초록 ▼

A modular microchannel heat exchanger for cooling a heated region and a method for making the device. A first section of the device features an array of thin copper sheets which are etched with rows of elongated holes that pierce the sheets, coated with silver and held together with the holes aligne

A modular microchannel heat exchanger for cooling a heated region and a method for making the device. A first section of the device features an array of thin copper sheets which are etched with rows of elongated holes that pierce the sheets, coated with silver and held together with the holes aligned. These holes form a microchannel having a desired aspect ratio. A second section of the device has a series of thin copper plates which are etched as apertures, coated with silver and stacked in a sequence on the sheets of the first section, the plate closest to the sheets having elongated apertures oriented transversely to the microchannel of the sheets, the apertures combining further from the sheets into circular apertures to fit a coaxial inlet and outlet conduit where unitary or pipe flow occurs. The inlet conduit is, through the branching series of plates, in communication with alternately spaced elongated apertures adjacent to the microchannel of the sheets, and the outlet conduit is in communication with the other alternate elongated apertures. A case for both sections has an inlet and outlet chamber with holes that the inlet and outlet conduits plug into.

대표청구항 ▼

[ We claim:] [1.] An apparatus for cooling a heated region comprising:a liquid coolant;a thermally conductive substrate in heat exchange communication with said heated region;a first body having a plurality of elongated passageways;a second body, disposed between said substrate and said first body,

[ We claim:] [1.] An apparatus for cooling a heated region comprising:a liquid coolant;a thermally conductive substrate in heat exchange communication with said heated region;a first body having a plurality of elongated passageways;a second body, disposed between said substrate and said first body, with said second body being in heat exchange communication with said substrate and including a plurality of microchannels, with said plurality of elongated passageways defining a plurality of inlet apertures and a plurality of outlet apertures, with said plurality of inlet and outlet apertures being interspaced and in flow communication with said plurality of microchannels;means, in flow communication with said plurality of inlet apertures, for symmetrically dividing a stream of said liquid coolant moving toward said plurality of inlet apertures into a plurality of coolant flows, said symmetrically dividing means formed from a plurality of laminae arranged as a contiguous stack, each of said plurality of laminae having multiple throughaways disposed therein, with a subset of said multiple throughways of adjacent laminae being aligned, defining a flow path in fluid communication with said plurality of inlet apertures, a first of said plurality of laminae being disposed between a second and third of said plurality of laminae and having one said throughway including a central portion and a pair of tributary portions, each of which extends from said central portion in opposing directions, with said second of said plurality of laminae having one said throughway with a cross-sectional area coinciding with a region of said central portion and said third of said plurality of laminae having a barrier portion coinciding with said region and having a plurality of said throughways, so that a flow traveling along said flow path and through said central portion is evenly divided by passing through said pair of tributary portions and a subgroup of said plurality of throughways;means, in fluid communication with said symmetrically dividing means, for supplying said coolant to said inlet apertures via said subset of said multiple throughways; andmeans for receiving said coolant from said outlet apertures.