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Stable, low cure-temperature semi-structural pressure sensitive adhesive 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08F-002/50
  • C08F-004/80
  • C09J-013/308
  • C09J-013/310
출원번호 US-0531275 (1995-10-05)
발명자 / 주소
  • Karim Naimul
  • Kinzer Kevin E.
  • Everaerts Albert I.
  • Halm Leo W.
  • Keipert Steven J.
  • Williams Jerry W.
출원인 / 주소
  • Minnesota Mining and Manufacturing Company
대리인 / 주소
    Peters
인용정보 피인용 횟수 : 39  인용 특허 : 0

초록 ▼

A curable pressure sensitive adhesive having long shelf stability comprising (a) at least one free radically polymerized polymer; (2) at least one cationically-polymerizable monomer; (3) a photo-activatable catalyst system for the cationically-polymerizable monomer comprising either at least one org

대표청구항 ▼

[ We claim:] [1.] A post curable pressure sensitive adhesive consisting essentially of:(1) at least one free radically polymerized polymer;(2) at least one cationically-polymerizable monomer;(3) a photo-activatable catalyst system for the cationically-polymerizable monomer comprising either at least

이 특허를 인용한 특허 (39)

  1. Zajaczkowski, Michael; Waterman, Michael T.; Heimbach, Kyle R.; Bartholomew, Eric L.; Miller, Brandon S., Adhesives and related methods.
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  2. Zajaczkowski, Michael; Waterman, Michael T.; Heimbach, Kyle R.; Bartholomew, Eric L.; Miller, Brandon S., Adhesives and related methods.
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  3. Zajaczkowski, Michael; Waterman, Michael T.; Heimbach, Kyle R.; Bartholomew, Eric L.; Miller, Brandon S., Adhesives and related methods.
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  4. Zajaczkowski, Michael; Waterman, Michael T.; Heimbach, Kyle R.; Bartholomew, Eric L.; Miller, Brandon S., Adhesives and related methods.
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  5. Zajaczkowski, Michael; Waterman, Michael T.; Heimbach, Kyle R.; Bartholomew, Eric L.; Miller, Brandon S., Adhesives and related methods.
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  6. Zajaczkowski, Michael; Waterman, Michael T.; Heimbach, Kyle R.; Bartholomew, Eric L.; Miller, Brandon S., Adhesives and related methods.
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  7. Zajaczkowski, Michael; Waterman, Michael T.; Heimbach, Kyle R.; Bartholomew, Eric L.; Miller, Brandon S., Adhesives and related methods.
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  8. Zajaczkowski, Michael; Waterman, Michael T.; Heimbach, Kyle R.; Bartholomew, Eric L.; Miller, Brandon S., Adhesives and related methods.
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  9. Ha Chau Thi Minh ; Sullivan Michael G., Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs.
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  10. Chau Thi Minh Ha ; Michael G. Sullivan, Cationic and hybrid radiation-curable adhesives for bonding of optical discs.
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  11. Rakow, Neal A.; Lyons, Christopher S.; Maki, Stephen P., Colorimetric sensor.
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  12. Rakow,Neal A.; Lyons,Christopher S.; Maki,Stephen P., Colorimetric sensor.
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  13. Wendland, Michael S.; Rakow, Neal A.; Palazzotto, Michael C.; Weiss, Douglas E., Colorimetric sensors.
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  14. Kim, Jang Soon; Lee, Yong Hoon; Choi, Won Gu, Composition for forming electronic paper without particle freezing, and adhesive film prepared thereby.
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  15. Oxman Joel D. ; Trom Matthew C. ; Jacobs Dwight W., Compositions featuring cationically active and free radically active functional groups, and methods for polymerizing such compositions.
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  16. Shinji Murai JP; Shuji Hayase JP; Shinetsu Fujieda JP; Rumiko Hayase JP; Yasuyuki Hotta JP, Curing catalyst, resin composition, resin-sealed semiconductor device and coating material.
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  17. Sumida,Yukihiro; Sato,Takashi; Kihara,Hidenori; Watanabe,Noriko, Display device including adhesive film with transparent support.
