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Method and apparatus for bonding using brazing material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-031/02
  • B23K-035/38
출원번호 US-0347398 (1995-02-10)
우선권정보 JP-0113204 (1993-05-14)
국제출원번호 PCT/JP94/005 (1994-04-05)
§371/§102 date 19950210 (19950210)
국제공개번호 WO-9422628 (1994-10-13)
발명자 / 주소
  • Mori Yoshiaki,JPX
  • Miyakawa Takuya,JPX
  • Asano Yasuhiko,JPX
  • Kurashina Osamu,JPX
  • Miyamori Satoshi,JPX
  • Kurashima Yohei,JPX
  • Anan Makoto,JPX
출원인 / 주소
  • Seiko Epson Corporation, JPX
대리인 / 주소
    Stroock & Stroock & Lavan LLP
인용정보 피인용 횟수 : 27  인용 특허 : 29

초록

High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to components, which are under atmospheric pressure, by exposing them to the gas

대표청구항

[ What is claimed is:] [1.] A method of bonding two components together employing a brazing material comprising the steps of forming a gas discharge in a gas near or at atmospheric pressure to produce active species of said gas by providing energy across said gas; and then treating a surface of at l

이 특허에 인용된 특허 (29)

  1. Reisman Arnold (Raleigh) Temple Dorota (Raleigh NC), Alternating cyclic pressure modulation process for selective area deposition.
  2. Bobbio Stephen M. (Wake Forest NC), Apparatus and method for controlling processing uniformity in a magnetron.
  3. Liu Yung S. (Schenectady NY) Grubb Willard T. (Schenectady NY), Apparatus and method for photoetching of polyimides, polycarbonates and polyetherimides.
  4. Tanisaki Tatsuzo (Onomichi JPX), Apparatus for atmospheric plasma treatment of a sheet-like structure.
  5. Yoneda Masahiro (Itami JPX) Hine Shiro (Minoh JPX) Koyama Hiroshi (Amagasaki JPX), Cleaning device for a plasma etching system.
  6. Tsai Chin-Chi (Oak Ridge TN) Haselton Halsey H. (Knoxville TN), Coupled microwave ECR and radio-frequency plasma source for plasma processing.
  7. Kumihashi Takao (Musashino JPX) Tsujimoto Kazunori (Higashiyamato JPX) Tachi Shinichi (Sayama JPX), Dry etching apparatus and method.
  8. Ishida Tomoaki (Hyogo JPX), Dry etching method of copper or copper alloy interconnection layer employing plasma of an iodine compound.
  9. Grewal Virinder S. (Fishkill NY) Laux Volker B. (Munich DEX), Etch chamber having three independently controlled electrodes.
  10. Haigh John (Ipswich GB2) Aylett Martin R. (Felixstowe GB2), Etching method.
  11. Terada Yasuharu (Uozu JPX) Suzuki Tsuneo (Kurobe JPX) Matsushima Hideyuki (Toyama JPX) Horita Yoshiyuki (Toyama JPX), Fastening device.
  12. Koopman Nicholas G. (Raleigh NC) Nangalia Sundeep (Raleigh NC), Fluxless soldering of copper.
  13. Dishon Giora (Jerusalem NC ILX) Bobbio Stephen M. (Wake Forest NC), Fluxless soldering process.
  14. Bobbio Stephen M. (Wake Forest NC) Koopman Nicholas G. (Raleigh NC) Nangalia Sundeep (Raleigh NC), Fluxless soldering sample pretreating system.
  15. Blackwood Robert S. (Lubbock TX) Biggerstaff Rex L. (Lubbock TX) Clements L. Davis (Lincoln NE) Cleavelin C. Rinn (Lubbock TX), Gaseous process and apparatus for removing films from substrates.
  16. Hynecek Jaroslav (Richardson TX), Hydrogen iodide etch of tin oxide.
  17. Bobbio Stephen M. (Wake Forest NC), Magnetron method and apparatus for producing high density ionic gas discharge.
  18. Pedder David J. (Warks) Wort Christopher J. (Northants) Pickering Kim L. (Northampton GBX), Metal surface cleaning processes.
  19. Kusano Yukihiro (20-11 ; Takaidohigashi 2-chome Tokorozawa JPX) Yoshikawa Masato (20-11 ; Takaidohigashi 2-chome Kodaira JPX) Naito Kazuo (20-11 ; Takaidohigashi 2-chome Kawasaki JPX) Okazaki Satiko , Method and apparatus for surface treating an axially symmetric substrate at atmosphere pressure.
  20. Yoshikawa Masato (Tokyo JPX) Kusano Yukihiro (Tokorozawa JPX) Akiyama Setsuo (Sagamihara JPX) Naito Kazuo (Kawasaki JPX) Okazaki Satiko (Tokyo JPX) Kogoma Masuhiro (Wako JPX), Method and apparatus for surface treatment.
  21. Phillips Eugene (Diamond Bar CA), Method for conditioning drilled holes in multilayer wiring boards.
  22. Tsukamoto Katsuhiro (Hyogo JPX) Tokui Akira (Hyogo JPX), Method for forming a thin layer on a semiconductor substrate and apparatus therefor.
  23. Schuurmans Hubertus J. A. (Amsterdam NLX) Werner Jan (Amsterdam NLX) Schram Daniel C. (Eindhoven NLX) Kroesen Gerardus M. W. (Eindhoven NLX), Method for plasma surface treating and preparation of membrane layers.
  24. Kusano Yukihiro (No. 20-11 ; Takaido Higashi 2-chome Tokorozawa JPX) Yoshikawa Masato (No. 20-11 ; Takaido Higashi 2-chome Kodaira JPX) Naito Kazuo (No. 20-11 ; Takaido Higashi 2-chome Kawasaki JPX) , Method for preparing a rubber-based composite material.
  25. Nishiwaki Atsushi (1-11 ; Funakoshi-cho 2-chome Chuo-ku ; Osaka JPX) Ikemiya Norihito (Takatsuki JPX) Uchiyama Hiroshi (Hirakata JPX) Inagaki Hideo (Hirakata JPX) Sawada Yasuo (Tokyo JPX) Ogino Kazum, Method for the surface treatment of a metal by atmospheric pressure plasma.
  26. Tanisaki Tatsuzo (No. 20-11 ; Takaidohigashi 2-chome Onomichi JPX) Okazaki Satiko (No. 20-11 ; Takaidohigashi 2-chome Suginami-ku ; Tokyo JPX) Kogoma Masuhiro (No. 843-15 Shimoniikura ; Wako-shi ; Sa, Method for utilizing a plasma reaction under an atmospheric pressure.
  27. Okazaki Satiko (Tokyo JPX) Kogoma Masuhiro (Saitama JPX), Method of forming a thin polymeric film by plasma reaction under atmospheric pressure.
  28. Maruyama Takahiro (Hyogo JPX), Plasma treatment apparatus.
  29. Liedke Volker (Elsenfeld/Eichelsbach) Grasmann Karl H. (Stadprozelten) Albrecht Hans-Jurgen (Berlin) Wittrich Harald (Berlin) John Wilfred (Berlin) Scheel Wolfgang (Berlin DEX), Procedure for processing joints to be soldered.

