초록 ▼

A thermal management structure to provide mechanical isolation and heat removal for a unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and substrate between two heat sink pieces which are

A thermal management structure to provide mechanical isolation and heat removal for a unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and substrate between two heat sink pieces which are rigidly mounted to the substrate, thereby mechanically isolating the unpackaged semiconductor die and preventing the die from being accidentally touched. The two heat sink pieces further compliantly thermally engage selected sites on the exposed face of the semiconductor die and the surface of the substrate to conductively remove heat away from the substrate. The thermal management structure may also thermally engage selected thermally conductive components within an end product to spread the heat more uniformly throughout the system.

대표청구항 ▼

[ What is claimed is:] [1.] A thermal management structure for a chip-on-board substrate, the thermal management structure comprising:a substrate having a first side, a second side, an unpackaged semiconductor die mounted on the second side, the unpackaged semiconductor die having an exposed face;a

[ What is claimed is:] [1.] A thermal management structure for a chip-on-board substrate, the thermal management structure comprising:a substrate having a first side, a second side, an unpackaged semiconductor die mounted on the second side, the unpackaged semiconductor die having an exposed face;a first heat sink piece having a first face and a first plurality of mounting brackets, the first face proximate to the first side of said substrate and the first plurality of mounting brackets rigidly engaging the first side of said substrate;a second heat sink piece having a second face and a second plurality of mounting brackets, the second face proximate to the exposed face of the unpackaged semiconductor die mounted on the second side of said substrate and the second plurality of mounting brackets rigidly engaging the second side of said substrate;a first interface means interposed between and compliantly engaging the first side of said substrate and the first face of said first heat sink piece, the first interface means proximate to the unpackaged semiconductor die whereby the first interface means conductively transfers heat from the unpackaged semiconductor die to said first heat sink piece;a second interface means interposed between and compliantly engaging the exposed face of the unpackaged semiconductor die and the second face of said second heat sink piece whereby the second interface means conductively transfers heat from the unpackaged semiconductor die to said second heat sink piece; anda plurality of fasteners, said fasteners fixedly connecting the first plurality of mounting brackets to the second plurality of mounting brackets.