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Apparatus for packaging contaminant-sensitive articles and resulting package

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F26B-019/00
출원번호 US-0685697 (1996-07-24)
발명자 / 주소
  • Brooks Ray G.
  • Brooks Timothy W.
  • Fowler Stephen L.
대리인 / 주소
    Mantooth
인용정보 피인용 횟수 : 84  인용 특허 : 6

초록

A package for storing contaminant-sensitive articles in a contaminant-free environment featuring a pair of polymeric material circular half-sections having a bottom wall and a side wall. The half sections are arranged for overlying ans sliding engagement from a spaced-apart, open position into a sto

대표청구항

[ We claim:] [1.] A package for storing contaminant-sensitive articles in a contaminant-free environment comprising, in combination, a pair of half-sections of polymeric material, each of said half-sections having a bottom wall and a side wall, said half-sections arranged for overlying, sliding enga

이 특허에 인용된 특허 (6)

  1. Holliday James E. (75 “E.”Watchhill Dr. Colorado Springs CO 80906) Gallagher Gary M. (440F Autumn Ridge Cir. Colorado Springs CO 80906), Enclosed sealable purgible semiconductor wafer holder.
  2. DeAngelis, Robert L.; Gallagher, Gary M., Gas purge system for isolation enclosure for contamination sensitive items.
  3. Brooks Ray G. (Irving TX) Brooks Timothy W. (Irving TX) Corris C. James (Elkmont AL), Method and apparatus for maintaining clean articles.
  4. Brooks Ray G. (Irving TX) Brooks Timothy W. (Irving TX), Method and apparatus for maintaining sensitive articles in a contaminant-free environment.
  5. Vandergriff Johnie B. (1855 Romand Dr. Monroe MI 48161), Storage container with sealed storage compartment for a purging gas cartridge.
  6. Fukutomi Yoshiteru (Kyoto JPX) Ohtani Masami (Kyoto JPX) Okamoto Takeo (Kyoto JPX), Substrate transport apparatus.

이 특허를 인용한 특허 (84)

