초록 ▼

Molded bodies of quartz glass have at least one surface area of transparent quartz glass, the exposed surfaces of which are smooth and which have a surface microroughness of less than 8 .mu.m. The base material has a chemical purity of at least 99.9% and a cristobalite content of no more than 1%; is

Molded bodies of quartz glass have at least one surface area of transparent quartz glass, the exposed surfaces of which are smooth and which have a surface microroughness of less than 8 .mu.m. The base material has a chemical purity of at least 99.9% and a cristobalite content of no more than 1%; is gas-impermeable and opaque; and contains pores. At a wall thickness of 1 mm, the base material has a nearly uniform direct spectral transmission of less than 10% in the wavelength range of .lambda.=190-2,650 nm; and which has a density of at least 2.215 g/cm.sup.3. The transparent surface area is formed from base material by heating it to a temperature above 1,650.degree. C. The thickness of the transparent layer is at least 0.5 mm, and its direct spectral transmission in the wavelength range of .lambda.=6001-2,650 nm is at least 60% for a layer thickness of 1 mm.

대표청구항 ▼

[ We claim:] [1.] Molded body of quartz glass which has at least one surface region of transparent quartz glass, having an exposed surface with a surface microroughness of less than 8 .mu.m, said body comprising a base consisting of a base material which has a chemical purity of at least 99.9% and a

[ We claim:] [1.] Molded body of quartz glass which has at least one surface region of transparent quartz glass, having an exposed surface with a surface microroughness of less than 8 .mu.m, said body comprising a base consisting of a base material which has a chemical purity of at least 99.9% and a cristobalite content of no more than 1%; which is gas-impermeable and opaque and contains pores; which has, at a wall thickness of 1 mm, a nearly constant direct spectral transmission of less than 10% in the wavelength range of .lambda.=190 nm to .lambda.=2,650 nm; and which has a density of at least 2.16 g/cm.sup.3 ; and wherein the transparent surface region is formed from the base material by subjecting the base material to a heat treatment at a temperature above 1,650.degree. C., the transparent layer being at least 0.5 mm thick, the direct spectral transmission of the transparent layer in the wavelength range of .lambda.=600 nm to .lambda.=2,650 nm being at least 60% for a thickness of 1 mm. [13.] Process for the production of a molded body of quartz glass with at least one surface region of transparent quartz glass, the exposed surface of which is smooth, with a microroughness of less than 8 .mu.m, comprising the steps of producing a base by the slip casting method, where quartz glass of a purity of at least 99.9% is ground into a powder with a particle size of less than 70 .mu.m; forming a slip from the powder and stabilizing the slip over the course of 1-240 hours by keeping it in continuous motion; loading the stabilized slip into a porous mold corresponding to the base, where it is allowed to remain for a predetermined period of time; after removal from the mold, drying the base blank and heating it in a furnace at a heating rate of 5-60 K/min to a sintering temperature in the range of 1,350.degree.-1,450.degree. C. and then exposing the blank to a temperature of more than 1,300.degree. C. for a period of at least 40 minutes; cooling the sintered base and then heating a surface region of the opaque, porous, gas-impermeable base material forming the base locally by means of a heat source to a temperature in the range of 1,650.degree.-2,000.degree. C. to transform the porous, opaque base material into transparent quartz glass until the thickness of the transparent surface region is at least 0.5 mm and its direct spectral transmission in the wavelength range of .lambda.=600 nm to .lambda.=2,650 nm has a value of at least 60% for a layer thickness of 1 mm. Process according to claim 13 wherein a gas burner selected from the group consisting of a natural gas or oxyhydrogen-oxygen torch, a plasma torch, an electric arc, and a laser is used as a heat source. A process according to claim 14 wherein the laser is a CO.sub.2 laser. Process according to claim 13 wherein the heat source and the surface region are moved relative to each other. Process according to claim 13 wherein the heat source is moved back and forth over the surface region. Process according to claim 13 wherein the base is designed as a hollow component and at least part of its exterior and/or interior surface is heated by means of the heat source. Process according to claim 18 wherein the hollow component is rotated so that partial regions of its exterior and/or interior surface can be heated.