초록 ▼

A thermal management device for controlling the temperature of a computer processor chip, by controlling the operating speed of the processor, including a temperature sensitive circuitry incorporated within a packaged clock chip for connection to a processor. A thermal management method for controll

A thermal management device for controlling the temperature of a computer processor chip, by controlling the operating speed of the processor, including a temperature sensitive circuitry incorporated within a packaged clock chip for connection to a processor. A thermal management method for controlling the temperature of a computer processor chip includes sensing a temperature with a temperature dependent circuitry integrally formed in a packaged clock chip, in which the sensed temperature is a function of the temperature of the computer processor chip, generating a clock control signal with the temperature dependent circuitry and sending the clock control signal to a clock generator also integrally formed in the clock chip, and sending a clock signal from the clock generator to the computer processor chip in order to control the operating frequency, and thus the temperature, of the processor.

대표청구항 ▼

[ What is claimed is:] [1.] An active thermal management system comprising:a packaged computer processor chip adapted for operating at variable frequency;a separately packaged clock chip having a temperature sensitive circuitry and a clock generator both integrated therein, said temperature sensitiv

[ What is claimed is:] [1.] An active thermal management system comprising:a packaged computer processor chip adapted for operating at variable frequency;a separately packaged clock chip having a temperature sensitive circuitry and a clock generator both integrated therein, said temperature sensitive circuitry being operative to produce a clock control signal dependent upon a temperature sensed by said temperature sensitive circuitry, said clock generator being connected with said temperature sensitive circuitry for receiving said clock control signal therefrom, said clock generator being operative to produce a clock signal dependent upon said clock control signal from said temperature sensitive circuitry, said computer processor chip being connected with said clock generator for receiving said clock signal therefrom for controlling the frequency of operation of the computer processor, said packaged clock chip being positioned adjacent to said packaged computer processor chip, but not in physical contact with said packaged computer processor chip, such that said packaged clock chip is thermally influenced by at least a portion of a heat energy generated by said packaged computer processor chip; anda thermal coupling positioned between said computer processor chip and said clock chip said thermal coupling being capable of transferring at least a portion of said heat energy to said temperature sensitive circuitry of said clock chip so as to thermally influence said clock chip.