초록 ▼

An optical semiconductor module comprises an optical semiconductor element, an optical fiber, a monocrystalline substrate, an airtight sealing member and a reinforcing plate. Light is transmitted through the optical semiconductor element and the optical fiber. The optical semiconductor element and t

An optical semiconductor module comprises an optical semiconductor element, an optical fiber, a monocrystalline substrate, an airtight sealing member and a reinforcing plate. Light is transmitted through the optical semiconductor element and the optical fiber. The optical semiconductor element and the optical fiber are mounted on the monocrystalline substrate. The optical semiconductor element is sealed airtight by the airtight sealing member. An optical axis aligning mechanism for aligning the optical axis of the optical semiconductor element with the optical axis of the optical fiber is arranged on the monocrystalline substrate. The reinforcing body is welded with metal on the rear surface of the monocrystalline substrate.

대표청구항 ▼

[ What is claimed is:] [1.] An optical semiconductor module adapted to a plurality of optical transmission and reception channels, comprising:a monocrystalline substrate having first and second surfaces;an optical semiconductor array formed on the first surface of the monocrystalline substrate, havi

[ What is claimed is:] [1.] An optical semiconductor module adapted to a plurality of optical transmission and reception channels, comprising:a monocrystalline substrate having first and second surfaces;an optical semiconductor array formed on the first surface of the monocrystalline substrate, having a plurality of optical axes, for performing light emitting and receiving functions;an optical fiber array formed on the first surface of the monocrystalline substrate, having a plurality of optical axes, for transmitting light received and emitted by the optical semiconductor array;an optical axis aligning mechanism, formed on the first surface of the monocrystalline substrate, for aligning the optical axes of the optical semiconductor array with the optical axes of the optical fiber array;an airtight sealing member formed on the first surface of the monocrystalline substrate for forming an airtight seal around the optical semiconductor array and a portion of the optical fiber array; anda reinforcing body formed on the second surface of the monocrystalline substrate and thermally connected to a part of the airtight sealing member, and having a thermal expansion characteristic substantially equal to that of the airtight sealing member.