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Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/11
  • H05K-001/14
  • H01R-023/72
출원번호 US-0685425 (1994-09-26)
발명자 / 주소
  • Stopperan Jahn J.
출원인 / 주소
  • Sheldahl, Inc.
대리인 / 주소
    Merchant, Gould, Smith, Edell, Welter & Schmidt,P.A.
인용정보 피인용 횟수 : 113  인용 특허 : 53

초록 ▼

A printed circuit assembly includes a fine pitch flexible printed circuit overlay bonded to a normal pitch printed circuit board. The fine pitch flexible printed circuit overlay may provide increased packaging density, direct chip attachment and/or complex routing with a minimal cost impact on the o

대표청구항 ▼

[ What is claimed is:] [1.] A printed circuit assembly comprising:(a) a normal pitch printed circuit board having bonding pads arranged into a footprint on a surface thereof;(b) a fine pitch flexible printed circuit overlay having bonding pads arranged into a footprint on a surface thereof, wherein

이 특허에 인용된 특허 (53)

  1. Hodgson Rodney T. (Ossining NY) Jones Harry J. (Austin TX) Ledermann Peter G. (Pleasantville NY) Reiley Timothy C. (Ridgefield CT) Moskowitz Paul A. (Yorktown Heights NY), Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam proc.
    상세보기
  2. Hagner George R. (Cary NC), Circuit board and method of soldering.
    상세보기
  3. Casson Keith L. (Northfield MN) Habeck Kelly D. (Tampa FL) Selbitschka Eugene T. (South St. Paul MN), Direct application of unpackaged integrated circuit to flexible printed circuit.
    상세보기
  4. Casson Keith L. (Northfield MN) Habeck Kelly D. (Tampa FL) Selbitschka Eugene T. (South St. Paul MN), Direct application of unpackaged integrated circuit to flexible printed circuit.
    상세보기
  5. Corbett Tim J. (Boise ID) Wood Alan G. (Boise ID), Directly bonded simm module.
    상세보기
  6. Cook Carl R. (Coral Springs FL), Double sided mounting module for surface mount integrated circuits.
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  7. Fujiwara Yoshio (Tochigi JPX) Kobayashi Naotake (Tochigi JPX) Matsubara Yuichi (Tochigi JPX) Ando Hisashi (Tochigi JPX) Numao Hidehiro (Tochigi JPX) Suzuki Kazuaki (Tochigi JPX), Electrically conductive adhesive sheet, circuit board and electrical connection structure using the same.
    상세보기
  8. Spinelli Thomas S. (Attleboro MA) Manns William G. (Dallas TX) Weirauch Donald F. (Dallas TX), Electronic circuit interconnection system.
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  9. Spinelli, Thomas S.; Manns, William G.; Weirauch, Donald F., Electronic circuit interconnection system.
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  10. Spinelli, Thomas S.; Manns, William G.; Weirauch, Donald F., Electronic circuit interconnection system.
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  11. Bentlage James R. (Binghamton NY) Engle David E. (Vestal NY) Mariner Geoffrey R. (Apalachin NY) Squires John J. (Endicott NY) Williams John H. (Endicott NY), Electronic package for high density applications.
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  12. Nakatani Hiroshi (Tenri JPX) Kawaguchi Hisao (Nara JPX) Nakabu Shigeo (Nara JPX), Flat display panel with framing for flexible substrate folding.
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  13. Angulas Christopher G. (Endicott NY) Flynn Patrick T. (Owego NY) Funari Joseph (Vestal NY) Kindl Thomas E. (Endwell NY) Orr Randy L. (Vestal NY), Flexible circuit member.
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  14. Canestaro Michael J. (Endicott NY) Summa William J. (Endwell NY), Flexible electrical connection and method of making same.
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  15. Canestaro Michael J. (Endicott NY) Summa William J. (Endwell NY), Flexible electrical connection and method of making same.
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  16. Haas Daniel P. (Houston TX), Flexible printed circuits.
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  17. Juskey Frank J. (Coral Springs FL) Miles Barry M. (Plantation FL) Papageorge Marc V. (Plantation FL), Flip-chip package for integrated circuits.
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  18. Knight Alan D. (Newark Valley NY) Petrozello James R. (Endicott NY), Fluid pressure actuated electrical connector.
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  19. Porter Warren W. (Escondido CA) Lauffer Donald K. (Poway CA), Foldable printed circuit board.
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  20. Kucharek Andrzej (Mountain View CA), High density multi-chip interconnection and cooling package.