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  18. Schwartz, Evan L.; Hartmann-Thompson, Claire; Cheng, Shijing; Erickson, Nicholas C., Dual-cure nanostructure transfer film.
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  19. Husemann, Marc; Zollner, Stephan; Westphal, Andreas, Electrically heatable pressure-sensitive adhesive compound.
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  20. Kawate Kohichiro,JPX ; Ishii Shigeyoshi,JPX ; Perez Mario A., Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition.
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  21. Yang, Jie; Salnikov, Dmitriy; Balich, Jason W., Hybrid adhesives, articles, and methods.
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  22. Everaerts, Albert I.; Nguyen, Lang N., Imagewise printing of adhesives and limited coalescence polymerization method.
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  23. Jun Hai Liu ; Bor Zeng Jang, Layer manufacturing using electrostatic imaging and lamination.
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  24. Burns, Barry N., Low temperature, cationically curable compositions with improved cure speed and toughness.
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  25. Husemann,Marc; Z？llner,Stephan; W？rden,Kai Tom, Method for cross-linking polyacrylates.
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  26. Ellis, Mark F.; Goeb, Siegfried R.; Graichen, Andreas H.; Kuester, Frank, Method for preparing a pressure-sensitive adhesive.
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  27. Watanabe,Noriko; Sato,Takashi; Sumida,Yukihiro; Shimaoka,Junichi, Multi-layer sheet and liquid crystal display device.
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  28. Yamamura Tetsuya,JPX ; Watanabe Tsuyoshi,JPX ; Takeuchi Akira,JPX ; Ukachi Takashi,JPX, Photo-curable resin composition used for photo fabication of three-dimensional objects.
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  29. Tetsuya Yamamura JP; Tsuyoshi Watanabe JP; Akira Takeuchi JP; Takashi Ukachi JP, Photo-curable resin composition used for photo-fabrication of three-dimensional object.
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  30. Yamamura, Tetsuya; Watanabe, Tsuyoshi; Takeuchi, Akira; Ukachi, Takashi, Photo-curable resin composition used for photo-fabrication of three-dimensional object.
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  31. Murray, Helen M.; Wigham, Jonathan P.; Cahill, John E.; Lakes, Aisling; Holloway, Matthew J.; Ledwidge, Eadaoin D.; Ward, Mary B., Photocurable adhesive compositions, reaction products of which have low halide ion content.
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  32. Bretscher Kathyrn R. ; Rusin Richard P. ; Craig Bradley D. ; Mitra Sumita B. ; Oxman Joel D. ; Gust Janis R. ; Hayne Cheryl A. ; Westberg James W. ; Trom Matthew C. ; Kolb Brant U. ; Jacobs Dwight W., Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same.
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  33. Kathyrn R. Bretscher ; Richard P. Rusin ; Sumita B. Mitra ; Janis R. Gust ; Cheryl A. Hayne ; Dwight W. Jacobs ; David A. Kaisaki, Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same.
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  34. Rusin,Richard P., Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same.
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  35. Rusin,Richard P.; Craig,Bradley D.; Oxman,Joel D.; Westberg,James W.; Trom,Matthew C.; Kolb,Brant U.; Baker,James A., Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same.
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  36. Nakasuga, Akira; Fukui, Hiroji, Sheet-form, curable pressure-sensitive adhesive.
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  37. O'Leary,Robert J.; Alter,Harry; Estes,Matthew J., Structured adhesive system.
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  38. Husemann, Marc; Z?llner, Stephan, Thermally crosslinked acrylic hotmelts.
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  39. Hosokawa Kazuhito,JPX ; Oura Masahiro,JPX, Thermosetting adhesive and adhesive sheet thereof.
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