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Method of making IC card 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/30
  • H05K-013/04
  • B29C-045/03
  • B32B-031/12
출원번호 US-0716540 (1996-09-19)
우선권정보 JP-0345327 (1991-12-26)
발명자 / 주소
  • Ochi Katsunori,JPX
  • Takemura Seiji,JPX
  • Kodai Syojiro,JPX
  • Kurisu Tuguo,JPX
출원인 / 주소
  • Mitsubishi Denki Kabushiki Kaisha, JPX
대리인 / 주소
    Leydig, Voit & Mayer, Ltd.
인용정보 피인용 횟수 : 61  인용 특허 : 4

초록

A method of producing a thin IC card having a built-in battery includes forming a through-hole including an edge in a circuit board having obverse and reverse main surfaces, a circuit pattern being present on a first of the main surfaces of the circuit board; mounting a functional part on the first

대표청구항

[ What is claimed is:] [1.] A method of producing a thin IC card having a built-in battery comprising:forming a through-hole including an edge, in a circuit board, the circuit board having first and second main surfaces, a circuit pattern being present on the first main surface;mounting a functional

이 특허에 인용된 특허 (4)

  1. Haghiri-Tehrani Yahya (Munich DEX) Hoppe Joachim (Munich DEX), Method for producing a carrier element for an IC-chip.
  2. Hoppe Joachim (Munich DEX), Method for producing an identification card with an integrated circuit.
  3. Endoh Kenji (Iruma JPX) Narui Fumio (Tokyo JPX) Sugiyama Kazuhiro (Tokyo JPX) Hara Kazuya (Tokyo JPX) Shimazaki Tatsuo (Tokyo JPX), Method of manufacturing a small electronic device.
  4. Nakanishi Chiaki (Ogaki) Hiroi Atsushi (Ogaki) Yanagawa Yoji (Ogaki JPX), Printed wiring board for IC cards.

이 특허를 인용한 특허 (61)