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  21. DeMaso Arthur J. (Pepperell MA) Stearns Thomas H. (Nashua NH), High yield combined rigid and flexible printed circuits and method of manufacture.
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  22. Volfson David (Worcester MA) Senturia Stephen D. (Boston MA), High-density, multi-level interconnects, flex circuits, and tape for TAB.
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  23. Smith Kenneth R. (Aloha OR), Integrated circuit package, and method of forming an integrated circuit package.
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  24. Dixon Herbert (West Andover MA) Heinrich Walter (Derry NH) Morris Gilbert (Amherst NH), Interconnected printed circuits and method of connecting them.
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  25. Benko John W. (Trenton NJ) Coucoulas Alexander (Basking Ridge NJ), Laser soldering method and apparatus.
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  26. Kitano Makoto (Ibaraki JPX) Kawai Sueo (Ibaraki JPX) Nishimura Asao (Ushiku JPX) Miura Hideo (Ibaraki JPX) Yaguchi Akihiro (Ibaraki JPX) Kitabayashi Chikako (Ibaraki JPX) Shimizu Ichio (Gunma JPX) Ha, Lead frame and semiconductor device.
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  27. Cooper Paul V. (Kingsley GB2) Marsh Anthony (Blisworth GB2), Magnetic domain devices.
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  28. Swisher Richard L. (Northfield MN), Metal-film laminate resistant to delamination.
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  29. Swisher Richard L. (Northfield MN), Metal-film laminate resistant to delamination.
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  30. Septfons Ren (Paris FRX), Method and device for cooling an integrated circuit package.
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  31. Wilson Arthur M. (Richardson TX), Method for producing an integrated circuit product having a polyimide film interconnection structure.
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  32. Morris Gilbert (Amherst NH) Heinrich Richard P. (Westville NH), Method of making a flexible jumper strip.
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  33. Freyman Bruce J. (N. Lauderdale FL) Dorinski Dale (Coral Springs FL) Shurboff John (Coral Springs FL), Method of making an ultra high density pad array chip carrier.
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  34. Swisher Richard L. (Northfield MN), Method of making metal-film laminate resistant to delamination.
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  35. Kopel Leroy A. (Tempe AZ) Plank Randy G. (Mesa AZ), Method of manufacturing a curved array ultrasonic transducer assembly.
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  36. Yoshikawa Minoru (Tokyo JPX), Method of mounting circuit on substrate and circuit substrate for use in the method.
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  37. Smith Kenneth R. (Aloha OR) Johnston Kent H. (Beaverton OR) LaRue George S. (Beaverton OR) Mueller Robert A. (Portland OR) Tabor Steven A. (Aptos CA), Method of packaging integrated circuit chips, and integrated circuit package.
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  38. Marshall Donald E. (Harvard MA) McElroy James B. (Cupertino CA), Module for interconnecting integrated circuits.
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  39. Mowatt Larry J. (Allen TX) Walter David (Richardson TX), Multi-chip integrated circuit module and method for fabrication thereof.
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  40. Taylor Glen J. (Winter Park FL), Multilayer circuit board with integral flexible appendages.
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  41. Dixon Herbert S. (Derry NH) Weller Jonathan W. (Amherst NH) Boyer Ivon (Merrimack NH) McKenney Darryl J. (Milford NH), Multilayer combined rigid and flex printed circuits.
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  42. Dowling Edward C. (Harrisburg PA) Fortuna Jon A. (New Cumberland PA), Polarized ribbon cable connector having circuit components therein.
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  43. Reding Bennett J. (Colorado Springs CO) McIver Chandler H. (Tempe AZ), Pretestable double-sided tab design.
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  44. Tate Howard L. (Newman Lake WA) Romeike Gary L. (Spokane WA) Tara Vinai M. (Spokane WA) Vocture James L. (Spokane WA), Printed circuit board assembly.
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  45. Gooch Roland W. (Dallas TX), Process for fabrication and assembly of semiconductor devices.