  1. Ootsuka, Fumio, 3D stacked multilayer semiconductor memory using doped select transistor channel.
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  4. Kamata, Keisuke; Sato, Hiroyuki; Furukawahara, Kazunori; Suwada, Masaei; Okubo, Kenkichi; Arai, Izumi, Apparatus and method for pre-baking substrate upstream of process chamber.
  5. Kamiya, Tatsuo, Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum.
  6. den Hartog Besselink, Edwin; Garssen, Adriaan; Dirkmaat, Marco, Cassette holder assembly for a substrate cassette and holding member for use in such assembly.
  7. Chevalier Mathieu,FRX ; Chevalier Christophe,FRX, Close contamination protection device and method thereof for food.
  8. Lee Lewis ; Kurodearimasu Takeshi Hirose JP; Jeffrey Wilson ; James Dove ; Michael Hayden, Containment device for retaining semiconductor wafers.
  9. Lewis Lee ; Hirose Kurodearimasu Takeshi,JPX ; Wilson Jeffrey ; Dove James ; Hayden Michael, Containment device for retaining semiconductor wafers.
  10. Lewis, Lee; Hirose, Kurodearimasu Takeshi; Wilson, Jeffrey; Dove, James; Hayden, Michael, Containment device for retaining semiconductor wafers.
  11. Zaitsu, Masaru; Fukazawa, Atsuki; Fukuda, Hideaki, Continuous process incorporating atomic layer etching.
  12. Raisanen, Petri; Shero, Eric; Haukka, Suvi; Milligan, Robert Brennan; Givens, Michael Eugene, Deposition of metal borides.
  13. Zhu, Chiyu; Shrestha, Kiran; Haukka, Suvi, Deposition of metal borides.
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  15. Milligan, Robert Brennan, Formation of boron-doped titanium metal films with high work function.
  16. Brooks, Ray G.; Brooks, Timothy W., Integrated circuit wafer packaging system and method.
  17. Jung, Sung-Hoon, Metal oxide protective layer for a semiconductor device.
  18. Pore, Viljami, Method and apparatus for filling a gap.
  19. Pore, Viljami; Knaepen, Werner; Jongbloed, Bert; Pierreux, Dieter; Van Aerde, Steven R. A.; Haukka, Suvi; Fukuzawa, Atsuki; Fukuda, Hideaki, Method and apparatus for filling a gap.
  20. Pore, Viljami; Knaepen, Werner; Jongbloed, Bert; Pierreux, Dieter; Van Der Star, Gido; Suzuki, Toshiya, Method and apparatus for filling a gap.
  21. Brooks Ray G., Method and apparatus for packaging contaminant-sensitive articles and resulting package.
  22. Brooks Ray Gene, Method and apparatus for packing contaminant-sensitive articles and resulting package.
  23. Howland, Jr.,William H.; Healy, Jr.,James E., Method and apparatus for removing and/or preventing surface contamination of a probe.
  24. Tolle, John; Hill, Eric; Winkler, Jereld Lee, Method and system for in situ formation of gas-phase compounds.
  25. Jung, Sung-Hoon; Raisanen, Petri; Liu, Eric Jen Cheng; Schmotzer, Mike, Method and system to reduce outgassing in a reaction chamber.
  26. Winkler, Jereld Lee, Method and systems for in-situ formation of intermediate reactive species.
  27. Suemori, Hidemi, Method for depositing dielectric film in trenches by PEALD.
  28. Kang, DongSeok, Method for depositing thin film.
  29. Takamure, Noboru; Okabe, Tatsuhiro, Method for forming Ti-containing film by PEALD using TDMAT or TDEAT.
  30. Shiba, Eiichiro, Method for forming aluminum nitride-based film by PEALD.
  31. Winkler, Jereld Lee, Method for forming conformal carbon films, structures conformal carbon film, and system of forming same.
  32. Fukazawa, Atsuki, Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition.
  33. Fukazawa, Atsuki; Fukuda, Hideaki; Takamure, Noboru; Zaitsu, Masaru, Method for forming dielectric film in trenches by PEALD using H-containing gas.
  34. Kimura, Yosuke; de Roest, David, Method for forming film having low resistance and shallow junction depth.
  35. Ishikawa, Dai; Fukazawa, Atsuki, Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches.
  36. Namba, Kunitoshi, Method for forming silicon oxide cap layer for solid state diffusion process.
  37. Shiba, Eiichiro, Method for performing uniform processing in gas system-sharing multiple reaction chambers.
  38. Yamagishi, Takayuki; Suwada, Masaei; Tanaka, Hiroyuki, Method for positioning wafers in multiple wafer transport.
  39. Kato, Richika; Nakano, Ryu, Method for protecting layer by forming hydrocarbon-based extremely thin film.
  40. Kato, Richika; Okuro, Seiji; Namba, Kunitoshi; Nonaka, Yuya; Nakano, Akinori, Method for protecting layer by forming hydrocarbon-based extremely thin film.
  41. Zaitsu, Masaru, Method of atomic layer etching using functional group-containing fluorocarbon.
  42. Zaitsu, Masaru; Kobayashi, Nobuyoshi; Kobayashi, Akiko; Hori, Masaru; Kondo, Hiroki; Tsutsumi, Takayoshi, Method of cyclic dry etching using etchant film.
  43. Knaepen, Werner; Maes, Jan Willem; Jongbloed, Bert; Kachel, Krzysztof Kamil; Pierreux, Dieter; De Roest, David Kurt, Method of forming a structure on a substrate.
  44. Lee, Choong Man; Yoo, Yong Min; Kim, Young Jae; Chun, Seung Ju; Kim, Sun Ja, Method of forming metal interconnection and method of fabricating semiconductor apparatus using the method.
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  47. Dao, Giang T.; Kuse, Ronald J., Method of transporting a reticle.
  48. Kohen, David; Profijt, Harald Benjamin, Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures.
  49. Raisanen, Petri; Givens, Michael Eugene, Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures.
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  51. Margetis, Joe; Tolle, John, Methods of forming silicon germanium tin films and structures and devices including the films.
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  56. Alokozai, Fred; Milligan, Robert Brennan, Process gas management for an inductively-coupled plasma deposition reactor.
  57. Zabka,Michael; Nigg,James, Protective shipper.
  58. Brooks Ray G. ; Brooks Timothy ; Fowler Steve L. ; Neal Robert A., Protective system for integrated circuit (IC) wafers retained within containers designed for storage and shipment.
  59. Winkler, Jereld Lee, Pulsed remote plasma method and system.
  60. Dao Giang T. ; Kuse Ronald J., Reduced particle contamination manufacturing and packaging for reticles.
  61. Dao, Giang T.; Kuse, Ronald J., Reduced particle contamination manufacturing and packaging for reticles.
  62. Dao, Giang T.; Kuse, Ronald J., Reduced particle contamination manufacturing and packaging for reticles.
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  64. Wang, Song; Wan, Jiyu; Feng, He; Wu, Hongjiang, Reduced pressure drying method and device of a substrate.
  65. Kim Beom-Soo,KRX, Reticle cleaning apparatus for wafer exposure system.
  66. Zhu, Chiyu, Selective film deposition method to form air gaps.
  67. Kim, Young Jae; Choi, Seung Woo; Yoo, Yong Min, Semiconductor device and manufacturing method thereof.
  68. Milligan, Robert Brennan; Alokozai, Fred, Semiconductor reaction chamber with plasma capabilities.
  69. Cleaver, Brian, Shock absorbing apparatus and method.
  70. Cleaver,Brian, Shock absorbing apparatus and method.
  71. Bores, Gregory W.; Zabka, Michael C.; Henderer, Ralph, Shock resistant variable load tolerant wafer shipper.
  72. Arai, Izumi, Single-and dual-chamber module-attachable wafer-handling chamber.
  73. Xie, Qi; de Roest, David; Woodruff, Jacob; Givens, Michael Eugene; Maes, Jan Willem; Blanquart, Timothee, Source/drain performance through conformal solid state doping.
  74. Tolle, John, Structures and devices including germanium-tin films and methods of forming same.
  75. Jeong, Sang Jin; Han, Jeung Hoon; Choi, Young Seok; Park, Ju Hyuk, Susceptor for semiconductor substrate processing apparatus.
  76. Tang, Fu; Givens, Michael Eugene; Xie, Qi; Raisanen, Petri, System and method for gas-phase sulfur passivation of a semiconductor surface.
  77. Lawson, Keith R.; Givens, Michael E., Systems and methods for dynamic semiconductor process scheduling.
  78. Coomer, Stephen Dale, Variable adjustment for precise matching of multiple chamber cavity housings.
  79. Shugrue, John Kevin, Variable conductance gas distribution apparatus and method.
  80. Schmotzer, Michael; Whaley, Shawn, Variable gap hard stop design.
  81. Forsyth, Valoris L.; Gardiner, Jim; Brown, Berry, Wafer box with radially pivoting latch elements.
  82. Parks,John, Wafer edge wheel with drying function.
  83. Parks,John, Wafer edge wheel with drying function.
  84. Cleaver, Brian R., Wafer shipping and storage container.
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