초록 ▼

A method of producing a biocompatible prosthesis based on a substrate made essentially of metal or ceramic. The substrate is placed into a reactor chamber of a cathodic vapor deposition arrangement and the chamber is evacuated to a predetermined pressure. A predetermined, negative bias voltage is th

A method of producing a biocompatible prosthesis based on a substrate made essentially of metal or ceramic. The substrate is placed into a reactor chamber of a cathodic vapor deposition arrangement and the chamber is evacuated to a predetermined pressure. A predetermined, negative bias voltage is then applied to the substrate and the substrate is surface treated by adding an etching gas to the reactor chamber, at a predetermined, first flow rate and coupling in a high frequency power with a first, predetermined power density for ionic etching for a first, predetermined period of time. The surface treated substrate is separated from the negative bias voltage and a semiconductor cover layer is chemical vapor-phase deposited on the substrate by adding to the reactor chamber a multi-component mixture of process gases containing a semiconductor element in bound format a second, predetermined flow rate and coupling-in of HF power with a predetermined, second power density, for a second, predetermined time period.

대표청구항 ▼

[ What is claimed is:] [1.] A biocompatible prosthesis, comprising:a prefabricated substrate comprised of one of a metallic and a ceramic material;a cover layer including a semiconductor material covering a surface of the substrate; anda boundary layer having a microstructure including reciprocal bu

[ What is claimed is:] [1.] A biocompatible prosthesis, comprising:a prefabricated substrate comprised of one of a metallic and a ceramic material;a cover layer including a semiconductor material covering a surface of the substrate; anda boundary layer having a microstructure including reciprocal bumps and dents formed between the surface of the substrate and the cover layer said bumps and dents interlocking said substrate and said cover layer.