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  46. Barton Carlos L. (Brooklyn CT) Lindsay Adrienne (Chandler AZ) Henson Samuel W. (Mesa AZ), Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefro.
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  47. Bronnenberg David L. (Riviera AZ), Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefro.
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  48. McKenney Darryl J. (Milford NH) Millette Lee (Hudson NH) Dixon Herb (Derry NH) Caron Roland (Hudson NH), Process of forming a rigid-flex circuit.
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  49. Desai Jay (Corona CA), Rigid flex printed circuit configuration.
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  50. McKenney Darryl J. (Milford NH) Millette Lee (Hudson NH) Dixon Herb (Derry NH) Caron Roland (Hudson NH), Rigid-flex printed circuit.
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  51. Chang Cheng-Cheng (Palo Alto CA) Hanlon Lawrence R. (Menlo Park CA), Secondary board for mounting of components having differing bonding requirements.
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  52. Saito Tamio (Tokyo JPX) Yosihara Kunio (Kawasaki JPX), Semiconductor integrated circuit device.
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  53. Kushima Tadao (Ibaraki JPX) Soga Tasao (Hitachi JPX) Yamada Kazuji (Hitachi JPX) Shirai Mitugu (Hadano JPX), Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same.
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  2. Kuo, Bob Shih-Wei, Blind via capture pad structure fabrication method.
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  3. Huemoeller, Ronald Patrick; Rusli, Sukianto; Hiner, David Jon, Buildup dielectric and metallization process and semiconductor package.
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  4. Huemoeller, Ronald Patrick; Rusli, Sukianto; Hiner, David Jon, Buildup dielectric layer having metallization pattern semiconductor package fabrication method.
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  5. Huemoeller, Ronald Patrick; Rusli, Sukianto; Hiner, David Jon, Buildup dielectric layer having metallization pattern semiconductor package fabrication method.
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  6. Oggioni, Stefano; Ravanelli, Roberto, Chip carrier for a high-frequency electronic package.
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  7. Huemoeller, Ronald Patrick; Rusli, Sukianto, Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns.
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  8. Huemoeller,Ronald Patrick; Rusli,Sukianto, Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns.
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  9. St. Amand, Roger D., Column and stacking balls package fabrication method and structure.
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  10. Oishi, Eiji; Endo, Kogo, Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment.
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  14. Schreiber, Christopher; Dunn, Chris, Dimensionally stabilized flexible circuit fabrication method and product.
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  20. Salmon, Peter C., Electronic system modules and method of fabrication.
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  22. Salmon, Peter C., Electronic system modules and method of fabrication.
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  23. Huemoeller, Ronald Patrick; Rusli, Sukianto; Hiner, David Jon; Karim, Nozad Osman, Embedded metal features structure.
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  25. Hiner, David Jon; Huemoeller, Ronald Patrick, Extended landing pad substrate package structure and method.
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  26. Hiner, David Jon; Huemoeller, Ronald Patrick, Extended landing pad substrate package structure and method.
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  27. Harvey Paul M. ; Dower William V. ; Ballard William V.,JPX, Fabrication process for flex circuit applications.
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  28. Scanlan, Christopher M.; St. Amand, Roger D.; Kim, Jae Dong, Fan out build up substrate stackable package and method.
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  32. Webster Larry D. ; Pardo Ehud ; Duluk ; Jr. Jerome F., Flexible electrical test fixture for integrated circuits on prototype and production printed circuit boards.
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  33. Hsieh, Chin-Tang; Wu, Fei-Jain; Tu, Chia-Jung, Flexible substrate.
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