  1. Bolken,Todd O., Alternative method used to package multimedia card by transfer molding.
  2. Gfeller Martin,CHX ; Christen Otto,CHX ; Grunder Emil,CHX, Apparatus supplying components to a placement machine with splice sensor.
  3. Nelson, Craig; Singleton, Robert W.; Scruggs, Michael G.; Guindy, Wade W., Battery.
  4. Nelson, Craig; Singleton, Robert W.; Scruggs, Michael G.; Guindy, Wade W., Battery tab and packaging frame design.
  5. Wensley, C. Glen; Gustafson, Scott; Nelson, Craig R., Card with embedded IC and electrochemical cell.
  6. Tuttle,Mark E., Communication devices, remote intelligent communication devices, electronic communication devices, methods of forming remote intelligent communication devices and methods of forming a radio frequency.
  7. Sauers, Matthew Carlyle, Consumer electronic device with elastomeric mat.
  8. Tuttle, Mark E., Electronic communication devices, methods of forming electrical communication devices, and communications methods.
  9. Jacobsen,Jeffrey Jay; Gengel,Glenn Wilhelm; Hadley,Mark A.; Craig,Gordon S. W.; Smith,John Stephen, Electronic devices with small functional elements supported on a carrier.
  10. Tuttle Mark E. ; Lake Rickie C., Embedded circuits.
  11. McAllister, Michael F.; Pross, Harald; Ruehle, Gerhard H.; Scholz, Wolfgang A.; Schoor, Gerhard, Gel package structural enhancement of compression system board connections.
  12. McAllister, Michael F.; Pross, Harald; Ruehle, Gerhard H.; Scholz, Wolfgang A.; Schoor, Gerhard, Gel package structural enhancement of compression system board connections.
  13. Bunert Peter,DEX, Housing for electronic circuit implementable in an electronic card, and a method of manufacturing such a card.
  14. Sakamoto Noriaki,JPX ; Shimizu Hisashi,JPX, IC card module, manufacturing method therefor, hybrid integrated circuit module, and manufacturing method thereof.
  15. Eskildsen, Steven R.; Franz, Jeffrey C.; Brannam, David S., IC package with edge connect contacts.
  16. Eskildsen Steven R. ; Franz Jeffrey C. ; Brannam David S., IC package with quick connect feature.
  17. Eskildsen, Steven R.; Franz, Jeffrey C.; Brannam, David S., IC package with quick connect feature.
  18. Mannhart Eugen,CHX ; Ulrich Alois,CHX ; Guenther Thomas,CHX ; Krieger Matthias,CHX, Method and apparatus for aligning the bonding head of a bonder, in particular a die bonder.
  19. Yabushita, Noriyuki; Yoshiba, Toshikazu, Method for attaching a flat-shaped battery and apparatus to be attached to a rotary portion.
  20. Finkelstein, Alan, Method for making a financial transaction card with embedded electronic circuitry.
  21. Tarantino, Thomas; Ponikwar, Walter; Salzer, Tobias; Endres, Günter; Schellenberger, Cristina, Method for manufacturing a data carrier body for a portable data carrier and data carrier body.
  22. Wensley, C. Glen; Gustafson, Scott; Nelson, Craig R., Method of forming a card with embedded IC and electrochemical cell.
  23. Credelle, Thomas Lloyd; Gengel, Glenn; Stewart, Roger Green; Joseph, William Hill, Method of making a radio frequency identification (RFID) tag.
  24. Tuttle Mark E. ; Lake Rickie C., Methods for forming integrated circuits within substrates.
  25. Tuttle,Mark E.; Lake,Rickie C., Methods for forming integrated circuits within substrates.
  26. Credelle,Thomas Lloyd; Gengel,Glenn; Stewart,Roger Green; Joseph,William Hill, Methods for making electronic devices with small functional elements supported on a carriers.
  27. Credelle, Thomas Lloyd; Gengel, Glenn; Stewart, Roger Green; Joseph, William Hill, Methods of making a radio frequency identification (RFID) tags.
  28. Jonathan L. McFarland ; Steve W. Greathouse ; Eric Gelvin, Paper substrates for use in integrated circuit packaging molding processes.
  29. Tsao, Paul; Brown, Kerry D., Payment card manufacturing technology.
  30. Gfeller Martin,CHX ; Christen Otto,CHX ; Grunder Emil,CHX, Placement machine and a method to control a placement machine.
  31. Wensley,C. Glen; Vall?e,Alain; Brouillette,Dany; Gustafson,Scott, Polyimide matrix electrolyte.
  32. Wensley,C. Glen; Gustafson,Scott; Nelson,Craig R.; Singleton,Robert W.; Vallee,Alain; Brouillette,Dany, Polyimide matrix electrolyte and improved batteries therefrom.
  33. Vallee, Allain; Brouillette, Dany; Pugh, James K.; Guindy, Wade W., Polyimide-based lithium metal battery.
  34. Vall��e,Alain; Brouillette,Dany; Pugh,James K.; Guindy,Wade W., Polyimide-based lithium metal battery.
  35. Vinciarelli, Patrizio; Curhan, Jeffrey A., Protective coating for an electronic device.
  36. Gengel, Glenn W.; Hadley, Mark A.; Pounds, Tom; Schatz, Kenneth D.; Drzaic, Paul S., RFID tags and processes for producing RFID tags.
  37. Gengel, Glenn W.; Hadley, Mark A.; Pounds, Tom; Schatz, Kenneth D.; Drzaic, Paul S., RFID tags and processes for producing RFID tags.
  38. Gengel, Glenn W.; Hadley, Mark A.; Pounds, Tom; Schatz, Kenneth D.; Drzaic, Paul S., RFID tags and processes for producing RFID tags.
  39. Gengel, Glenn W.; Hadley, Mark A.; Pounds, Torn; Schatz, Kenneth D.; Drzaic, Paul S., RFID tags and processes for producing RFID tags.
  40. Gengel,Glenn W.; Hadley,Mark A.; Pounds,Tom; Schatz,Kenneth D.; Drzaic,Paul S., RFID tags and processes for producing RFID tags.
  41. Gengel,Glenn W.; Hadley,Mark A.; Pounds,Tom; Schatz,Kenneth D.; Drzaic,Paul S., RFID tags and processes for producing RFID tags.
  42. Carrender, Curt, Radio frequency identification (RFID) tag for an item having a conductive layer included or attached.
  43. Carrender, Curt, Radio frequency identification (RFID) tag for an item having a conductive layer included or attached.
  44. Carrender, Curt, Radio frequency identification (RFID) tag for an item having a conductive layer included or attached.
  45. Tuttle, John R., Radio frequency identification device and method.
  46. Tuttle, John R., Radio frequency identification device and method.
  47. Tuttle, John R., Radio frequency identification device and method.
  48. Miyajima Fumio,JPX, Resin molding method in which a movable cavity piece allows a direct resin feed.
  49. Sauers, Matthew Carlyle, Robust consumer electronic device.
  50. Viggiano Franco,CHX ; Koster Christof,CHX, Semi-conductor mounting apparatus for applying adhesive to a substrate.
  51. Hudson Edison T., Semiconductor die in-flight registration and orientation method and apparatus.
  52. Wensel,Richard W., Semiconductor die with attached heat sink and transfer mold.
  53. Schindler Samuel,CHX, Semiconductor mounting apparatus with a chip gripper travelling back and forth.
  54. Tuttle, John R., System and method to track articles at a point of origin and at a point of destination using RFID.
  55. Tuttle,John R., Thin flexible, RFID labels, and method and apparatus for use.
  56. Tuttle,John R., Thin, flexible, RFID label and system for use.
  57. Carrender,Curt, Transponder incorporated into an electronic device.
  58. Parrini Lorenzo,CHX, Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder.
  59. Finkelstein, Alan, Wallet card with built-in light.
  60. Jacobsen,Jeffrey Jay; Gengel,Glenn Wilhelm; Hadley,Mark A.; Craig,Gordon S. W.; Smith,John Stephen, Web process interconnect in electronic assemblies.
  61. Nakagawa, Mitsuru; Maruyama, Terutaka, Wireless transceiver for automotive vehicle.
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