner diffusion barrier layer attached to said electrically conducting layer; and,a contact layer attached to said inner diffusion barrier layer.