초록 ▼

A thin and flat integrated circuit assembly (10, 40) may be achieved by using a thin carrier (20) with shallow cavities (22, 24) for holding the integrated circuits (16) and/or discrete circuit components (14). The integrated circuits (16) and/or circuit components (14) may be friction fitted in the

A thin and flat integrated circuit assembly (10, 40) may be achieved by using a thin carrier (20) with shallow cavities (22, 24) for holding the integrated circuits (16) and/or discrete circuit components (14). The integrated circuits (16) and/or circuit components (14) may be friction fitted in the cavities (22, 24) or they may be secured therein by the use of adhesives and/or solder. Electrical connection between the integrated circuits (16) and circuit components (14) may be done with wire bonding, ribbon bonding, tape-automated bonding, lead frames, flip chip bonding, and/or conductive gluing of leads. The circuit assembly may then be accommodated into a credit card-sized packaging with standard dimensions set by the International Standards Organization.

대표청구항 ▼

[ What is claimed is:] [1.] A batteryless flat integrated circuit assembly, comprising:at least one integrated circuit;a capacitor;a carrier having a thickness less than that of the integrated circuit and capacitor, said carrier defining shallow cavities for accommodating each of said integrated cir

[ What is claimed is:] [1.] A batteryless flat integrated circuit assembly, comprising:at least one integrated circuit;a capacitor;a carrier having a thickness less than that of the integrated circuit and capacitor, said carrier defining shallow cavities for accommodating each of said integrated circuit and capacitor; andelectrical connectors connecting said at least one integrated circuit and capacitor.