이 특허를 인용한 특허 (27)

  1. Egawa Hidemitsu,JPX ; Ezawa Hirokazu,JPX, Apparatus and method for producing electronic elements.
  2. Haji Hiroshi,JPX, Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus.
  3. Fang Lu ; Potteiger Brian Dale ; Scrak Shaun P. ; Yeagle Frederick Arthur, Automated fluxless soldering using inert gas.
  4. Egitto Frank D. ; Fey Edmond O. ; Matienzo Luis J. ; Questad David L. ; Rai Rajinder S. ; Van Hart Daniel C., Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties.
  5. Egitto Frank D. ; Matienzo Luis J., Fluxless joining process for enriched solders.
  6. Mori Yoshiaki,JPX ; Miyakawa Takuya,JPX ; Asano Yasuhiko,JPX ; Kurashina Osamu,JPX ; Miyamori Satoshi,JPX ; Kurashima Yohei,JPX ; Anan Makoto,JPX, Method and apparatus for bonding using brazing material.
  7. Ohmi,Tadahiro; Murakami,Hidetoshi, Method and apparatus for manufacturing multilayer printed wiring board.
  8. Kumar, Satyendra; Kumar, Devendra, Plasma catalyst.
  9. Kumar,Satyendra; Kumar,Devendra, Plasma catalyst.
  10. Miyakawa Takuya,JPX, Plasma etching method and method of manufacturing liquid crystal display panel.
  11. Kumar, Satyendra; Kumar, Devendra, Plasma generation and processing with multiple radiation sources.
  12. Kumar,Satyendra; Kumar,Devendra, Plasma generation and processing with multiple radiation sources.
  13. Kumar,Devendra; Kumar,Satyendra, Plasma-assisted decrystallization.
  14. Kumar,Satyendra; Kumar,Devendra, Plasma-assisted doping.
  15. Kumar,Devendra; Kumar,Satyendra, Plasma-assisted enhanced coating.
  16. Kumar,Satyendra; Kumar,Devendra, Plasma-assisted formation of carbon structures.
  17. Kumar,Satyendra; Kumar,Devendra, Plasma-assisted gas production.
  18. Kumar, Satyendra; Kumar, Devendra; Dougherty, Michael L., Plasma-assisted heat treatment.
  19. Kumar, Devendra; Kumar, Satyendra, Plasma-assisted joining.
  20. Kumar,Devendra; Kumar,Satyendra, Plasma-assisted joining.
  21. Kumar,Devendra; Kumar,Satyendra, Plasma-assisted nitrogen surface-treatment.
  22. Dougherty, Sr., Michael L.; Kumar, Devendra; Kumar, Satyendra, Plasma-assisted processing in a manufacturing line.
  23. Tischler, Friedrich, Process for MSG-soldering and use of a shielding gas.
  24. Park, Jaeyoung; Henins, Ivars, Production of stable, non-thermal atmospheric pressure rf capacitive plasmas using gases other than helium or neon.
  25. Egitto, Frank D.; Fey, Edmond O.; Matienzo, Luis J.; Questad, David L.; Rai, Rajinder S.; Van Hart, Daniel C., Solder ball with chemically and mechanically enhanced surface properties.
  26. Kumar,Satyendra; Kumar,Devendra; Tasch,Dominique; Stroebel,Raimund, Surface cleaning and sterilization.
  27. Fang Lu ; Pottelger Brian Dale ; Rinaudo Dominic Paul ; Yeagle Frederick Arthur, System for providing back-lighting of components during fluxless soldering.
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